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    • 1. 发明申请
    • Surface acoustic wave device package
    • 声表面波器件封装
    • US20060250049A1
    • 2006-11-09
    • US11259199
    • 2005-10-27
    • Doo ParkYoung LeeSeung LeeJoo ParkSang ParkNam Kim
    • Doo ParkYoung LeeSeung LeeJoo ParkSang ParkNam Kim
    • H01L41/053
    • H03H9/1085H01L2224/16225H03H9/059
    • The present invention provides a SAW device package used in filters, duplexers, etc., in particular, which simplifies sealing process for protecting the active area of a SAW device. The SAW device package comprises a wiring substrate, as a package base having connection patterns, having bare chip attaching means. A bare chip is flip-bonded and attached to the attaching means on the wiring substrate while maintaining the airtight condition. A resin molding part covers the top of the bare chip to seal the device. The invention facilitates maintaining an airtight condition of the active area which affects the operational characteristics of the device, and simplifies the manufacturing processes. Furthermore, the improved structure of the wiring substrate blocks the external moisture permeation, thereby enabling the device to better withstand the external changes.
    • 本发明提供了一种特别用于滤波器,双工器等中的SAW器件封装,其简化了用于保护SAW器件的有源区域的密封工艺。 SAW器件封装包括布线衬底,作为具有连接图案的封装基座,具有裸芯片附接装置。 在保持气密状态的同时,将裸芯片翻转接合并附接到布线基板上的附接装置。 树脂成型部分覆盖裸芯片的顶部以密封装置。 本发明有助于维持影响装置的操作特性的活性区域的气密状态,并且简化了制造过程。 此外,布线基板的改进的结构阻止外部水分渗透,从而使得该装置能够更好地承受外部变化。