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1. 发明授权

US07070419B2 Land grid array connector including heterogeneous contact elements 有权
标题翻译：地面阵列连接器包括异质接触元件
公开(公告)号：US07070419B2
公开(公告)日：2006-07-04
申请号：US10854600
申请日：2004-05-26
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , H01L23/32 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2457 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.
摘要翻译：用于电连接到形成在电子部件上的焊盘栅格阵列的焊盘的电连接器包括包括相对的第一和第二表面的电介质层和在电介质层的第一表面上方延伸的多个接触元件。每个接触元件包括设置成接合焊盘栅格阵列的相应焊盘的导电部分，用于提供与焊盘栅格阵列的电连接。特别地，多个接触元件包括第一接触元件和第二接触元件，由此第一接触元件具有与第二接触元件的操作性能不同的操作特性。在一个实施例中，操作属性包括机械或电气特性。例如，第一接触元件可以具有比第二接触元件更大的弹性。

2. 发明授权

US06869290B2 Circuitized connector for land grid array 有权
标题翻译：电路连接器用于焊盘阵列
公开(公告)号：US06869290B2
公开(公告)日：2005-03-22
申请号：US10854437
申请日：2004-05-26
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
IPC分类号： H01L23/32 , H01L23/48 , H01R12/04 , H01R13/03 , H01R13/24 , H01R43/00 , H01R43/20 , H05K3/32 , H05K3/40 , H05K7/10 , H01R12/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2457 , H01R43/007 , H01R43/205 , H05K3/326 , H05K7/1069 , H01L2924/00
摘要： A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.
摘要翻译：用于电连接到形成在电子部件上的焊盘栅格阵列的焊盘的连接器包括包括相对的第一和第二表面的电介质层和在电介质层的第一表面之上延伸的多个接触元件。每个接触元件包括设置成接合焊盘栅格阵列的相应焊盘的导电部分，用于提供与焊盘栅格阵列的电连接。连接器还包括形成在电介质层上或内部的电路。电路电连接到多个接触元件中的至少一个。在一个实施例中，电路包括诸如去耦电容器的电气部件。在另一个实施例中，电路操作以将两个接触元件连接在一起。例如，连接到地电位的接触元件可以通过电路连接在一起。

3. 发明授权

US06916181B2 Remountable connector for land grid array packages 有权
标题翻译：用于焊盘阵列封装的可重新连接器
公开(公告)号：US06916181B2
公开(公告)日：2005-07-12
申请号：US10460501
申请日：2003-06-11
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
IPC分类号： H01L23/32 , H01L23/48 , H01R12/04 , H01R13/03 , H01R13/24 , H01R43/00 , H01R43/20 , H05K3/32 , H05K3/40 , H05K7/10 , H05K1/00
CPC分类号： H01L24/72 , H01L23/32 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2492 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.
摘要翻译：用于电连接到焊盘栅极阵列的焊盘的连接器包括包括相对的第一和第二表面的介电层以及形成在介电层的第一表面上的多个接触元件。每个接触元件包括导电材料的基部和与基部一体形成的导电材料的弹性部分。弹性部分从基部延伸并突出在电介质层的第一表面之上。多个接触元件的每个弹性部分弹性地接合焊盘栅格阵列的相应焊盘，以提供与焊盘栅格阵列的电连接。特别地，每个弹性部分具有接触元件的电路长度的顺序的弹性工作范围。

4. 发明授权

US07628617B2 Structure and process for a contact grid array formed in a circuitized substrate 有权
标题翻译：在电路化基板中形成的接触栅极阵列的结构和工艺
公开(公告)号：US07628617B2
公开(公告)日：2009-12-08
申请号：US11525755
申请日：2006-09-22
申请人： Dirk D. Brown , John D. Williams , William B. Long
发明人： Dirk D. Brown , John D. Williams , William B. Long
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H05K3/326 , H05K3/4015 , H05K3/4092 , H05K2201/0311 , H05K2201/0397 , H05K2201/10719 , H05K2201/10924 , H05K2201/10946
摘要： An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.
摘要翻译：弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

