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1. 发明专利

DE112017001177T5 Gleitmaterial, Wellenhülse und mit der Wellenhülse versehene Pumpe 未知
公开(公告)号：DE112017001177T5
公开(公告)日：2018-11-15
申请号：DE112017001177
申请日：2017-02-23
申请人： EBARA CORP , NIPPON TUNGSTEN
发明人： ITO NOBUAKI , SUGIYAMA KENICHI , YAKUWA HIROSHI , TAKAHASHI NORIO , KOMIYA MAKOTO , FUJIMOTO KENJI
IPC分类号： C22C29/10 , C22C29/02 , F04D29/046 , F16C33/12
摘要： Ein TiC-(Ti-Mo)-Gleitmaterial wird vorgesehen, welches eine Binderphase hat, die aus einer Ti-Mo-Legierung gemacht ist, und eine Hartphase, welche TiCenthält, wobei das TiC-(Ti-Mo)-Gleitmaterial alle folgenden Bedingungen erfüllt: (1) eine Gesamtfläche der Binderphase und der Hartphase ist 90 % oder mehr einer Fläche des Sichtfeldes; (2) eine Gesamtfläche der Binderphase ist 15 % oder mehr und 20 % oder weniger der Fläche des Sichtfeldes; (3) in der Binderphase ist eine Gesamtfläche der Binderphase, die einen Durchmesser äquivalent 10 µm oder mehr und 50 µm oder weniger hat, und zwar berechnet basierend auf einer Annahme, dass eine Fläche der Binderphase eine Kreisform hat, 60 % oder mehr und 80 % oder weniger der Gesamtfläche der Binderphase; (4) in der Binderphase ist eine Gesamtfläche der Binderphase mit einem Durchmesser äquivalent weniger als 10 µm, und zwar berechnet basierend auf einer Annahme, dass eine Fläche der Binderphase eine Kreisform hat, 20 % oder mehr und 40 % oder weniger der Gesamtfläche der Binderphase; und (5) eine Mo-Konzentration in der Binderphase ist 25 Gewichts-% oder mehr und 35 Gewichts-% oder weniger.

2. 发明专利

DE60125859T2 未知
公开(公告)号：DE60125859T2
公开(公告)日：2007-11-08
申请号：DE60125859
申请日：2001-05-14
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU , NOJI NAOKI , CHIBA KAZUKI , FUJIMOTO KENJI
IPC分类号： B24B7/17 , B24B37/04 , B24B37/32 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/687
摘要： A multi-head type polishing apparatus has a plurality of top rings for holding workpieces with respect to a single polishing table. A polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.

3. 发明专利

DE60125859D1 未知
公开(公告)号：DE60125859D1
公开(公告)日：2007-02-22
申请号：DE60125859
申请日：2001-05-14
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU , NOJI NAOKI , CHIBA KAZUKI , FUJIMOTO KENJI
IPC分类号： B24B7/17 , B24B37/04 , B24B37/32 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/687
摘要： A multi-head type polishing apparatus has a plurality of top rings for holding workpieces with respect to a single polishing table. A polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.

4. 发明专利

JP2002261057A DEVICE AND METHOD FOR GRINDING SUBSTRATE 失效
公开(公告)号：JP2002261057A
公开(公告)日：2002-09-13
申请号：JP2001057089
申请日：2001-03-01
申请人： EBARA CORP , MITSUBISHI MATERIALS CORP
发明人： KATSUOKA SEIJI , FUJIMOTO KENJI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate grinding device capable of improving the throughput of grinding by finishing mounting of an un-ground substrate to be ground to a top ring during grinding of the substrate to be ground. SOLUTION: The substrate grinding device is provided with a top ring mounting table 33 for holding a plurality of top rings 31 for holding the substrate to be ground, and substrate grinding part 13 for grinding the grinding surface of the substrate to be ground by the mutual movement of the substrate to be ground and the grinding surface of a grinding table by pressuring the substrate to be ground held by the rings 31 mounted to the table 33 to the grinding surface of the grinding table. A top ring mounting and removing part 12 is provided for mounting and removing the top rings 31 holding the substrate to be ground with the substrate to be ground is provided at the table 33. Since the top rings 31 holding the substrate to be ground are mounted and removed to/from the table 33 with the substrate to be ground, the ground substrate to be ground can be received from the top rings 31, and the un-ground substrate to be ground can be held (mounted) to the top rings 31 of the substrate to be ground during grinding of the substrate to be ground, thereby improving the throughput of substrate grinding.

