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1. 发明申请

US20080295773A1 SUBSTRATE SUPPORT, SUBSTRATE PROCESSING DEVICE AND METHOD OF PLACING A SUBSTRATE 有权
标题翻译：基板支撑，基板处理装置和放置基板的方法
公开(公告)号：US20080295773A1
公开(公告)日：2008-12-04
申请号：US12108320
申请日：2008-04-23
申请人： Dieter Haas , Thomas Berger , Simon Lau
发明人： Dieter Haas , Thomas Berger , Simon Lau
IPC分类号： C23C16/54
CPC分类号： H01L21/68714 , H01L21/68 , Y10T29/49998
摘要： A substrate support for supporting a substrate in a processing chamber comprises a frame for carrying the substrate, at least a first fastening means fixedly attached to the frame for aligning the substrate relative to the frame, and at least a second fastening means movably attached to the frame, the second fastening means being movable relative to the frame and/or the substrate. Furthermore, a processing device comprises an edge exclusion projecting over a portion of the surface of the substrate in order to prevent processing of the portion of the surface of the substrate. A part of the edge exclusion may be moved into a gap between the edge(s) of the substrate and the frame element of the substrate support to form a labyrinth seal between the frame element and the edge of the substrate. A method of placing the substrate on the substrate support is also disclosed.
摘要翻译：用于在处理室中支撑衬底的衬底支撑件包括用于承载衬底的框架，至少一个固定地连接到框架上用于使衬底相对于框架对准的第一紧固装置，以及至少一个第二紧固装置，第二紧固装置可相对于框架和/或基板移动。此外，处理装置包括在衬底表面的一部分上突出的边缘排除，以防止衬底的表面部分的处理。边缘排除的一部分可以移动到基板的边缘和基板支撑件的框架元件之间的间隙中，以在框架元件和基板的边缘之间形成迷宫式密封。还公开了将衬底放置在衬底支撑件上的方法。

2. 发明授权

US08323412B2 Substrate support, substrate processing device and method of placing a substrate 有权
标题翻译：基板支撑，基板处理装置和放置基板的方法
公开(公告)号：US08323412B2
公开(公告)日：2012-12-04
申请号：US12108320
申请日：2008-04-23
申请人： Dieter Haas , Thomas Berger , Simon Lau
发明人： Dieter Haas , Thomas Berger , Simon Lau
IPC分类号： C23C16/00 , B05C13/00
CPC分类号： H01L21/68714 , H01L21/68 , Y10T29/49998
摘要： A substrate support for supporting a substrate in a processing chamber comprises a frame for carrying the substrate, at least a first fastening means fixedly attached to the frame for aligning the substrate relative to the frame, and at least a second fastening means movably attached to the frame, the second fastening means being movable relative to the frame and/or the substrate. Furthermore, a processing device comprises an edge exclusion projecting over a portion of the surface of the substrate in order to prevent processing of the portion of the surface of the substrate. A part of the edge exclusion may be moved into a gap between the edge(s) of the substrate and the frame element of the substrate support to form a labyrinth seal between the frame element and the edge of the substrate. A method of placing the substrate on the substrate support is also disclosed.
摘要翻译：用于在处理室中支撑衬底的衬底支撑件包括用于承载衬底的框架，至少一个固定地连接到框架上用于使衬底相对于框架对准的第一紧固装置，以及至少一个第二紧固装置，第二紧固装置可相对于框架和/或基板移动。此外，处理装置包括在衬底表面的一部分上突出的边缘排除，以防止衬底的表面部分的处理。边缘排除的一部分可以移动到基板的边缘和基板支撑件的框架元件之间的间隙中，以在框架元件和基板的边缘之间形成迷宫式密封。还公开了将衬底放置在衬底支撑件上的方法。

