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1. 发明申请

WO2004081261B1 PLATING APPARATUS 审中-公开
标题翻译：电镀设备
公开(公告)号：WO2004081261B1
公开(公告)日：2005-07-14
申请号：PCT/JP2004003040
申请日：2004-03-09
申请人： EBARA CORP , KURIYAMA FUMIO , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KIMURA MASAAKI , KIUMI REI
发明人： KURIYAMA FUMIO , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KIMURA MASAAKI , KIUMI REI
IPC分类号： C23C18/16 , C23C18/54 , C25D5/02 , C25D5/08 , C25D7/12 , C25D17/00 , C25D21/10 , H01L21/288 , H01L21/60
CPC分类号： C25D17/008 , C23C18/1628 , C25D5/08 , C25D7/123 , C25D17/001 , C25D21/10 , H01L21/288 , H01L21/2885 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186). A ring-shaped nozzle pipe (220) having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186), or a stirring mechanism having a stirring vane are disposed in the plating tank (186).
摘要翻译：本发明涉及用于在半导体晶片的表面中限定的沟槽，通孔或抗蚀剂开口中形成电镀膜并且形成与封装的电极电连接的凸块的电镀装置，半导体晶片的表面。电镀装置（170）具有用于保持电镀液（188）的电镀槽（186），用于保持工件（W）并使工件的被电镀面与电镀液接触的保持件（160）（188）在镀槽（186）中。一个环形喷嘴管（220），它具有多个用于将电镀液（188）注入到由夹持器（160）夹持的工件的待镀表面上的电镀液注入喷嘴（222），以便将电镀液 188）流入镀槽（186），或者在镀槽（186）中设置具有搅拌叶片的搅拌机构。

2. 发明申请

WO2004081261A2 PLATING APPARATUS 审中-公开
标题翻译：电镀设备
公开(公告)号：WO2004081261A2
公开(公告)日：2004-09-23
申请号：PCT/JP2004003040
申请日：2004-03-09
申请人： EBARA CORP , KURIYAMA FUMIO , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KIMURA MASAAKI , KIUMI REI
发明人： KURIYAMA FUMIO , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KIMURA MASAAKI , KIUMI REI
IPC分类号： C23C18/16 , C23C18/54 , C25D5/02 , C25D5/08 , C25D7/12 , C25D17/00 , C25D21/10 , H01L21/288 , H01L21/60 , C25D
CPC分类号： C25D17/008 , C23C18/1628 , C25D5/08 , C25D7/123 , C25D17/001 , C25D21/10 , H01L21/288 , H01L21/2885 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186), and a ring-shaped nozzle pipe (220) disposed in the plating tank (186) and having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186).
摘要翻译：本发明涉及用于在半导体晶片的表面中限定的沟槽，通孔或抗蚀剂开口中形成电镀膜的电镀设备，以及形成电连接到封装的电极的凸块，半导体晶片的表面。电镀装置（170）具有用于保持电镀液（188）的电镀槽（186），用于保持工件（W）的保持架（160），使被处理体的表面与电镀液接触（186）中的电镀液注入喷嘴（188），以及设置在所述镀槽（186）内的多个电镀液注入喷嘴（222）的环状喷嘴管（220）被保持器（160）保持的工件的待镀表面，以将镀液（188）供应到镀槽（186）中。

