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1. 发明申请

US20070132536A1 Printed circuit board having embedded electronic components and manufacturing method thereof 失效
标题翻译：具有嵌入式电子部件的印刷电路板及其制造方法
公开(公告)号：US20070132536A1
公开(公告)日：2007-06-14
申请号：US11637664
申请日：2006-12-13
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H01F5/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

2. 发明授权

US07697301B2 Printed circuit board having embedded electronic components and manufacturing method thereof 失效
标题翻译：具有嵌入式电子部件的印刷电路板及其制造方法
公开(公告)号：US07697301B2
公开(公告)日：2010-04-13
申请号：US11637664
申请日：2006-12-13
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

3. 发明申请

US20100154210A1 Method of manufacturing a printed circuit board having embedded electronic components 审中-公开
标题翻译：具有嵌入式电子部件的印刷电路板的制造方法
公开(公告)号：US20100154210A1
公开(公告)日：2010-06-24
申请号：US12656781
申请日：2010-02-16
申请人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Byoung-Youl Min , Myung-Sam Kang , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06524 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/3511 , H05K1/056 , H05K3/4608 , H05K2201/10515 , Y10T29/4913 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.
摘要翻译：一种具有嵌入式电子部件的印刷电路板的制造方法。利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度因为电子部件安装在芯片的两侧。

4. 发明授权

US07947906B2 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07947906B2
公开(公告)日：2011-05-24
申请号：US11528322
申请日：2006-09-28
申请人： Doo-Hwan Lee , Je-Gwang Yoo , Seung-Gu Kim , Jae-Kul Lee , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Je-Gwang Yoo , Seung-Gu Kim , Jae-Kul Lee , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H05K3/02 , H05K1/00
CPC分类号： H05K1/185 , H01L23/13 , H01L23/142 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/83192 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H05K1/021 , H05K1/053 , H05K3/4608 , H05K2201/09745 , H05K2201/10477 , H05K2201/10674 , H05K2203/0315 , Y10T29/49156 , H01L2924/00
摘要： A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.
摘要翻译：一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。

5. 发明申请

US20070074900A1 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20070074900A1
公开(公告)日：2007-04-05
申请号：US11528322
申请日：2006-09-28
申请人： Doo-Hwan Lee , Je-Gwang Yoo , Seung-Gu Kim , Jae-Kul Lee , Moon-Il Kim , Hyung-Tae Kim
发明人： Doo-Hwan Lee , Je-Gwang Yoo , Seung-Gu Kim , Jae-Kul Lee , Moon-Il Kim , Hyung-Tae Kim
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L23/13 , H01L23/142 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/83192 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H05K1/021 , H05K1/053 , H05K3/4608 , H05K2201/09745 , H05K2201/10477 , H05K2201/10674 , H05K2203/0315 , Y10T29/49156 , H01L2924/00
摘要： A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the metal substrate to form at least one insulation layer, (b) forming an inner layer circuit on the at least one insulation layer, (d) placing chip bond adhesive in correspondence with a position where the electronic component is to be embedded and mounting the electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an anodizing process and is used as a core member in a printed circuit board, so that bending stiffness and heat-releasing property are improved; wet etching can be applied, so that manufacturing costs are reduced; and a chip bond adhesive, die attach film, or nonconductive paste, etc., that is high in thixotropy is used in embedding the electronic component, so that the degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.
摘要翻译：公开了一种印刷电路板及其制造方法。通过使用制造印刷电路板的方法，该印刷电路板使用金属基板作为核心部件并且具有嵌入金属基板中的电子部件，其主要包括：（a）阳极氧化金属基板的至少一个表面以形成至少一个绝缘层，（b）在所述至少一个绝缘层上形成内层电路，（d）将芯片粘结粘合剂放置在与要嵌入电子元件的位置相对应并安装电子元件的位置）形成与形成内层电路的位置对应的外层电路和电子部件的电极的位置，并且还可以包括蚀刻金属基板以形成相应的空腔的操作（c）具有将电子部件嵌入在操作（b）和（d）之间的位置，诸如铝等的金属基板通过ap被电绝缘采用阳极氧化工艺，用作印刷电路板中的芯材，改善了弯曲刚度和散热性能; 可以应用湿蚀刻，从而降低制造成本; 并且在嵌入电子部件时使用具有高触变性的芯片接合粘合剂，芯片附着膜或非导电浆料等，使得当嵌入时电子部件的位置和高度的精度可以增加电子元件。

6. 发明授权

US08929091B2 Method of manufacturing a printed circuit board (PCB) 有权
标题翻译：制造印刷电路板（PCB）的方法
公开(公告)号：US08929091B2
公开(公告)日：2015-01-06
申请号：US13067131
申请日：2011-05-11
申请人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
发明人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
IPC分类号： H05K1/16 , H01L23/538 , H01L23/13 , H01L23/00 , H05K1/18
CPC分类号： H01L23/5389 , H01L23/13 , H01L24/11 , H01L24/13 , H01L24/24 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/1132 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/13147 , H01L2224/13166 , H01L2224/24227 , H01L2224/82039 , H01L2224/82047 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H05K1/185 , Y10T29/4913 , H01L2224/13099 , H01L2224/05599
摘要： A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.
摘要翻译：一种制造具有嵌入式裸芯片的印刷电路板（PCB）的方法包括：将带粘附到具有形成在其中的穿透孔的绝缘基板的一侧，并将裸芯片附接到穿透孔内的带上，使得电极焊盘的裸片面对磁带; 用填料填充贯通孔，取出胶带; 将金属层层压到填料的表面上以及除去带的绝缘基板; 以及通过去除金属层的部分形成电极凸块。电极凸块的形成还包括同时去除金属层的部分并在绝缘基板的一侧上形成电路图案。电路图案直接形成在绝缘基板的上侧，并且电极凸块形成在电极焊盘的表面上。