3. 发明授权

US09293706B2 Method for encapsulating an organic light emitting diode 有权
标题翻译：封装有机发光二极管的方法
公开(公告)号：US09293706B2
公开(公告)日：2016-03-22
申请号：US13366109
申请日：2012-02-03
申请人： Dieter Haas , John M. White , Byung-sung Leo Kwak , Soo Young Choi , Jrjyan Jerry Chen , Jose Manuel Dieguez-Campo
发明人： Dieter Haas , John M. White , Byung-sung Leo Kwak , Soo Young Choi , Jrjyan Jerry Chen , Jose Manuel Dieguez-Campo
IPC分类号： H01L33/52 , H01L51/00 , H01L51/52
CPC分类号： H01L51/0014 , H01L51/5253
摘要： Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.
摘要翻译：提供了使用软/聚合物掩模技术封装设置在基板上的OLED结构的方法。与常规的硬掩模图案化技术相比，软/聚合物掩模技术可以有效地提供简单且低成本的OLED封装方法。软/聚合物掩模技术可以利用单个聚合物掩模以低成本完成整个封装工艺，并且在使用常规金属掩模时不存在对准问题。不是使用软/聚合物掩模，而是可以将封装层消隐沉积，然后激光烧蚀，使得在封装过程中不使用掩模。

4. 发明申请

US20130074771A1 APPARATUS FOR FORMING ENERGY STORAGE AND PHOTOVOLTAIC DEVICES IN A LINEAR SYSTEM 审中-公开
标题翻译：在线性系统中形成能量储存和光伏器件的设备
公开(公告)号：US20130074771A1
公开(公告)日：2013-03-28
申请号：US13682479
申请日：2012-11-20
申请人： VICTOR L. PUSHPARAJ , Pravin K. Narwankar , Dieter Haas , Bipin Thakur , Mahesh Arcot , Vikas Gujar , Omkaram Nalamasu
发明人： VICTOR L. PUSHPARAJ , Pravin K. Narwankar , Dieter Haas , Bipin Thakur , Mahesh Arcot , Vikas Gujar , Omkaram Nalamasu
IPC分类号： C23C16/54
CPC分类号： C23C16/545 , B82Y10/00 , B82Y40/00 , H01L31/035227 , H01L31/075 , H01L31/1876 , H01L31/206 , H01L51/0048 , H01L51/4213 , Y02E10/548 , Y02E10/549 , Y02P70/521
摘要： A method and apparatus are provided for formation of a composite material on a substrate. The composite material includes carbon nanotubes and/or nanofibers, and composite intrinsic and doped silicon structures. In one embodiment, the substrates are in the form of an elongated sheet or web of material, and the apparatus includes supply and take-up rolls to support the web prior to and after formation of the composite materials. The web is guided through various processing chambers to form the composite materials. In another embodiment, the large scale substrates comprise discrete substrates. The discrete substrates are supported on a conveyor system or, alternatively, are handled by robots that route the substrates through the processing chambers to form the composite materials on the substrates. The composite materials are useful in the formation of energy storage devices and/or photovoltaic devices.
摘要翻译：提供了一种用于在基底上形成复合材料的方法和装置。复合材料包括碳纳米管和/或纳米纤维，以及复合本征和掺杂硅结构。在一个实施方案中，基材为细长片或材料网的形式，并且该装置包括在形成复合材料之前和之后的供应和卷取辊以支撑幅材。纤维网被引导通过各种处理室以形成复合材料。在另一个实施例中，大规模衬底包括离散衬底。离散的衬底被支撑在输送系统上，或者由机器人来处理，该机器人将衬底通过处理室，以在衬底上形成复合材料。复合材料可用于形成储能装置和/或光伏器件。