3. 发明申请

WO2005033376A3 PLATING METHOD AND APPARATUS 审中-公开
标题翻译：电镀方法和装置
公开(公告)号：WO2005033376A3
公开(公告)日：2005-06-02
申请号：PCT/JP2004014698
申请日：2004-09-29
申请人： EBARA CORP , KURIYAMA FUMIO , KIUMI REI , SAITO NOBUTOSHI , TAKEMURA TAKASHI , KIMURA MASAAKI , TAKEDA SACHIKO , GUO YUGANG
发明人： KURIYAMA FUMIO , KIUMI REI , SAITO NOBUTOSHI , TAKEMURA TAKASHI , KIMURA MASAAKI , TAKEDA SACHIKO , GUO YUGANG
IPC分类号： C23C18/16 , C23C18/18 , C25D5/34 , C25D5/48 , C25D7/12 , H01L21/288 , H05K3/24
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substrate into contact with electrolytic ionized water or performing a team treatment using steam on a surface of a substrate, and plating the surface of the substrate after said applying, exposing, bringing or performing process. A plating method comprising performing a team treatment using steam on a surface of a substrate, and performing a wet process on the surface of the substrate of a substrate with an acidic plating solution, cleaning the surface of the substrate with pure water and cleaning the surface of the substrate with an alkalescent aqueous solution. A plating apparatus adapted to perform at least one of said methods.
摘要翻译：一种电镀方法，其包括将紫外线施加到基板的表面或将基板的表面暴露于臭氧气体或使表面与基底接触的方式与臭氧水接触或使基板的表面与电解电离水接触或者使用蒸镀在基板的表面上进行团队处理，以及在施加，曝光，进行或执行处理之后对基板的表面进行电镀。一种电镀方法，包括使用蒸镀在基材表面进行团队处理，并用酸性电镀液对基板表面进行湿法处理，用纯水清洗基板的表面并清洗表面的碱性水溶液。适于执行所述方法中的至少一种的电镀装置。

4. 发明申请

WO2004107422A3 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A3
公开(公告)日：2005-06-16
申请号：PCT/JP2004007437
申请日：2004-05-25
申请人： EBARA CORP , SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
发明人： SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
IPC分类号： C25D5/02 , C25D7/12 , H01L21/00 , H01L21/288 , H01L21/60
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的种子层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

5. 发明专利

JP2001318440A METHOD FOR REPRODUCING AND TRANSMITTING HUE WITH BLACK AND WHITE FILM AND PURPLISH RED COLOR FILTER 失效
公开(公告)号：JP2001318440A
公开(公告)日：2001-11-16
申请号：JP2000172710
申请日：2000-05-02
申请人： TAKEMURA TAKASHI , TAKEMURA TADASHI
发明人： TAKEMURA TAKASHI
IPC分类号： G03B33/02
摘要： PROBLEM TO BE SOLVED: To provide a method for reproducing and transmitting hue by a black and white film and 'Kodak Wratten Filter No. 33 (R)' (hereafter described as No. 33). SOLUTION: The inventor discovered that the differences in hue are generated by the excitation ratios of rods and cones which are retinal visual cells. Since the rods are excited by white color light and the cones are excited by purplish red color light, the reproduction and transmission of the hue are easily made possible by using the black and white film and the No. 33 allowing the transmission of the purplish red color and utilizing the black and white film. Since the hue of a subject may be reproduced by using only the black and white film and the No. 33, the reproduction and transmission of the hue are made possible by utilizing the No. 33 on both of the transmission side and the reception side by only the black and white film of the invention process. The currently sold color film is formed in accordance with a three primary color theory and therefore this result cannot be photographed.

6. 发明公开

EP1524338A4 PLATING DEVICE 审中-公开
标题翻译： ABSCHEIDUNGSVERFAHREN
公开(公告)号：EP1524338A4
公开(公告)日：2008-02-27
申请号：EP03765327
申请日：2003-07-18
申请人： EBARA CORP
发明人： YAJIMA TOSHIKAZU , TAKEMURA TAKASHI , KIUMI REI , SAITO NOBUTOSHI , KURIYAMA FUMIO , KIMURA MASAAKI
IPC分类号： C25D7/12 , C25D17/00 , C25D21/12
CPC分类号： C25D21/12 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/008
摘要： A plating apparatus according to the present invention has a plating tank (40) for holding a plating solution (10), an anode (56) disposed so as to be immersed in the plating solution (10) in the plating tank (40), a regulation plate (60) disposed between the anode (56) and a plating workpiece (W) disposed so as to face the anode (56), and a plating power supply (24) for supply a current between the anode (56) and the plating workpiece (W) to carry out plating. The regulation plate (60) is disposed so as to separate the plating solution (10) held in the plating tank (40) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group (68) having a large number of through-holes (66) is formed in the regulation plate (60).
摘要翻译：一种电镀装置具有用于接收电镀液（10）的电镀容器（40），安装成浸入电镀容器（40）中的电镀液（10）中的阳极（56），调节板（60）设置在阳极（56）和设置成与阳极（56）相对设置的基板（W）之间;以及电镀电源（24），用于通过在阳极（56）和基材（W）。调整板60设置为将容纳在电镀槽40内的电镀液10分离为阳极侧和被镀物侧。在板中设有由大量穿孔66形成的穿孔组68。

