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1. 发明授权

US06916181B2 Remountable connector for land grid array packages 有权
标题翻译：用于焊盘阵列封装的可重新连接器
公开(公告)号：US06916181B2
公开(公告)日：2005-07-12
申请号：US10460501
申请日：2003-06-11
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
IPC分类号： H01L23/32 , H01L23/48 , H01R12/04 , H01R13/03 , H01R13/24 , H01R43/00 , H01R43/20 , H05K3/32 , H05K3/40 , H05K7/10 , H05K1/00
CPC分类号： H01L24/72 , H01L23/32 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2492 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.
摘要翻译：用于电连接到焊盘栅极阵列的焊盘的连接器包括包括相对的第一和第二表面的介电层以及形成在介电层的第一表面上的多个接触元件。每个接触元件包括导电材料的基部和与基部一体形成的导电材料的弹性部分。弹性部分从基部延伸并突出在电介质层的第一表面之上。多个接触元件的每个弹性部分弹性地接合焊盘栅格阵列的相应焊盘，以提供与焊盘栅格阵列的电连接。特别地，每个弹性部分具有接触元件的电路长度的顺序的弹性工作范围。

2. 发明授权

US06869290B2 Circuitized connector for land grid array 有权
标题翻译：电路连接器用于焊盘阵列
公开(公告)号：US06869290B2
公开(公告)日：2005-03-22
申请号：US10854437
申请日：2004-05-26
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao , Hassan O. Ali
IPC分类号： H01L23/32 , H01L23/48 , H01R12/04 , H01R13/03 , H01R13/24 , H01R43/00 , H01R43/20 , H05K3/32 , H05K3/40 , H05K7/10 , H01R12/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2457 , H01R43/007 , H01R43/205 , H05K3/326 , H05K7/1069 , H01L2924/00
摘要： A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.
摘要翻译：用于电连接到形成在电子部件上的焊盘栅格阵列的焊盘的连接器包括包括相对的第一和第二表面的电介质层和在电介质层的第一表面之上延伸的多个接触元件。每个接触元件包括设置成接合焊盘栅格阵列的相应焊盘的导电部分，用于提供与焊盘栅格阵列的电连接。连接器还包括形成在电介质层上或内部的电路。电路电连接到多个接触元件中的至少一个。在一个实施例中，电路包括诸如去耦电容器的电气部件。在另一个实施例中，电路操作以将两个接触元件连接在一起。例如，连接到地电位的接触元件可以通过电路连接在一起。

3. 发明授权

US07070419B2 Land grid array connector including heterogeneous contact elements 有权
标题翻译：地面阵列连接器包括异质接触元件
公开(公告)号：US07070419B2
公开(公告)日：2006-07-04
申请号：US10854600
申请日：2004-05-26
申请人： Dirk D. Brown , John D. Williams , Hongjun Yao
发明人： Dirk D. Brown , John D. Williams , Hongjun Yao
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , H01L23/32 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2457 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.
摘要翻译：用于电连接到形成在电子部件上的焊盘栅格阵列的焊盘的电连接器包括包括相对的第一和第二表面的电介质层和在电介质层的第一表面上方延伸的多个接触元件。每个接触元件包括设置成接合焊盘栅格阵列的相应焊盘的导电部分，用于提供与焊盘栅格阵列的电连接。特别地，多个接触元件包括第一接触元件和第二接触元件，由此第一接触元件具有与第二接触元件的操作性能不同的操作特性。在一个实施例中，操作属性包括机械或电气特性。例如，第一接触元件可以具有比第二接触元件更大的弹性。

4. 发明授权

US07244125B2 Connector for making electrical contact at semiconductor scales 有权
标题翻译：用于在半导体尺度进行电接触的连接器
公开(公告)号：US07244125B2
公开(公告)日：2007-07-17
申请号：US10731669
申请日：2003-12-08
申请人： Dirk D. Brown , John D. Williams , Eric M. Radza
发明人： Dirk D. Brown , John D. Williams , Eric M. Radza
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , G01R1/0416 , G01R3/00 , H01L23/32 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R13/2442 , H01R43/007 , H01R43/205 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
摘要翻译：用于电连接到形成在半导体器件上的焊盘的连接器包括衬底和形成在衬底上的导电材料的接触元件阵列。每个接触元件包括附接到基底的顶表面的基部和从基部延伸并具有突出在基底上方的远端的弯曲弹簧部分。弯曲的弹簧部分被形成为远离接触平面弯曲并且具有设置成在接合半导体器件的相应焊盘时提供受控的擦拭动作的曲率。