5. 发明授权

US07244125B2 Connector for making electrical contact at semiconductor scales 有权
标题翻译：用于在半导体尺度进行电接触的连接器
公开(公告)号：US07244125B2
公开(公告)日：2007-07-17
申请号：US10731669
申请日：2003-12-08
申请人： Dirk D. Brown , John D. Williams , Eric M. Radza
发明人： Dirk D. Brown , John D. Williams , Eric M. Radza
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , G01R1/0416 , G01R3/00 , H01L23/32 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2442 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
摘要翻译：用于电连接到形成在半导体器件上的焊盘的连接器包括衬底和形成在衬底上的导电材料的接触元件阵列。每个接触元件包括附接到基底的顶表面的基部和从基部延伸并具有突出在基底上方的远端的弯曲弹簧部分。弯曲的弹簧部分被形成为远离接触平面弯曲并且具有设置成在接合半导体器件的相应焊盘时提供受控的擦拭动作的曲率。

6. 发明授权

US07113408B2 Contact grid array formed on a printed circuit board 有权
标题翻译：在印刷电路板上形成的接触栅格阵列
公开(公告)号：US07113408B2
公开(公告)日：2006-09-26
申请号：US10460497
申请日：2003-06-11
申请人： Dirk D. Brown , John D. Williams
发明人： Dirk D. Brown , John D. Williams
IPC分类号： H01R9/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L2224/05001 , H01L2224/05022 , H01L2224/051 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R43/007 , H01R43/205 , H05K3/326 , H05K7/1069 , H01L2924/00 , H01L2924/00014
摘要： A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.
摘要翻译：印刷电路板包括电介质层和在电介质层的第一表面之上延伸的接触元件的区域阵列。每个接触元件包括导电部分，其布置成接合焊盘栅格阵列模块的相应焊盘，用于提供与焊盘栅格阵列模块的电连接。地面栅格阵列模块可以包括平面栅格阵列封装或第二印刷电路板。在一个实施例中，接触元件选自包括金属弹簧，捆扎丝，聚合物中的金属和固体金属片的接触类型。在另一个实施例中，区域阵列中的接触元件包括导电材料的基部和与基部一体形成的导电材料的弹性部分，由此弹性部分从基部延伸并突出在电介质层的第一表面之上。

7. 发明授权

US08922301B1 High quality-factor resonator 有权
标题翻译：高质量因子谐振器
公开(公告)号：US08922301B1
公开(公告)日：2014-12-30
申请号：US13283138
申请日：2011-10-27
申请人： John D. Williams , Reza Kamali-Sarvestani
发明人： John D. Williams , Reza Kamali-Sarvestani
IPC分类号： H03H7/01
CPC分类号： H03H7/175 , H05K1/16 , H05K1/162 , H05K1/165
摘要： A high-Q factor resonator comprises a solenoid having an embedded capacitor assembled in a machineable high-frequency dielectric printed circuit board (“PCB”), or other substrate. The solenoid comprises a plurality of surface conductors positioned on upper and lower surfaces of the PCB. The solenoid further comprises a plurality of conductive vias extending through the PCB between the surface conductors, and at least two aligned vias are separated by a capacitive gap. The device can therefore be described as a coupled circuit having a 1.5 or more turn inductor with an embedded capacitor along the length of the conductive path. Accordingly, a resonator having a high-Q factor is provided which is relatively inexpensive and easy to fabricate.
摘要翻译：高Q因子谐振器包括具有组装在可加工的高频电介质印刷电路板（“PCB”）或其它基板中的嵌入式电容器的螺线管。螺线管包括位于PCB的上表面和下表面上的多个表面导体。螺线管还包括在表面导体之间延伸穿过PCB的多个导电通孔，并且至少两个对准的通孔被电容间隙分开。因此，该装置可以被描述为具有沿着导电路径的长度的具有嵌入式电容器的1.5或更多转向电感器的耦合电路。因此，提供了具有高Q因子的谐振器，其相对便宜并且易于制造。