7. 发明专利

JP2011252487A Vertical shaft volute pump 有权
标题翻译：垂直轴电动泵
公开(公告)号：JP2011252487A
公开(公告)日：2011-12-15
申请号：JP2010128872
申请日：2010-06-04
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONDA SHUICHIRO , ENOMOTO TAKASHI , TAKEMURA TAKASHI , JINNO HIDEKI , KANEKO ATSUSHI , YAMANAKA TAKASHI , KUDO DAI
IPC分类号： F04D29/42 , F04D13/00 , F04D29/60 , F04D29/62
摘要： PROBLEM TO BE SOLVED: To provide a vertical shaft volute pump that includes at least a part of a volute of a pump casing and a discharge pipe connected to the volute, which are formed by can manufacturing that provides an intended shape by forming a steel plate in a predetermined shape by cutting the steel plate from a sheet-like steel material and bending it and connecting the plurality of formed steel plates.SOLUTION: The vertical shaft volute pump includes: vertical piping 4; a main shaft 7 passing through the vertical piping 4; an impeller 6 rotated by the main shaft 7; the pump casing 2 for housing the impeller 6; and the discharge pipe 3 constituting a channel for connecting the pump casing 2 and the vertical piping 4. At least the part of the volute of the pump casing 2 and the discharge pipe 3 connected to the volute are formed by the can manufacturing that provides the intended shape by connecting the plurality of steel plates cut from the sheet-like steel material into the predetermined shape and the plurality of steel plates cut from the sheet-like steel material into the predetermined shape by bending.
摘要翻译：要解决的问题：提供一种垂直轴蜗壳泵，其包括泵壳体的蜗壳的至少一部分和连接到蜗壳的排出管，其通过罐制造形成，其通过成形提供预期形状通过从钢板状钢板切割钢板并弯曲并连接多个成形钢板，形成预定形状的钢板。
解决方案：垂直轴蜗壳泵包括：垂直管道4; 主轴7穿过竖直管道4; 由主轴7旋转的叶轮6; 用于容纳叶轮6的泵壳体2; 排气管3构成用于连接泵壳体2和垂直配管4的通道。泵壳体2的蜗壳的部分和连接到蜗壳的排出管3的至少一部分通过罐体制造形成，通过将从片状钢材切割成的多个钢板连接成规定形状，将从片状钢材切割成的多个钢板弯曲成规定形状，形成预期的形状。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2005240108A Plating apparatus and plating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：JP2005240108A
公开(公告)日：2005-09-08
申请号：JP2004051849
申请日：2004-02-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
IPC分类号： C25D7/12 , C25D5/02 , C25D5/34 , C25D5/48 , C25D5/50 , C25D17/00 , C25D21/12 , C25D21/14 , C25D21/16 , C25D21/18
CPC分类号： H01L2224/1146 , H01L2224/1147 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To form a plated film free from plating defect such as a chipping of the film and an unplated spot, by surely plugging a plating liquid into an opening of a resist formed on a substrate, without adding a surface active agent to the plating liquid. SOLUTION: The plating apparatus for forming a plated film on a predetermined position of a substrate surface on which wiring has been formed, while using a resist as a mask, comprises an ashing device 300 for performing ashing treatment on the resist applied on the substrate surface; a pre-wetting section 26 for performing hydrophilizing treatment on the substrate surface after having been ashing-treated; a presoaking section 28 for cleaning or activating the surface of the substrate to be plated by contacting the substrate surface after having been hydrophilized with a treatment liquid; and a plating tank 34 for growing a plated film on the surface of the substrate to be plated by making the substrate surface contact with the plating liquid in which an anode is immersed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了形成没有电镀缺陷的电镀膜，例如膜的剥落和未镀层的斑点，通过将电镀液肯定地插入到形成在基板上的抗蚀剂的开口中，而不添加表面电镀液中的活性剂。＆lt; P＆gt;解决方案：在使用抗蚀剂作为掩模的同时，在形成有布线的基板表面的预定位置上形成电镀膜的电镀装置包括灰化装置300，用于对施加在抗蚀剂上的抗蚀剂进行灰化处理基材表面; 用于在灰化处理之后在基板表面上进行亲水化处理的预润湿部分26; 预浸渍部分28，用于通过在已经用处理液体亲水化之后使基板表面接触来清洁或激活待镀基材的表面; 以及电镀槽34，用于通过使基板表面与浸渍有阳极的电镀液接触而在被镀基板的表面上生长镀膜。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2011026708A Plating apparatus 有权