7. 发明授权

US08184448B2 Bare chip embedded PCB 有权
标题翻译：裸芯片嵌入式PCB
公开(公告)号：US08184448B2
公开(公告)日：2012-05-22
申请号：US11703814
申请日：2007-02-08
申请人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
发明人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
IPC分类号： H05K1/16
CPC分类号： H01L23/5389 , H01L23/13 , H01L24/11 , H01L24/13 , H01L24/24 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/1132 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/13147 , H01L2224/13166 , H01L2224/24227 , H01L2224/82039 , H01L2224/82047 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H05K1/185 , Y10T29/4913 , H01L2224/13099 , H01L2224/05599
摘要： A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.
摘要翻译：具有嵌入式裸芯片的PCB包括其中形成有穿透孔的绝缘基板; 填充物穿透孔内部的填充物; 嵌入填料中的裸芯片，使得在其一侧形成的电极焊盘在填料的表面露出; 以及附着到电极焊盘的表面并突出以暴露于外部的电极凸块。

8. 发明申请

US20110277320A1 Method of manufacturing a PCB having an embedded bare chip 审中-公开
标题翻译：制造具有嵌入式裸芯片的PCB的方法
公开(公告)号：US20110277320A1
公开(公告)日：2011-11-17
申请号：US13067131
申请日：2011-05-11
申请人： Kyung-Jin Han , Hyung-Tae Kim , Moon-il Kim , Jae-Kul Lee , Doo-Hwan Lee
发明人： Kyung-Jin Han , Hyung-Tae Kim , Moon-il Kim , Jae-Kul Lee , Doo-Hwan Lee
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L23/13 , H01L24/11 , H01L24/13 , H01L24/24 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/1132 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/13147 , H01L2224/13166 , H01L2224/24227 , H01L2224/82039 , H01L2224/82047 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H05K1/185 , Y10T29/4913 , H01L2224/13099 , H01L2224/05599
摘要： A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.
摘要翻译：一种制造PCB的方法，包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。

9. 发明申请

US20070181988A1 Bare chip embedded PCB and method of the same 有权
标题翻译：裸芯片嵌入式PCB和方法相同
公开(公告)号：US20070181988A1
公开(公告)日：2007-08-09
申请号：US11703814
申请日：2007-02-08
申请人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
发明人： Kyung-Jin Han , Hyung-Tae Kim , Moon-Il Kim , Jae-Kul Lee , Doo-Hwan Lee
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L23/5389 , H01L23/13 , H01L24/11 , H01L24/13 , H01L24/24 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/1132 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/13147 , H01L2224/13166 , H01L2224/24227 , H01L2224/82039 , H01L2224/82047 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H05K1/185 , Y10T29/4913 , H01L2224/13099 , H01L2224/05599
摘要： A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.
摘要翻译：公开了具有嵌入式裸芯片的PCB及其制造方法。制造PCB的方法可以包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。这样，裸芯片嵌入式PCB的批量生产系统可以简化工艺，成本低廉。

10. 发明申请

US20110152717A1 APPARATUS FOR INSERTING NEEDLE 有权
标题翻译：插入针的装置
公开(公告)号：US20110152717A1
公开(公告)日：2011-06-23
申请号：US12796446
申请日：2010-06-08
申请人： Kwang-Gi KIM , Soo-Hyeon Kim , Hyung-Tae Kim
发明人： Kwang-Gi KIM , Soo-Hyeon Kim , Hyung-Tae Kim
IPC分类号： A61B10/00 , A61M5/20
CPC分类号： A61B10/0233 , A61B10/0283 , A61B34/30 , A61B90/11 , A61M5/158 , A61M2005/1585
摘要： Provided is an apparatus for inserting a needle capable of obtaining automation of tissue sample collection or drug injection and operation stability by applying a link mechanism between a needle inserted into a specific part of a human body and a power source for providing a drive force. The apparatus includes a needle unit inserted into a human body, a drive unit configured to provide a drive force to the needle unit such that the needle unit reciprocates between an insertion position at which the needle unit is inserted into the human body and a withdrawal position at which the needle unit is withdraw to the outside of the human body, and a guide unit including a plurality of guide links each having at least two links relatively rotated by the drive force of the drive unit and radially disposed around the needle unit, and configured to guide the needle unit such that the needle unit translates between the insertion position and the withdrawal position in a longitudinal direction of the needle unit.
摘要翻译：提供一种用于插入能够通过在插入人体的特定部分的针和提供驱动力的电源之间的连杆机构来获得组织样本收集或药物注射和操作稳定性的自动化的针的装置。该装置包括插入人体的针单元，驱动单元，其构造成向针单元提供驱动力，使得针单元在针单元插入人体的插入位置与拔出位置之间往复运动所述引导单元包括多个引导链，所述导向连接件具有通过所述驱动单元的驱动力相对旋转并且径向设置在所述针单元周围的至少两个链节，以及被配置为引导所述针单元，使得所述针单元在所述针单元的纵向方向上在所述插入位置和所述退出位置之间平移。

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