5. 发明专利

JP2001326201A POLISHING DEVICE 失效
公开(公告)号：JP2001326201A
公开(公告)日：2001-11-22
申请号：JP2000143771
申请日：2000-05-16
申请人： EBARA CORP , MITSUBISHI MATERIALS CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU , NOMICHI NAOKI , CHIBA KAZUKI , FUJIMOTO KENJI
IPC分类号： B24B7/17 , B24B37/04 , B24B37/32 , H01L21/00 , H01L21/304 , H01L21/677 , H01L21/687
摘要： PROBLEM TO BE SOLVED: To provide a multi-head type polishing device which can be improved in throughput by increasing the polishing number of substrates, such as semiconductor wafers, etc., per unit time. SOLUTION: This multi-head type polishing device is provided with turntables 34L, 34R, 35L and 35R having polishing surfaces, a plurality of top rings 32L and 32R which press semiconductor wafers against the turntables 34L, 34R, 35L and 35R by holding the wafers, and carousels 36L and 36R which hold the top rings 32L and 32R and, at the same time, perform rotation indexing on the rings 32L and 32R. The polishing device is also provided with rotary transporters 27L and 27R having pluralities of portions which are positioned on a circumference at a prescribed distance from the center of rotation and hold the semiconductor wafers and indexing functions for indexing the portions and pushers 30L and 30R which transfer the wafers between the rotary transporters 27L and 27R and top rings 32L and 32R.

6. 发明专利

JP2002239894A POLISHING DEVICE 失效
公开(公告)号：JP2002239894A
公开(公告)日：2002-08-28
申请号：JP2001043775
申请日：2001-02-20
申请人： EBARA CORP , MITSUBISHI MATERIALS CORP
发明人： SEKIMOTO MASAHIKO , FUJIMOTO KENJI
IPC分类号： B24B37/005 , B24B37/30 , B24B37/32 , H01L21/304 , B24B37/00 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To easily correct the non-uniformity of polishing in a well controllable manner and perform polishing while increasing/decreasing a polishing amount in part of an aiming area on a polished surface. SOLUTION: The polishing device comprises a turn table 14 having a polishing tool 12 provided on the upper face and a top ring 10, between which a polished object W is interposed to be polished while being thrust with predetermined force. The top ring 10 has a gripping plate 42 for gripping the polished object W to be thrust against the turn table 14 and a covering plate 44 for covering the gripping plate 42 on its reverse side. The gripping plate 42 is concentrically split into plural pieces and formed to be thrust-adjustable for each of the split piece members 42a-42c.

7. 发明专利

JP2001328069A METHOD AND DEVICE FOR CLEANING OF DRESSER IN GRINDING DEVICE 失效
公开(公告)号：JP2001328069A
公开(公告)日：2001-11-27
申请号：JP2000153399
申请日：2000-05-24
申请人： EBARA CORP
发明人： SEKIMOTO MASAHIKO , FUJIMOTO KENJI
IPC分类号： B24B55/06 , B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a method and device for cleaning a dresser in a grinding device capable of efficiently removing clogging by improving capacity to remove chips on a grinding surface adhered to a dressing surface of the dresser and the clogging by the chips. SOLUTION: This dresser cleaning device in the grinding device is for cleaning the dressing surface abutting on the grinding surface of the dresser 6 for dressing the grinding surface of the grinding device, is provided with a liquid tank 9 for accommodating liquid, and one or more such things as an injection nozzle 11 for injecting a flow of liquid followed by cavitation on the dressing surface in a state of the dresser 6 soaked in the cleaning liquid of the tank 9, an ultrasonic vibrator for applying ultrasonic vibration on the liquid of the liquid tank 9 or a bubble generator for diffusing bubbles in the liquid of the tank and abutting them on the dressing surface.

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