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    • 5. 发明授权
    • Method of treating a metal surface to increase polymer adhesion
    • 处理金属表面以增加聚合物粘合力的方法
    • US06286939B1
    • 2001-09-11
    • US08938786
    • 1997-09-26
    • Gregory T. HindmanDomingo A. FigueredoRonald L. Enck
    • Gregory T. HindmanDomingo A. FigueredoRonald L. Enck
    • B41J205
    • B41J2/14129B41J2202/03
    • A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF4), fluoroform (CHF3), hexafluoroethane (C2F6), difluoromethane (CH2F2), pentafluoroethane (C2HF5), tetraf luoroethane (C2H2F4), or octafluorobutene (C4F8).
    • 一种热喷墨打印头,其包括具有多个薄膜层的薄膜基板,多个薄膜层中限定的多个喷墨加热电阻器,设置在所述多个薄膜层上的图案化钽层, 设置在图案化的钽层上的粘合层,设置在阻挡粘附层上的油墨阻挡层和在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室,每个室由阻挡层中的开口形成, 层更具体地包括氮化钽层或沉积的钽,碳,氟和含氧层,其是通过将图案化的钽层暴露于等离子体而形成的,所述等离子体包括氟化烃如四氟化碳(CF 4),氟代( CHF3),六氟乙烷(C2F6),二氟甲烷(CH2F2),五氟乙烷(C2HF5),四氟乙烷(C2H2F4)或八氟 鲁本(C4F8)。
    • 6. 发明授权
    • Thin-film printhead device for an ink-jet printer
    • 用于喷墨打印机的薄膜打印头装置
    • US5883650A
    • 1999-03-16
    • US568208
    • 1995-12-06
    • Domingo A. FigueredoDavid R. ThomasMark A. Buonanno
    • Domingo A. FigueredoDavid R. ThomasMark A. Buonanno
    • B41J2/14B41J2/16B41J2/05
    • B41J2/14129B41J2/1603B41J2/1623B41J2/1628B41J2/1629B41J2/1631B41J2/1642B41J2/1646
    • The present invention provides an ink-jet printhead substructure highly thermally efficient and greatly simplified in both the method of manufacture and resulting structure. The printhead substructure of the present invention comprises a resistor formed on an insulated substrate, a single conductive layer that provides both the conductive bonding interconnect pads and the conductive traces for the substructure, a passivation layer and a cavitation barrier. The resistor, passivation layer and cavitation barrier may comprise a single graded layer. The graded thin-film structure provides the resistor, passivation and cavitation barrier components without creating abrupt layer interfaces thereby, improving printhead reliability and durability. Fabrication of the printhead substructure of the present invention requires only two or three lithographic masks and a minimized number of sputter source materials.
    • 本发明在制造方法和结构的结构中提供了高度热效率且大大简化的喷墨打印头底座。 本发明的打印头子结构包括形成在绝缘基板上的电阻器,提供导电接合互连焊盘和用于子结构的导电迹线,钝化层和空化屏障的单个导电层。 电阻器,钝化层和空化屏障可以包括单个梯度层。 分级薄膜结构提供电阻器,钝化和气蚀屏障部件,而不产生突变层界面,从而提高打印头的可靠性和耐用性。 本发明的打印头子结构的制造仅需要两个或三个光刻掩模和最少数量的溅射源材料。
    • 9. 发明授权
    • Method of treating a metal surface to increase polymer adhesion
    • 处理金属表面以增加聚合物粘合力的方法
    • US06441838B1
    • 2002-08-27
    • US09765825
    • 2001-01-19
    • Gregory T. HindmanDomingo A. FigueredoRonald L. Enck
    • Gregory T. HindmanDomingo A. FigueredoRonald L. Enck
    • G01D928
    • B41J2/1606B41J2/14129
    • A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF4), fluoroform (CHF3), hexafluoroethane (C2F6), difluoromethane (CH2F2), pentafluoroethane (C2HF5), tetrafluoroethane (C2H2F4), or octafluorobutene (C4F8).
    • 一种热喷墨打印头,其包括具有多个薄膜层的薄膜基板,多个薄膜层中限定的多个喷墨加热电阻器,设置在所述多个薄膜层上的图案化钽层, 设置在图案化的钽层上的粘合层,设置在阻挡粘附层上的油墨阻挡层和在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室,每个室由阻挡层中的开口形成, 层更具体地包括氮化钽层或沉积的钽,碳,氟和含氧层,其是通过将图案化的钽层暴露于等离子体而形成的,所述等离子体包括氟化烃如四氟化碳(CF 4),氟代( CHF3),六氟乙烷(C2F6),二氟甲烷(CH2F2),五氟乙烷(C2HF5),四氟乙烷(C2H2F4)或八氟 (C4F8)。
    • 10. 发明授权
    • Small value precision integrated circuit resistors
    • 小型精密集成电路电阻
    • US5257005A
    • 1993-10-26
    • US931615
    • 1992-08-18
    • Alan R. DesrochesDomingo A. Figueredo
    • Alan R. DesrochesDomingo A. Figueredo
    • H01C17/00H01L27/08H01L29/8605H01C1/14H01C1/012
    • H01L27/0802H01L29/8605
    • The effective parasitic end resistance of small-value precision integrated circuit resistors is reduced by providing N resistors connected in parallel and causing at least two of the resistors to share a terminal contact. The resulting integrated circuit resistor includes multiple terminal contacts of any number n greater than two. Of the n terminal contacts, N-1 terminal contacts are shared amongst said resistors. The parasitic end resistances are diminished by a factor equal to the number of resistors connected in parallel. By increasing the length of the active area of the N resistors by a factor equal to the number of the resistors, the desired resistance value remains undiminished. As a result, the parasitic end resistances may be made negligible compared to the desired resistance even for small value resistors.
    • 通过提供并联连接的N个电阻并使至少两个电阻器共享端子触点来减小小值精密集成电路电阻的有效寄生结束电阻。 所得到的集成电路电阻器包括多于n个大于2的多个端子触点。 在n个端子触点中,N-1个端子触点在所述电阻之间共享。 寄生端电阻减小等于并联连接的电阻器数量的因子。 通过将N个电阻器的有效面积的长度增加到等于电阻器数量的因子,期望的电阻值保持不变。 结果,即使对于小值电阻器,寄生端电阻也可以与期望的电阻相比可忽略。