5. 发明授权

US08117987B2 Hot wire chemical vapor deposition (CVD) inline coating tool 有权
标题翻译：热线化学气相沉积（CVD）在线涂层工具
公开(公告)号：US08117987B2
公开(公告)日：2012-02-21
申请号：US12873299
申请日：2010-08-31
申请人： Dieter Haas , Pravin K. Narwankar , Randhir P. S. Thakur
发明人： Dieter Haas , Pravin K. Narwankar , Randhir P. S. Thakur
IPC分类号： A61D3/00
CPC分类号： C23C16/24 , C23C16/54 , H01L21/02532 , H01L21/0262
摘要： Methods and apparatus for hot wire chemical vapor deposition (HWCVD) are provided herein. In some embodiments, an inline HWCVD tool may include a linear conveyor for moving a substrate through the linear process tool; and a multiplicity of HWCVD sources, the multiplicity of HWCVD sources being positioned parallel to and spaced apart from the linear conveyor and configured to deposit material on the surface of the substrate as the substrate moves along the linear conveyor; wherein the substrate is coated by the multiplicity of HWCVD sources without breaking vacuum. In some embodiments, methods of coating substrates may include depositing a first material from an HWCVD source on a substrate moving through a first deposition chamber; moving the substrate from the first deposition chamber to a second deposition chamber; and depositing a second material from a second HWCVD source on the substrate moving through the second deposition chamber.
摘要翻译：本文提供了热线化学气相沉积（HWCVD）的方法和装置。在一些实施例中，在线HWCVD工具可以包括用于通过线性处理工具移动衬底的线性输送机; 和多个HWCVD源，多个HWCVD源被定位成与线性传送器平行并与其间隔开，并且被配置为当衬底沿着线性传送器移动时将材料沉积在衬底的表面上; 其中所述基底被多个HWCVD源涂覆而不破坏真空。在一些实施例中，涂覆基底的方法可以包括在移动通过第一沉积室的基底上沉积来自HWCVD源的第一材料; 将衬底从第一沉积室移动到第二沉积室; 以及将第二材料从第二HWCVD源沉积在移动通过第二沉积室的衬底上。

6. 发明授权

US08012260B2 Apparatus and method for coating an areal substrate 有权
标题翻译：用于涂覆面状基材的装置和方法
公开(公告)号：US08012260B2
公开(公告)日：2011-09-06
申请号：US10164337
申请日：2002-06-06
申请人： Uwe Hoffmann , Jutta Trube , Dieter Haas
发明人： Uwe Hoffmann , Jutta Trube , Dieter Haas
IPC分类号： C23C16/00
CPC分类号： C23C14/24 , C23C14/12
摘要： An apparatus for coating an areal substrate, for example a rectangular plate comprises a vaporizer source and a distributor system for the supply of vaporized material onto the substrate. The distributor system comprises a line source, with this line source and the substrate is movable relative to one another. The apparatus serves preferably for the production of flat screens with organic light-emitting diodes.
摘要翻译：用于涂覆面状基底（例如矩形板）的装置包括蒸发器源和用于将气化材料供应到基底上的分配器系统。分配器系统包括线源，该线源和衬底可相对于彼此移动。该装置优选用于生产具有有机发光二极管的平面屏幕。

7. 发明授权

US07972486B2 Machine for coating a substrate, and module 有权
标题翻译：用于涂覆基材的机器和模块
公开(公告)号：US07972486B2
公开(公告)日：2011-07-05
申请号：US11279047
申请日：2006-04-07
申请人： Hans Buchberger , Andreas Geiss , Jörg Krempel-Hesse , Dieter Haas
发明人： Hans Buchberger , Andreas Geiss , Jörg Krempel-Hesse , Dieter Haas
IPC分类号： C23C14/34
CPC分类号： C23C14/56 , H01J37/32431 , H01J37/32458
摘要： A machine for coating a transparent substrate for the production of display screens comprises a coating chamber that has a modular design. Each of the modules 1 features a chamber section 2, a first support 3 that is arranged removably in or at the chamber section 2, and a second support 4 that is arranged removably at the first support 3. Whereas the first support 3 bears the cathodes, the second support 4 is formed as a cover at which are arranged the pumps for producing a vacuum in the coating chamber. Carriers 3 and 4 can be removed laterally from the chamber section 2 to such an extent that areas 11a, 11b accessible to persons can be formed between the module components. In this way, the components of the machine are readily accessible, for example for maintenance purposes. Work can be done simultaneously on the cathodes and in the chamber interior.
摘要翻译：用于涂覆用于生产显示屏的透明基板的机器包括具有模块化设计的涂布室。每个模块1具有腔室部分2，可移除地布置在腔室部分2中或在腔室部分2中的第一支撑件3，以及可移除地布置在第一支撑件3处的第二支撑件4.而第一支撑件3承载阴极，第二支撑件4形成为盖，在该盖处布置有用于在涂覆室中产生真空的泵。载体3和4可以从腔室部分2侧向移除到可以在模块部件之间形成人员可接近的区域11a，11b。以这种方式，机器的组件容易接近，例如用于维护目的。可以在阴极和室内同时进行工作。