标题翻译：电镀设备
公开(公告)号：JP2011026708A
公开(公告)日：2011-02-10
申请号：JP2010209535
申请日：2010-09-17
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO NOBUTOSHI , KURIYAMA FUMIO , TAKEMURA TAKASHI , KIMURA MASAAKI , KOKAI REI , ONOZAWA MASUNOBU , HORIE KUNIAKI , MINAMI YOSHIO
IPC分类号： C25D5/08 , C25D5/18 , C25D7/12 , C25D21/10 , H01L21/288
CPC分类号： H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which has a relatively simple structure, enhances the in-plane uniformity of the film thickness of a plated film by more uniformly adjusting the flow of a plating solution in a plating tank, and surely embeds the plated film for a shorter period of time. SOLUTION: The plating apparatus has a nozzle pipe 400 that is arranged in an inner part of the plating tank so as to be immersed in the plating solution in the plating tank and has a plurality of spouting nozzles 406 for spouting the plating solution, which spout the plating solution toward the face to be plated of an article to be plated that is held by a holder to supply the plating solution into the plating tank. The nozzle pipe 400 is composed by combining longitudinal pipes 402 and transverse pipes 404 in a lattice shape, and is composed so as to be freely movable in the transverse direction and/or the longitudinal direction in parallel to the face to be plated of the article to be plated which is held by the holder and is arranged so as to be immersed in the plating solution in the plating tank. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种结构相对简单的电镀装置，通过更均匀地调节电镀槽中的电镀液的流动来提高镀膜的膜厚的面内均匀性，以及确保将电镀膜嵌入较短的时间。解决方案：电镀装置具有喷镀管400，该喷嘴管400布置在镀槽的内部，以便浸入镀槽中的镀液中，并且具有多个用于喷射镀液的喷射喷嘴406 ，其将镀液溶液喷射到待保持的被镀物品的待镀面上，以将电镀液供给到电镀槽中。喷嘴管400通过将纵管402和横管404以格子形状组合而构成，并且能够在横向和/或长度方向上平行于待被镀的表面自由移动被电镀保持在电镀槽中的电镀液中。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JPH09317685A PUMP DEVICE 失效
公开(公告)号：JPH09317685A
公开(公告)日：1997-12-09
申请号：JP15751496
申请日：1996-05-29
申请人： EBARA CORP
发明人： KATO HIROYUKI , TAKEMURA TAKASHI , KUROKAWA JUNICHI
IPC分类号： F04D15/00
摘要： PROBLEM TO BE SOLVED: To provide a pump device capable of efficiently adjusting a difference of axial thrust force working on the main plate side of an impeller and axial thrust force working on the side plate side in comparatively simple constitution and preventing clogging and lowering of efficiency. SOLUTION: This pump device is constituted by storing an impeller 3 having a main plate 5 and a side plate 6 in the inside of a casing 1 free to rotate and to deliver fluid from the impeller 3 toward a ring space 7 in its circumference by rotation of the impeller 3. A pressure adjusting channel to flow a part of fluid in the ring space to a clearance S between the casing 1 and either of the main plate 5 and the side plate 6 while restarting a revolving flow is provided on the casing 1.

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