5. 发明授权

US07113408B2 Contact grid array formed on a printed circuit board 有权
标题翻译：在印刷电路板上形成的接触栅格阵列
公开(公告)号：US07113408B2
公开(公告)日：2006-09-26
申请号：US10460497
申请日：2003-06-11
申请人： Dirk D. Brown , John D. Williams
发明人： Dirk D. Brown , John D. Williams
IPC分类号： H01R9/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L2224/05001 , H01L2224/05022 , H01L2224/051 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R13/03 , H01R13/2407 , H01R43/007 , H01R43/205 , H05K3/326 , H05K7/1069 , H01L2924/00 , H01L2924/00014
摘要： A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.
摘要翻译：印刷电路板包括电介质层和在电介质层的第一表面之上延伸的接触元件的区域阵列。每个接触元件包括导电部分，其布置成接合焊盘栅格阵列模块的相应焊盘，用于提供与焊盘栅格阵列模块的电连接。地面栅格阵列模块可以包括平面栅格阵列封装或第二印刷电路板。在一个实施例中，接触元件选自包括金属弹簧，捆扎丝，聚合物中的金属和固体金属片的接触类型。在另一个实施例中，区域阵列中的接触元件包括导电材料的基部和与基部一体形成的导电材料的弹性部分，由此弹性部分从基部延伸并突出在电介质层的第一表面之上。

6. 发明授权

US07628617B2 Structure and process for a contact grid array formed in a circuitized substrate 有权
标题翻译：在电路化基板中形成的接触栅极阵列的结构和工艺
公开(公告)号：US07628617B2
公开(公告)日：2009-12-08
申请号：US11525755
申请日：2006-09-22
申请人： Dirk D. Brown , John D. Williams , William B. Long
发明人： Dirk D. Brown , John D. Williams , William B. Long
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H05K3/326 , H05K3/4015 , H05K3/4092 , H05K2201/0311 , H05K2201/0397 , H05K2201/10719 , H05K2201/10924 , H05K2201/10946
摘要： An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.
摘要翻译：弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

7. 发明授权

US06712620B1 Coaxial elastomeric connector system 有权
标题翻译：同轴弹性连接器系统
公开(公告)号：US06712620B1
公开(公告)日：2004-03-30
申请号：US10241945
申请日：2002-09-12
申请人： Che-Yu Li , Zhineng Fan , Dirk D. Brown
发明人： Che-Yu Li , Zhineng Fan , Dirk D. Brown
IPC分类号： H01R1200
CPC分类号： H01R12/714 , H01R13/22 , H01R13/2414 , H01R24/562 , H01R2107/00 , Y10T29/49194 , Y10T29/49222 , Y10T29/49798
摘要： A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.
摘要翻译：提供了一种板对板连接器系统，其可以与包括布置在阵列中的多个触点的柔性电路，插入件或聚合物壳体一起使用。多个触点中的每一个包括弹性体。提供第一导体，其包括形成为螺旋的至少一个线，所述螺纹连续延伸穿过弹性体，并且具有可电接触的第一和第二端。第一导体电连接到印刷线路板等上的多个信号导体迹线中的至少一个。提供第二导体，其包括形成为螺旋的至少一个线，所述螺纹连续延伸穿过弹性体，并且具有可电接触的第一和第二端。第一导体和第二导体彼此间隔开，并且第二导体电连接到布置在印刷线路板上的多个接地路径导体中的至少一个。

