专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007238993A Electroless nickel plating method 有权
标题翻译：电镀镍镀层法
公开(公告)号：JP2007238993A
公开(公告)日：2007-09-20
申请号：JP2006061087
申请日：2006-03-07
申请人： Denso Corp , Kawai:Kk , Nippon Kanizen Kk , 日本カニゼン株式会社 , 株式会社カワイ , 株式会社デンソー
发明人： IMAIZUMI NORIHISA , HANDA NORIMASA , SANADA SUKENORI , KAWAI NOBUHIRO , EDAKAWA MITSUHARU , FUJISAKI NAOTO , ISHIGAMI KENJI , TOMEDA SHIGENARI , TOUMON TAKASHI
IPC分类号： C23C18/34
摘要： PROBLEM TO BE SOLVED: To improve the plating rate in an electroless nickel plating method using hydrazine as a reducing agent.
SOLUTION: An electroless nickel plated film is formed on an object 20 to be plated by using an electroless nickel plating solution containing nickel ion and hydrazine as a reducing agent and having pH in a weak basic region and then adding a negative electric potential of the hybrid electric potential inherent in a plating bath 100 to the object 20 in the plating bath 100.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高使用肼作为还原剂的化学镀镍方法中的电镀速率。解决方案：通过使用含有镍离子和肼作为还原剂并且具有弱碱性区域的pH然后添加负电位的化学镀镍溶液在待镀物体20上形成化学镀镍膜在电镀浴100中的电镀浴100中固有的混合电位到对象20。版权所有：（C）2007，JPO＆INPIT

2. 发明专利

JP2014090136A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2014090136A
公开(公告)日：2014-05-15
申请号：JP2012240457
申请日：2012-10-31
申请人： Sanken Electric Co Ltd , サンケン電気株式会社 , Denso Corp , 株式会社デンソー
发明人： YOSHIZAKI SHIGEO , TANAKA ATSUHIKO , HANDA NORIMASA , SAKAI KOHEI , ASAI YASUTOMI
IPC分类号： H01L23/28 , H01L21/56 , H01L23/373 , H01L23/48
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which prevents detachment of an adhesive layer with a lead frame caused by an internal stress.SOLUTION: A semiconductor device 10 comprises: a metal substrate 12; an electrically insulating lower layer resin 15s which lies on the metal substrate 12 and which is thermally cured; an upper layer resin 16s which lies on the lower layer resin 15s and which is thermally cured; a lead frame 18 provided on the upper layer resin 16s; a semiconductor element 22 arranged on the lead frame 18; and an encapsulation resin 24 for encapsulating the metal substrate 12, the lower layer resin 15s, the upper layer resin 16s, the lead frame 18 and the semiconductor element 22. After completion of a thermosetting reaction of the lower layer resin 15s, a thermosetting reaction of the upper layer resin 16s is completed during a formation process of the encapsulation resin 24.
摘要翻译：要解决的问题：提供一种半导体器件及其制造方法，其防止由内部应力引起的引线框架的粘合剂层的剥离。解决方案：半导体器件10包括：金属基板12; 位于金属基板12上并被热固化的电绝缘下层树脂15s; 位于下层树脂15s上并被热固化的上层树脂16s; 设置在上层树脂16s上的引线框架18; 布置在引线框架18上的半导体元件22; 以及用于封装金属基板12，下层树脂15s，上层树脂16s，引线框18和半导体元件22的封装树脂24.在下层树脂15s的热固化反应完成后，在封装树脂24的形成过程中完成上层树脂16s。

