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1. 发明申请

WO2005033376A2 PLATING METHOD AND APPARATUS 审中-公开
标题翻译：电镀方法和装置
公开(公告)号：WO2005033376A2
公开(公告)日：2005-04-14
申请号：PCT/JP2004/014698
申请日：2004-09-29
申请人： EBARA CORPORATION , KURIYAMA, Fumio , KIUMI, Rei , SAITO, Nobutoshi , TAKEMURA, Takashi , KIMURA, Masaaki , TAKEDA, Sachiko , GUO, Yugang
发明人： KURIYAMA, Fumio , KIUMI, Rei , SAITO, Nobutoshi , TAKEMURA, Takashi , KIMURA, Masaaki , TAKEDA, Sachiko , GUO, Yugang
IPC分类号： C25D5/34
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating apparatus (1) has a steam treatment chamber (18) configured to perform a steam treatment using steam on a surface of a substrate (W), and a plating chamber (24) configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber (20) configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame (2) housing the steam treatment chamber (18), the acid treatment chamber (20), and the plating chamber (24).
摘要翻译：电镀装置（1）具有蒸汽处理室（18），其被配置为在基板（W）的表面上使用蒸汽进行蒸汽处理，以及电镀室（24），其被配置为对经受蒸汽处理。电镀装置还具有将处于蒸汽处理的基板的表面与酸性液体接触的酸处理室（20）。电镀装置包括容纳蒸汽处理室（18），酸处理室（20）和电镀室（24）的框架（2）。

2. 发明申请

WO2004081261A3 PLATING APPARATUS 审中-公开
公开(公告)号：WO2004081261A3
公开(公告)日：2004-09-23
申请号：PCT/JP2004/003040
申请日：2004-03-09
申请人： EBARA CORPORATION , KURIYAMA, Fumio , TAKEMURA, Takashi , SAITO, Nobutoshi , KIMURA, Masaaki, , KIUMI, Rei
发明人： KURIYAMA, Fumio , TAKEMURA, Takashi , SAITO, Nobutoshi , KIMURA, Masaaki, , KIUMI, Rei
IPC分类号： H01L21/288
摘要： The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186). A ring-shaped nozzle pipe (220) having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186), or a stirring mechanism having a stirring vane are disposed in the plating tank (186).

3. 发明申请

WO2004107422A2 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A2
公开(公告)日：2004-12-09
申请号：PCT/JP2004/007437
申请日：2004-05-25
申请人： EBARA CORPORATION , SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
发明人： SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
IPC分类号： H01L21/288
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

4. 发明公开

EP1524338A1 PLATING DEVICE 审中-公开
标题翻译： ABSCHEIDUNGSVERFAHREN
公开(公告)号：EP1524338A1
公开(公告)日：2005-04-20
申请号：EP03765327.6
申请日：2003-07-18
申请人： Ebara Corporation
发明人： YAJIMA, Toshikazu , TAKEMURA, Takashi , KIUMI, Rei , SAITO, Nobutoshi , KURIYAMA, Fumio , KIMURA, Masaaki
IPC分类号： C25D21/12
CPC分类号： C25D21/12 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/008
摘要： A plating apparatus according to the present invention has a plating tank (40) for holding a plating solution (10), an anode (56) disposed so as to be immersed in the plating solution (10) in the plating tank (40), a regulation plate (60) disposed between the anode (56) and a plating workpiece (W) disposed so as to face the anode (56), and a plating power supply (24) for supply a current between the anode (56) and the plating workpiece (W) to carry out plating. The regulation plate (60) is disposed so as to separate the plating solution (10) held in the plating tank (40) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group (68) having a large number of through-holes (66) is formed in the regulation plate (60).
摘要翻译：根据本发明的电镀装置具有用于保持电镀液（10）的电镀槽（40）和设置成浸在电镀槽（40）中的电镀液（10）中的阳极（56）设置在阳极（56）和与阳极（56）相对设置的电镀工件（W）之间的调节板（60），以及电镀电源（24），用于在阳极（56）和电镀工件（W）进行电镀。调整板60被配置为将保持在镀槽（40）中的电镀液（10）分离成在阳极侧的电镀液和电镀工件侧的电镀液，以及通孔组在所述调节板（60）中形成具有大量通孔（66）的多个（68）。

5. 发明公开

EP1048756A1 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译：基板电镀装置
公开(公告)号：EP1048756A1
公开(公告)日：2000-11-02
申请号：EP99970132.9
申请日：1999-10-04
申请人： EBARA CORPORATION
发明人： KURIYAMA, Fumio , OGURE, Naoaki , HONGO, Akihisa
IPC分类号： C25D19/00 , C25D5/48 , C23C18/31
CPC分类号： H01L21/67161 , C23C18/1632 , C25D7/123 , C25D17/001 , H01L21/67173 , H01L21/6723
摘要： The present invention provides a substrate plating apparatus capable of forming a plating layer on the surface of a substrate and storing the substrate until the next process in a way that the substrate is not exposed to the atmosphere. Also, the present invention provides a substrate plating apparatus not only capable of performing a process to introduce semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, and also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers; reducing the number of processes; and reducing the installation area required for the apparatus.
A substrate plating apparatus that includes a plating process section(20) for plating a substrate; a washing process section(10) for washing the substrate after the plating process; and a storage vessel(16) containing a storing solution in which the substrate is immersed after having been plated and washed. A substrate conveyor is provided in the substrate plating apparatus for loading substrates into the substrate plating apparatus and discharging substrates out of the substrate plating apparatus, or for performing at least one of the loading or discharging operations, such that the substrates are loaded into the substrate plating apparatus one at a time, plated in the plating process section, washed in the washing process section, and subsequently discharged one at a time from the substrate plating apparatus.
摘要翻译：本发明提供一种基板电镀装置，其能够在基板的表面上形成电镀层，并且以基板不暴露于大气的方式存储基板直到下一工序为止。而且，本发明提供了一种基板电镀设备，不仅能够执行将半导体晶片连续一个一个地引入到电镀设备中而不将晶片装载到盒中的过程，并且还能够防止颗粒污染和在其上形成氧化膜晶圆的表面; 减少进程的数量; 并减少设备所需的安装面积。一种基板电镀装置，包括用于电镀基板的电镀处理部分（20）洗涤处理部分（10），用于在电镀处理之后清洗基板; 和贮存容器（16），所述贮存容器（16）包含储存溶液，在所述储存溶液中已经电镀和洗涤之后将基板浸入其中。衬底传送器设置在衬底电镀装置中，用于将衬底装载到衬底电镀装置中并将衬底从衬底电镀装置中排出，或用于执行装载或卸载操作中的至少一个，使得衬底装载到衬底中电镀装置一次一个电镀在电镀处理部分中，在清洗处理部分中清洗，然后从基底电镀装置一次一个地排出电镀装置。

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