8. 发明授权

US06306732B1 Method and apparatus for simultaneously improving the electromigration reliability and resistance of damascene vias using a controlled diffusivity barrier 有权
标题翻译：使用受控扩散屏障同时提高大马士革过孔的电迁移可靠性和电阻的方法和装置
公开(公告)号：US06306732B1
公开(公告)日：2001-10-23
申请号：US09168689
申请日：1998-10-09
申请人： Dirk D. Brown
发明人： Dirk D. Brown
IPC分类号： H01L21326
CPC分类号： H01L21/76862 , H01L21/7681 , H01L21/76843 , H01L21/76877 , Y10S438/927
摘要： An apparatus for improving electromigration reliability and resistance of a single- or dual-damascene via includes an imperfect barrier formed at the bottom of the via, and a stronger barrier formed at all other portions of the via. The imperfect barrier allows for metal atoms, such as copper atoms, to flow therethrough when the electromigration force pushes the metal atoms against the barrier. That way, the metal atoms that are pushed away from the downstream side of the barrier are replaced by metal atoms that flow through the barrier from the upstream side of the barrier. The imperfect barrier may be formed by biasing a wafer, and having the atoms resputter from the bottom of the via and adhere to the sidewalls of the via. The imperfect barrier may also be formed by a two-layered barrier, where a first layer corresponds to a good step coverage, poor barrier, and where the second barrier corresponds to a poor step coverage, good barrier. The imperfect barrier may also be formed by depositing the barrier conformally, and providing a directional etch to the portions of the barrier that are deposited to the bottom of the via.
摘要翻译：用于提高单 - 或双 - 大马士革通路的电迁移可靠性和电阻的装置包括形成在通孔底部的不完美屏障和在通孔的所有其它部分处形成的更强的阻挡层。当电迁移力推动金属原子抵靠屏障时，不完美的屏障允许诸如铜原子的金属原子流过其中。这样，被从壁垒的下游侧推开的金属原子被从阻挡层的上游侧流过障壁的金属原子代替。不完美的屏障可以通过偏置晶片并且使原子从通孔的底部重新注入并粘附到通孔的侧壁来形成。不完美的屏障还可以由两层屏障形成，其中第一层对应于良好的台阶覆盖，差的屏障，以及第二屏障对应于差的台阶覆盖，良好屏障的位置。不完美的屏障还可以通过保守地沉积屏障形成，并且向屏蔽层的沉积到通孔底部的部分提供定向蚀刻。

9. 发明授权

US06712621B2 Thermally enhanced interposer and method 有权
标题翻译：热增强插入器和方法
公开(公告)号：US06712621B2
公开(公告)日：2004-03-30
申请号：US10055771
申请日：2002-01-23
申请人： Che-Yu Li , Zhineng Fan , Dirk D. Brown
发明人： Che-Yu Li , Zhineng Fan , Dirk D. Brown
IPC分类号： H01R1200
CPC分类号： H01L23/3677 , H01L23/367 , H01L2924/0002 , H01L2924/3011 , H01R12/523 , H05K1/141 , H05K3/4641 , H05K7/1061 , H01L2924/00
摘要： The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.
摘要翻译：本发明提供一种适用于电子部件的散热连接器，包括使用焊盘网格阵列和引脚格栅阵列的散热连接器及其使用方法。本发明的连接器包括至少一个介电层和至少一个导热层。

10. 发明授权

US06661690B2 High capacity memory module with built-in performance enhancing features 有权
标题翻译：高容量内存模块，具有内置的性能增强功能
公开(公告)号：US06661690B2
公开(公告)日：2003-12-09
申请号：US10077057
申请日：2002-02-19
申请人： Sharon L. Moriarty , Zineng Fan , Dirk D. Brown , Che-Yu Li
发明人： Sharon L. Moriarty , Zineng Fan , Dirk D. Brown , Che-Yu Li
IPC分类号： G11C526
CPC分类号： H05K1/0246 , G11C5/04 , G11C5/063 , G11C2207/105 , H05K1/0231 , H05K1/0262 , H05K3/222 , H05K2201/10022
摘要： A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.
摘要翻译：具有驱动器线路终端器，电源电路和与直接安装在存储器模块上用于与高速阻抗控制的存储器总线一起使用的存储器控制子系统的组件的存储器模块。存储器模块可以形成在传统的印刷电路卡上，其具有直接连接到存储器模块的未包装或打包的存储器芯片。在内存模块中直接添加附加功能可提高EMC / EMI性能以及信号质量和完整性，从而提高内存子系统的性能。这样的设计也可以消除对总线出口连接的需要，从而允许自由连接容量用于解决模块上的附加存储器容量。另一个实施例具有具有附加特征但没有存储器件的模块。

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