3. 发明专利

JP2011091308A Printed wiring board 有权
标题翻译：印刷线路板
公开(公告)号：JP2011091308A
公开(公告)日：2011-05-06
申请号：JP2009245419
申请日：2009-10-26
申请人： Denso Corp , 株式会社デンソー
发明人： UCHIBORI SHINYA , HANDA NORIMASA , SANADA SUKENORI
IPC分类号： H05K1/02 , H05K3/22 , H05K3/46
CPC分类号： H05K3/4644 , H05K1/0265 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0347 , H05K2201/0959 , H05K2201/09736 , H05K2201/09881 , H05K2203/025 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To prevent increase in substrate thickness, as much as possible, while making it possible to form each of first and second wirings of different thickness in one-time patterning on a wiring substrate having wirings of different thickness on one surface of a wiring formation layer. SOLUTION: A first wiring 30 is arranged on one surface of a wiring formation layer 10; a resin film 70 made of resin with electrical insulation property is arranged at a site other than the first wiring 30 on one surface of the wiring formation layer 10; the surface of the resin film 70 and the surface of the first wiring 30 are positioned on the same plane; and a second wiring 31 as a wiring thinner than the first wiring 30 is formed on the surface of the resin film 70. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题为了尽可能地防止基板厚度的增加，同时可以在具有不同厚度的布线的布线基板上一次构图中形成不同厚度的第一和第二布线中的每一个，布线形成层的一个表面。解决方案：第一布线30布置在布线形成层10的一个表面上; 在布线形成层10的一个表面上的除了第一布线30以外的部位设置由具有电绝缘性的树脂制成的树脂膜70; 树脂膜70的表面和第一布线30的表面位于同一平面上; 并且在树脂膜70的表面上形成作为比第一布线30薄的布线的第二布线31.权利要求：（C）2011，JPO＆INPIT

4. 发明专利

JP2011009257A Method of manufacturing electronic device 有权
标题翻译：制造电子器件的方法
公开(公告)号：JP2011009257A
公开(公告)日：2011-01-13
申请号：JP2009148341
申请日：2009-06-23
申请人： Denso Corp , 株式会社デンソー
发明人： HANDA NORIMASA , HAYASAKA SHIN , IMAIZUMI NORIHISA
IPC分类号： H01L21/56 , H05K1/02 , H05K3/00
CPC分类号： H01L24/97 , H01L2224/48227 , H01L2224/49175 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To cut a plate material by covering an electronic component with a tape member while separating the electronic component from the tape member without forming a projection on one surface of the plate material serving as a substrate.SOLUTION: The plate material 100 having a plurality of substrate forming regions 110 on one surface is prepared, a first component 21 and a second component 22 higher than the first component 21 are mounted on each substrate forming region 110 as the electronic components, and then the tape member 200 is applied onto one surface of the plate material 100 to cover one surface of the plate material 100 and the electronic components 21, 22. In this applying step, the tape member 200 is applied to a cut part 120 of the plate material 100 and is applied to the second component 22 such that the second component 22 supports it to cover the first component 21 out of contact with the tape member 200. Then, the plate material 100 is cut from the other surface opposite to the surface covered with the tape member 200 into units of the respective substrate forming regions 110.
摘要翻译：要解决的问题：通过用带状部件覆盖电子部件，同时从带部件分离电子部件而不在用作基板的板材的一个表面上形成突起来切割板材。解决方案：板材100 在一个表面上制备多个基板形成区域110，将高于第一部件21的第一部件21和第二部件22作为电子部件安装在每个基板形成区域110上，然后施加带状部件200 在板材100的一个表面上覆盖板材100和电子部件21,22的一个表面。在该施加步骤中，将带状部件200施加到板材100的切割部分120上，并施加到第二部件22使得第二部件22支撑它以覆盖与带部件200不接触的第一部件21.然后，将板材100从O 与由带状构件200覆盖的表面相反的表面形成为各个基板形成区域110的单元。

