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1. 发明授权

US07440779B2 Radar detector having function of hands-free device 有权
标题翻译：雷达探测器具有免提装置功能
公开(公告)号：US07440779B2
公开(公告)日：2008-10-21
申请号：US11299770
申请日：2005-12-13
申请人： Dong Chul Kim , Jeong Hun Kim , Young Jip Kim , Jong Yeon Kim , Jung Hyun Kim
发明人： Dong Chul Kim , Jeong Hun Kim , Young Jip Kim , Jong Yeon Kim , Jung Hyun Kim
IPC分类号： H04M1/00
CPC分类号： H04M1/6075 , G01S7/021 , H04B1/3877
摘要： A radar detector enabling hands-free communication over a mobile phone by connecting the mobile phone to the radar detector. The radar detector includes a horn antenna; a signal-processing unit (SPU) for detecting a signal received by the horn antenna; a laser module for receiving a laser signal; a central processing unit (CPU) for controlling the SPU; a pulse delay unit for delaying or sustaining a CPU pulse; a sweep voltage generator unit for driving the SPU; a warning unit for warning the detected signal; an audio amplifier controller connected to the CPU and the warning unit to amplify an audio signal; and a connecting unit installed to connect the audio amplifier controller with a mobile phone. The connecting unit includes a microphone, a switch for reception of a signal from the mobile phone, and a connection portion for connection to the mobile phone.
摘要翻译：一种雷达检测器，通过将移动电话连接到雷达探测器，实现手机上的免提通信。雷达检测器包括喇叭天线; 用于检测由喇叭天线接收的信号的信号处理单元（SPU）; 用于接收激光信号的激光模块; 用于控制SPU的中央处理单元（CPU）; 用于延迟或维持CPU脉冲的脉冲延迟单元; 用于驱动SPU的扫描电压发生器单元; 用于警告所检测到的信号的警告单元; 音频放大器控制器，连接到CPU和警告单元以放大音频信号; 以及安装用于将音频放大器控制器与移动电话连接的连接单元。连接单元包括麦克风，用于接收来自移动电话的信号的开关，以及用于连接到移动电话的连接部分。

2. 发明授权

US06716738B2 Method of fabricating multilayered UBM for flip chip interconnections by electroplating 失效
标题翻译：通过电镀制造用于倒装芯片互连的多层UBM的方法
公开(公告)号：US06716738B2
公开(公告)日：2004-04-06
申请号：US10232471
申请日：2002-08-30
申请人： Su Hyeon Kim , Jong Yeon Kim , Jin Yu
发明人： Su Hyeon Kim , Jong Yeon Kim , Jin Yu
IPC分类号： H01L2144
CPC分类号： C25D5/18 , C25D5/12 , C25D7/123 , H01L21/2885 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05147 , H01L2224/05155 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00014
摘要： Disclosed is a fabrication method of UBM for flip chip interconnections of a semiconductor device, consisting of dipping a patterned wafer into a plating solution containing materials supplying nickel and copper ions, forming a copper layer at a predetermined current density for connection between a chip pad and a solder bump and for residual stress-buffering, and forming a nickel-copper alloy layer at an increased current density for prevention of diffusion between the solder and the pad. The method is advantageous in terms of low fabrication cost due to not requiring an etching process, while meeting the conditions of wettability, diffusion-barrier function and small residual stress required to form UBM on the patterned wafer.
摘要翻译：公开了一种用于半导体器件的倒装芯片互连的UBM的制造方法，其包括将图案化晶片浸入含有供应镍和铜离子的材料的镀液中，形成预定电流密度的铜层，用于连接芯片焊盘和焊料凸块和残余应力缓冲，并以增加的电流密度形成镍 - 铜合金层，以防止焊料和焊盘之间的扩散。该方法由于不需要蚀刻工艺而在低制造成本方面是有利的，同时满足在图案化晶片上形成UBM所需的润湿性，扩散阻挡功能和小的残余应力条件。

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