8. 发明申请

US20140142134A1 INHIBITORS OF BACTERIAL TYPE III SECRETION SYSTEM 有权
标题翻译：细菌III型分泌系统的抑制剂
公开(公告)号：US20140142134A1
公开(公告)日：2014-05-22
申请号：US14232445
申请日：2012-07-13
申请人： Donald T. Moir , Daniel Aiello , Norton P. Peet , John D. Williams , Matthew Torhan
发明人： Donald T. Moir , Daniel Aiello , Norton P. Peet , John D. Williams , Matthew Torhan
IPC分类号： C07D491/056 , A61K31/36 , C07D405/12 , A61K45/06 , C07C235/34 , A61K31/165 , A61K31/4355 , C07D317/50 , A61K31/443
CPC分类号： C07D491/056 , A61K31/165 , A61K31/36 , A61K31/381 , A61K31/4355 , A61K31/443 , A61K31/53 , A61K45/06 , C07C235/34 , C07D317/50 , C07D405/12 , Y02A50/473 , Y02A50/475 , Y02A50/481
摘要： Organic compounds showing the ability to inhibit effector toxin secretion or translocation mediated by bacterial type III secretion systems are disclosed. The disclosed type III secretion system inhibitor compounds are useful for combating infections by Gram-negative bacteria such as Salmonella spp., Shigella flexneri, Psendomonas spp., Yersinia spp., en tero pathogenic and enteroinvasive Escherichia coli, and Chlamydia spp. having such type III secretion systems.
摘要翻译：公开了显示抑制由细菌III型分泌系统介导的效应物毒素分泌或易位的能力的有机化合物。公开的III型分泌系统抑制剂化合物可用于抵抗革兰氏阴性细菌如沙门氏菌属，志贺氏菌属（Psigomonas spp。），耶尔森菌属（Yersinia spp。），肠道致病性和肠内侵袭性大肠杆菌以及衣原体属（Chlamydia spp）的感染。具有这种III型分泌系统。

9. 发明申请

US20130331456A1 INHIBITORS OF VIRAL ENTRY INTO MAMMALIAN CELLS 有权
标题翻译：病毒进入马马里亚细胞的抑制剂
公开(公告)号：US20130331456A1
公开(公告)日：2013-12-12
申请号：US13821682
申请日：2011-09-13
申请人： Arnab Basu , Debra M. Mills , John D. Williams , Bing Li , Norton P. Peet , Terry L. Bowlin
发明人： Arnab Basu , Debra M. Mills , John D. Williams , Bing Li , Norton P. Peet , Terry L. Bowlin
IPC分类号： C07C311/44
CPC分类号： C07C311/44 , A61K31/18
摘要： The present invention is related to the development of compounds and methods for inhibiting viral infection in a mammal. A pseudotype virus was developed for use in a high throughput assay for identifying nonpeptidic small molecule inhibitors that prevent viral entry into a host cell.
摘要翻译：本发明涉及抑制哺乳动物中病毒感染的化合物和方法的开发。开发了一种假型病毒用于高通量测定，用于鉴定预防病毒进入宿主细胞的非肽小分子抑制剂。

10. 发明授权

US5924277A Ion thruster with long-lifetime ion-optics system 失效
标题翻译：离子推进器具有长寿命离子光学系统
公开(公告)号：US5924277A
公开(公告)日：1999-07-20
申请号：US767920
申请日：1996-12-17
申请人： John R. Beattie , John D. Williams , Jesse N. Matossian
发明人： John R. Beattie , John D. Williams , Jesse N. Matossian
IPC分类号： B64G1/24 , F03H1/00 , H05H1/00
CPC分类号： F03H1/0043
摘要： Ion erosion of grids is reduced in an ion thruster with a multiple-grid ion-optics system. The thruster has an array of aperture sets in which aperture areas change in a perimeter region of the array. In one ion-optics system embodiment, a screen aperture area is reduced and a decelerator aperture area is increased in aperture sets that are proximate to the perimeter of the array. Prototype tests of this embodiment have illustrated significant reduction of ion erosion.
摘要翻译：使用多栅离子光学系统的离子推进器减小了栅格的离子侵蚀。推进器具有一组孔径组，其中孔径区域在阵列的周边区域中变化。在一个离子光学系统实施例中，屏幕孔径面积减小，并且靠近阵列周边的孔径组中的减速器孔径面积增加。该实施例的原型测试表明离子侵蚀显着减少。

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