8. 发明申请

US20110126402A1 METHODS OF AND FACTORIES FOR THIN-FILM BATTERY MANUFACTURING 有权
标题翻译：薄膜电池制造方法与工艺
公开(公告)号：US20110126402A1
公开(公告)日：2011-06-02
申请号：US12882002
申请日：2010-09-14
申请人： Byung-Sung Kwak , Stefan Bangert , Dieter Haas , Omkaram Nalamasu
发明人： Byung-Sung Kwak , Stefan Bangert , Dieter Haas , Omkaram Nalamasu
IPC分类号： B23P19/00 , C23C16/44
CPC分类号： H01M10/0404 , H01M4/621 , H01M6/40 , H01M10/052 , H01M10/0585 , Y02E60/122 , Y02P70/54 , Y10T29/52
摘要： Methods of and factories for thin-film battery manufacturing are described. A method includes operations for fabricating a thin-film battery. A factory includes one or more tool sets for fabricating a thin-film battery.
摘要翻译：描述了薄膜电池制造的方法和工厂。一种方法包括制造薄膜电池的操作。工厂包括用于制造薄膜电池的一个或多个工具组。

9. 发明申请

US20080296352A1 BONDING METHOD FOR CYLINDRICAL TARGET 审中-公开
标题翻译：圆柱体接合方法
公开(公告)号：US20080296352A1
公开(公告)日：2008-12-04
申请号：US11755579
申请日：2007-05-30
申请人： AKIHIRO HOSOKAWA , Dieter Haas
发明人： AKIHIRO HOSOKAWA , Dieter Haas
IPC分类号： B23K31/00 , B23K37/00
CPC分类号： C23C14/3407 , H01J37/3423 , H01J37/3435 , H01J37/3491
摘要： The present invention generally comprises a method and apparatus for bonding a cylindrical sputtering target to a backing tube. The cylindrical sputtering target may be disposed over the outside surface of the backing tube and melted bonding material may be vacuum pulled through the gap formed between the sputtering target and the backing tube. By vacuum pulling the melted bonding material through the gap, the amount of air bubbles or pockets present within the bonding material between the sputtering target and the backing tube may be reduced.
摘要翻译：本发明通常包括用于将圆柱形溅射靶接合到背衬管的方法和装置。圆柱形溅射靶可以设置在背衬管的外表面上，并且熔化的粘合材料可以被真空拉动通过形成在溅射靶和背衬管之间的间隙。通过将熔融的粘接材料真空地吸引通过间隙，可以减少存在于溅射靶和背衬管之间的接合材料内的气泡或凹穴的量。

10. 发明授权

US4075591A Printed circuit coils 失效
标题翻译：印刷电路线圈
公开(公告)号：US4075591A
公开(公告)日：1978-02-21
申请号：US763852
申请日：1977-01-31
申请人： Dieter Haas
发明人： Dieter Haas
IPC分类号： H01F27/28 , H05K1/16
CPC分类号： H01F27/2804 , H05K1/165
摘要： The conducting path width of a spiral printed circuit coil is reduced for the inside of the spiral coil to obtain more inductance in the same space without substantial sacrifice in Q. In another form of spiral coil with non-constant path width, the path width is reduced in a sector of the coil located between the inner and outer terminals to reduce the distance between terminals with minimum sacrifice in inductance or Q.

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