5. 发明专利

JP2012125786A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2012125786A
公开(公告)日：2012-07-05
申请号：JP2010278318
申请日：2010-12-14
申请人： Denso Corp , 株式会社デンソー
发明人： ITO SHUICHI , HANDA NORIMASA , SUZUKI TOSHIO
IPC分类号： B23K1/14 , B23K1/00 , B23K101/40 , H01L21/52
CPC分类号： H01L24/32 , H01L2224/26175 , H01L2224/27013 , H01L2224/83385
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, in which a semiconductor element can be reliably solder-jointed to a member to be jointed.SOLUTION: In the semiconductor device, an annular groove 13 is formed in a joint surface 12 to which an IC element 20 is solder-jointed, of a lead frame 11 so as to prevent a solder 30 applied inward from outflowing outward. In the proximity of a center 13a in the annular groove 13 in the joint surface 12, a first surface state S1 and a second surface state S2 that are controlled so that wettabilities thereof with respect to the solder 30 are different from each other, are sectioned radially outward from the center 13a.
摘要翻译：解决的问题：提供一种半导体器件，其中半导体元件可以可靠地焊接到待连接的元件上。解决方案：在半导体器件中，在引线框架11的焊接接头的接合表面12中形成环形槽13，以防止向内施加的焊料30向外流出。在接合表面12中的环形槽13中的中心13a附近，被控制使得其相对于焊料30的润湿性彼此不同的第一表面状态S1和第二表面状态S2被分割从中心13a径向向外。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012043882A Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2012043882A
公开(公告)日：2012-03-01
申请号：JP2010182200
申请日：2010-08-17
申请人： Denso Corp , 株式会社デンソー
发明人： HAYASAKA SHIN , HANDA NORIMASA , SUZUKI TOSHIO
IPC分类号： H01L23/50 , H01L23/28
CPC分类号： H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can enhance bondability of a bonding wire for a lead frame without worsening the workability.SOLUTION: A lead frame 20 is formed so that the inner leads 22a-22c are coupled with other adjoining inner lead 22 via a coupling part 25, an aluminum wire 41 is connected electrically with the inner leads 22a-22c, and other bonding wire 40 is connected electrically with the other inner lead 22. A circuit board 11, each inner lead 22, and the like, are sealed by a mold member 30 so that the coupling part 25 is exposed from an opening 31 formed in the mold member 30, and the coupling part 25 exposed from the opening 31 is removed.
摘要翻译：解决的问题：提供一种制造半导体器件的方法，其可以增强引线框架的接合线的粘合性而不会恶化可加工性。解决方案：引线框架20形成为使得内引线22a-22c经由耦合部分25与其它相邻的内引线22连接，铝线41与内引线22a-22c电连接，其它接合线40与另一个内引线22电连接。电路板11，每个内引线22等由模具构件30密封，使得联接部25从形成在模具中的开口31露出从开口部31露出的连接部25被除去。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2007258205A Electronic device and its manufacturing method 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2007258205A
公开(公告)日：2007-10-04
申请号：JP2006076615
申请日：2006-03-20
申请人： Denso Corp , 株式会社デンソー
发明人： IMAIZUMI NORIHISA , HANDA NORIMASA , HOSHIMOTO AKINORI , YAMADA MASAO
IPC分类号： H01L23/50 , H01L25/00
CPC分类号： H01L2224/32245 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To secure resin adhesion, wire bondability, and connection reliability of a conductive joining member in an electronic device, in which a lead frame with an electronic element mounted is sealed with mold resin, an inner lead and the electronic element are joined via the conductive joining member and a bonding wire, and in addition an outer lead is welded to an external wiring member. SOLUTION: The lead frame 20 includes a base material 20a made of a Cu-based metal material, an Ni-P plating film 20b and an Ni plating film 20c with a rougher surface than that of the material 20a formed sequentially on the surface of the base material 20a. The surface of the lead frame 20 has a specific surface area of 1.2-1.8 and surface roughness Ra of 50-150 nm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了确保其中安装有电子元件的引线框用模具树脂密封的电子设备中的导电接合部件的树脂粘附性，引线接合性和连接可靠性，内引线和电子元件通过导电接合构件和接合线接合，此外外部引线焊接到外部配线构件。解决方案：引线框架20包括由Cu基金属材料制成的基材20a，Ni-P镀膜20b和Ni镀覆膜20c，其表面比依次形成的材料20a的表面粗糙基材20a的表面。引线框架20的表面的比表面积为1.2-1.8，表面粗糙度Ra为50-150nm。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006032635A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2006032635A
公开(公告)日：2006-02-02
申请号：JP2004209001
申请日：2004-07-15
申请人： Denso Corp , 株式会社デンソー
发明人： HANDA NORIMASA , ISHIKAWA TAKESHI , IMAIZUMI NORIHISA
