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    • 2. 发明授权
    • Ink jet heater chip module with sealant material
    • 喷墨加热器芯片模块采用密封材料
    • US06267472B1
    • 2001-07-31
    • US09100070
    • 1998-06-19
    • Colin Geoffrey MaherAshok MurthyDarrin Wayne OliverRobert Allen SamplesJeanne Marie Saldanha SinghCarl Edmond Sullivan
    • Colin Geoffrey MaherAshok MurthyDarrin Wayne OliverRobert Allen SamplesJeanne Marie Saldanha SinghCarl Edmond Sullivan
    • B41J205
    • B41J2/1635B41J2/14024B41J2/14072B41J2/1603B41J2/1623B41J2202/03
    • A heater chip module is provided comprising a carrier adapted to be secured directly to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes inner side walls and a support section which together define an inner cavity. An edge feed heater chip is coupled to the carrier support section. The heater chip includes side walls. The support section includes first and second passages which define first and second paths for ink to travel from the container to the inner cavity. The inner cavity and the heater chip are sized such that a first side wall of the heater chip is spaced from a first inner side wall of the carrier and a second side wall of the heater chip is spaced from a second inner side wall of the carrier. A nozzle plate is coupled to the heater chip and the carrier. The nozzle plate has a width such that the nozzle plate extends over an outer surface of the carrier. Sealant material is provided in the inner cavity such that at least a portion of the first inner side wall of the carrier, at least a portion of the first side wall of the heater chip, a first section of the nozzle plate and the sealant material define a first sealed ink cavity for receiving ink passing through the first passage. Additional sealant material is provided in the inner cavity such that at least a portion of the second inner side wall of the carrier, at least a portion of the second side wall of the heater chip, a second section of the nozzle plate and the additional sealant material define a second sealed ink cavity for receiving ink passing through the second passage.
    • 提供一种加热器芯片模块,其包括适于直接固定到填充墨水的容器的载体,至少一个具有联接到载体的基座的加热器芯片,以及耦合到加热器芯片的至少一个喷嘴板。 载体包括内侧壁和一起限定内腔的支撑部分。 边缘进料加热器芯片联接到载体支撑部分。 加热器芯片包括侧壁。 支撑部分包括第一和第二通道,其限定用于油墨从容器行进到内腔的第一和第二路径。 内腔和加热器芯片的尺寸使得加热器芯片的第一侧壁与载体的第一内侧壁间隔开,并且加热器芯片的第二侧壁与载体的第二内侧壁间隔开 。 喷嘴板连接到加热器芯片和载体。 喷嘴板具有使得喷嘴板在载体的外表面上延伸的宽度。 密封材料设置在内腔中,使得载体的第一内侧壁的至少一部分,加热器芯片的第一侧壁的至少一部分,喷嘴板的第一部分和密封材料限定 用于接收通过第一通道的油墨的第一密封油墨腔。 附加的密封剂材料设置在内腔中,使得载体的第二内侧壁的至少一部分,加热器芯片的第二侧壁的至少一部分,喷嘴板的第二部分和附加密封剂 材料限定了用于接收通过第二通道的油墨的第二密封油墨腔。