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    • 3. 发明授权
    • Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules
    • 多层陶瓷载体上芯片模块散热的布置,特别是多芯片模块
    • US06365260B1
    • 2002-04-02
    • US09202112
    • 1999-07-08
    • Günther StecherAnnette Seibold
    • Günther StecherAnnette Seibold
    • H01L23427
    • H01L23/427H01L25/0655H01L25/072H01L2924/0002H01L2924/09701H05K1/0272H05K1/0306Y10S428/901Y10T428/24331Y10T428/24562Y10T428/24661Y10T428/24744H01L2924/00
    • A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted. In the layers of the multilayer ceramic substrate located between the evaporation chamber and the condenser, in the region of these two chambers, a series of large steam channels and small condensate channels, the latter functioning as capillaries is provided, which interconnect these two chambers. This arrangement forms a miniaturized heat pipe structure which can transport a great amount of energy per unit of time across short distances.
    • 在多层陶瓷基板,特别是多芯片模块中的芯片模块的散热装置,其中在陶瓷基板中提供用于导热介质的通道。 多层陶瓷基板安装在金属散热器上。 特别是孔图案或阵列形式的热通道在待安装的芯片的区域中设置在多层陶瓷基板的顶层中。 作为蒸发室的空腔设置在多层陶瓷基板的正下方的顶层的下方,在要安装的芯片的区域中,并且用作冷凝器的槽形凹部设置在金属散热器 ,在要安装的芯片的区域。 在位于蒸发室和冷凝器之间的多层陶瓷基板的层中,在这两个室的区域中,提供了一系列大的蒸汽通道和小的冷凝物通道,后者用作毛细管,其连接这两个室。 这种布置形成了一种小型化的热管结构,其可以在短距离内每单位时间输送大量的能量。