IPC分类号： H01L23/50 , H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49 , H01L2224/49111 , H01L2224/49171 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device where a semiconductor element is mounted to a die pad, and a bonding wire is connected to the die pad, and they are sealed with mold resin for suppressing the progress of peeling to a wire connecting part on the die pad even when the peeling of the mold resin on the die pad is generated, and for lengthening the life of the wire. SOLUTION: This semiconductor device 100 is provided with a semiconductor element 20 and a die pad 11 to which the semiconductor element 20 is mounted. A bonding wire 40 is connected to the die pad 11, and the semiconductor 20, the die pad 11; and the bonding wire 40 are sealed with mold resin 50. The die pad 11 is provided with a U-shaped projector 11c extended from a root 11a to a direction away from the semiconductor element 20, and U-turned in the middle, whose tip 11b is extended to a direction toward the semiconductor element 20, and the bonding wire 40 is connected to the tip 11a of the projecting part 11c. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供将半导体元件安装到管芯焊盘的半导体器件，并且接合线连接到管芯焊盘，并且用模制树脂密封以抑制剥离的进行到即使产生模板上的模制树脂的剥离，并且延长线的寿命，也可以在芯片焊盘上连接线。解决方案：该半导体器件100设置有半导体元件20和安装半导体元件20的管芯焊盘11。接合线40连接到管芯焊盘11，半导体20，管芯焊盘11，并且接合线40用模制树脂50密封。芯片焊盘11设置有从根部11a延伸到远离半导体元件20的方向的U形投影仪11c，并且在中间U形转弯，其顶端 11b延伸到朝向半导体元件20的方向，并且接合线40连接到突出部11c的尖端11a。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2012222220A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2012222220A
公开(公告)日：2012-11-12
申请号：JP2011088016
申请日：2011-04-12
申请人： Denso Corp , 株式会社デンソー
发明人： HANDA NORIMASA
IPC分类号： H01L21/60 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/73265 , H01L2924/19105
摘要： PROBLEM TO BE SOLVED: To ensure connection of a lead frame and a substrate while suppressing separation of a lead frame and a mold resin, in an electronic device where an electronic component is mounted on a substrate via a lead frame, and the whole of the lead frame and the electronic component are resin molded.SOLUTION: In the whole lead frame 30 on the other side 32 projecting from an electronic component 20, the base metal composing the lead frame 30 is exposed to the surface and sealed with a mold resin 40. Between the other end 32 side of the lead frame 30 and a substrate 10, a conductive adhesive 50 containing a conductive filler 52 made from metal is interposed. When the conductive filler 52 fuses to the base metal, the other end 32 side of the lead frame 30 and a substrate 10 are fixed electrically and mechanically.
摘要翻译：要解决的问题：为了确保引线框和基板的连接，同时抑制引线框和模具树脂的分离，在电子部件中，电子部件经由引线框安装在基板上，并且整个引线框架和电子部件都是树脂模制的。解决方案：在从电子部件20突出的另一侧32的整个引线框架30中，构成引线框架30的基底金属暴露于表面并用模制树脂40密封。在另一端32侧引线框架30和基板10，插入包含由金属制成的导电填料52的导电粘合剂50。当导电填料52熔合到基体金属时，引线框架30的另一端32侧和基底10电气和机械固定。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2010098098A Method of manufacturing electronic apparatus 有权
标题翻译：制造电子装置的方法
公开(公告)号：JP2010098098A
公开(公告)日：2010-04-30
申请号：JP2008267233
申请日：2008-10-16
申请人： Denso Corp , 株式会社デンソー
发明人： HANDA NORIMASA
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2224/13 , H01L2224/13018 , H01L2224/13019 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic apparatus having one surface of an IC chip and one surface of a substrate bonded to each other by solder, which performs proper soldering without making solder into a special shape or mixing a flux component into solder and without using flux in the case of the existence of an oxide film. SOLUTION: A conductive post 11 which protrudes from one surface of an IC chip 10 and is provided in a sharp portion 12 having a sharp shape in a front end surface thereof is formed on a portion to be soldered of the one surface of the IC chip 10, and solder 30 is disposed on a portion to be soldered of one surface of a substrate 20, and next, the one surface of the IC chip 10 and the one surface of the substrate 20 are disposed so as to face each other, and the IC chip 10 is pressed to the substrate 20 to break through an oxide film located on the surface of solder 30 by the sharp portion 12 of the post 11, and in this state, the solder 30 is reflowed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造电子设备的方法，该电子设备具有IC芯片的一个表面和通过焊料彼此接合的基板的一个表面，其在不使焊料变成特殊形状或混合的情况下进行适当的焊接在存在氧化膜的情况下，焊剂中的助焊剂成分和不使用焊剂。解决方案：从IC芯片10的一个表面突出并设置在其前端表面具有尖锐形状的尖锐部分12中的导电柱11形成在待焊接的一个表面上的部分上 IC芯片10和焊料30设置在基板20的一个表面的要焊接的部分上，接下来，将IC芯片10的一个表面和基板20的一个表面设置成面对每个另外，IC芯片10被压到基板20上，以通过柱11的尖锐部分12穿过位于焊料30的表面上的氧化膜，在这种状态下，焊料30被回流。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式