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    • 2. 发明授权
    • Method of manufacturing semiconductor device for formation of pin transistor
    • 用于形成pin晶体管的半导体器件的制造方法
    • US07563654B2
    • 2009-07-21
    • US11647759
    • 2006-12-29
    • Dong Sun SheenSeok Pyo SongSang Tae AhnHyeon Ju AnHyun Chul Sohn
    • Dong Sun SheenSeok Pyo SongSang Tae AhnHyeon Ju AnHyun Chul Sohn
    • H01L21/335
    • H01L27/0886H01L27/1214
    • A method for manufacturing a semiconductor device is disclosed. The method includes the steps of defining a trench into a field region of a semiconductor substrate having an active region and the field region; partially filing the trench with a flowable insulation layer; completely filling the trench with an isolation structure by depositing a close-packed insulation layer on the flowable insulation layer in the trench; etching through a portion of the close-packed insulation layer and etching into a partial thickness of the flowable insulation layer of the insulation structure to expose a portion of the active region; cleaning the resultant substrate having the active region relatively projected; forming spacers on etched portions of the flowable insulation layer where bowing occurs during the cleaning step; and forming gates on the active region and the insulation structure to border the exposed portion of the active region.
    • 公开了一种制造半导体器件的方法。 该方法包括以下步骤:将沟槽定义为具有有源区域和场区域的半导体衬底的场区域; 用可流动的绝缘层部分地填充沟槽; 通过在沟槽中的可流动绝缘层上沉积紧密堆积的绝缘层,通过隔离结构完全填充沟槽; 蚀刻通过所述紧密封装绝缘层的一部分并蚀刻成所述绝缘结构的可流动绝缘层的部分厚度以暴露所述有源区的一部分; 清洁具有相对投影的活性区域的所得基材; 在清洁步骤中发生弯曲的可流动绝缘层的蚀刻部分上形成间隔物; 以及在所述有源区和所述绝缘结构上形成栅极以与所述有源区的所述暴露部分相接触。
    • 4. 发明申请
    • Method of manufacturing semiconductor device for formation of pin transistor
    • 用于形成pin晶体管的半导体器件的制造方法
    • US20070281454A1
    • 2007-12-06
    • US11647759
    • 2006-12-29
    • Dong Sun SheenSeok Pyo SongSang Tae AhnHyeon Ju AnHyun Chul Sohn
    • Dong Sun SheenSeok Pyo SongSang Tae AhnHyeon Ju AnHyun Chul Sohn
    • H01L21/3205
    • H01L27/0886H01L27/1214
    • A method for manufacturing a semiconductor device is disclosed. The method includes the steps of defining a trench into a field region of a semiconductor substrate having an active region and the field region; partially filing the trench with a flowable insulation layer; completely filling the trench with an isolation structure by depositing a close-packed insulation layer on the flowable insulation layer in the trench; etching through a portion of the close-packed insulation layer and etching into a partial thickness of the flowable insulation layer of the insulation structure to expose a portion of the active region; cleaning the resultant substrate having the active region relatively projected; forming spacers on etched portions of the flowable insulation layer where bowing occurs during the cleaning step; and forming gates on the active region and the insulation structure to border the exposed portion of the active region.
    • 公开了一种制造半导体器件的方法。 该方法包括以下步骤:将沟槽定义为具有有源区域和场区域的半导体衬底的场区域; 用可流动的绝缘层部分地填充沟槽; 通过在沟槽中的可流动绝缘层上沉积紧密堆积的绝缘层,通过隔离结构完全填充沟槽; 蚀刻通过所述紧密封装绝缘层的一部分并蚀刻成所述绝缘结构的可流动绝缘层的部分厚度以暴露所述有源区的一部分; 清洁具有相对投影的活性区域的所得基材; 在清洁步骤中发生弯曲的可流动绝缘层的蚀刻部分上形成间隔物; 以及在所述有源区和所述绝缘结构上形成栅极以与所述有源区的所述暴露部分相接触。