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1. 发明专利

JP2004258525A Manufacturing method of plasma display panel 有权
公开(公告)号：JP2004258525A
公开(公告)日：2004-09-16
申请号：JP2003051550
申请日：2003-02-27
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KAMATA SHINYA , YAMASHITA MASAMI , NAKANO TATSUO , ANDO TOSHIHIRO
IPC分类号： G09F9/00 , G09F9/313 , H01J11/44 , H01J17/28
摘要： PROBLEM TO BE SOLVED: To improve adhesiveness of a panel to a heat conductive layer by forming the heat conductive layer with a cured composition of a high heat conductive curable resin, and to improve heat conductive performance to a heat radiation plate.
SOLUTION: This plasma display panel is composed of the panel and heat radiation plate. In this manufacturing method of the plasma display panel, a hollow part is provided between the panel and radiation plate, the curable resin composition, such as an acrylic resin composition containing a heat conductive filler B is injected into the hollow part and cured to be integrated, to manufacture the plasma display having the cured matter with a heat conductivity ≥0.3 (w/m K). Hardness of the cured matter is preferably in the range of 8-70.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004162026A Rapidly curable composition 有权
公开(公告)号：JP2004162026A
公开(公告)日：2004-06-10
申请号：JP2003275414
申请日：2003-07-16
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO , ANDO TOSHIHIRO
IPC分类号： C08F4/40 , C08F20/00
摘要： PROBLEM TO BE SOLVED: To obtain an acrylic curable composition improved in curing speed while maintaining various characteristics of the acrylic curable composition.
SOLUTION: This rapidly curable composition contains (A) a polymerizable acrylic liquid state composition, (B) cumene hydroperoxide, (C) a fatty acid cobalt, (D) a basic compound, and preferably, (D) the basic compound is calcium hydroxide, 1, 8-diazabicyclo[5,4,0]undecene-7 or calcium hydroxide and water.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2004134781A Method for manufacturing metal base circuit board 审中-公开
公开(公告)号：JP2004134781A
公开(公告)日：2004-04-30
申请号：JP2003323959
申请日：2003-09-17
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： OKAJIMA YOSHIHIKO , NAKANO TATSUO , OGATA YOICHI , NAKAJIMA MASAHIKO
IPC分类号： H05K3/44 , H05K3/00 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal base circuit board having superior reliability with high productivity, reducing losses during the circuit formation. SOLUTION: The method for manufacturing a metal base circuit board sequentially comprises: a step (1) for applying an insulating adhesive composition (a) on a metal foil (A) to be fed continuously, laminating a metal foil (B) to be fed continuously on a layer comprising the insulating adhesive composition (a), pressuring the metal foil (A), the insulating adhesive composition (a), and the metal foil (B) by a roll so as to bond together, and curing the insulating adhesive composition; and a step (2) for continuously or intermittently forming a circuit by the metal foil (A) and/or the metal foil (B) of the metal foil composite; a step (3) for integrating the metal foil composite formed circuit on a metal plate via an insulating material sheet or a conductive material sheet, and curing the insulating material sheet or the conductive material sheet so as to integrate. COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2003342314A Acrylic curable composition with blended short fiber 审中-公开
标题翻译：具有混合短纤维的丙烯酸可固化组合物
公开(公告)号：JP2003342314A
公开(公告)日：2003-12-03
申请号：JP2002153471
申请日：2002-05-28
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO , ANDO TOSHIHIRO
IPC分类号： E04G23/02 , C08F2/44 , C08F20/00
摘要： PROBLEM TO BE SOLVED: To provide a curable composition and a section restoring material with improved practical applicability by preventing sagging and drawbacks in trowelability of the section restoring material. SOLUTION: The curable composition comprises (A) a polymerizable acrylic liquid composition containing an organic peroxide, (B) a curing initiator generating a free radical by decomposition of the organic peroxide and (C) short fibers with 0.5-20 mm length and 50 μm or less diameter used for restoration of surface of concrete by mixing and spreading 100 pts.wt. (A)+(B) and 1-10 pts.wt. (C). The powder form section restoring material comprises (A), (C) and (D) a powder form aggregate composition composed of a curing initiator and silica sands, and used for coating the section restoring material prepared by mixing 100 pts.wt. (D), 40-100 pts.wt. (A) in the claim 1, and 0.3-5 pts.wt. (C). COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过防止部分恢复材料的瑕疵的下垂和缺点，提供具有改进的实用性的可固化组合物和截面恢复材料。解决方案：可固化组合物包含（A）含有机过氧化物的可聚合丙烯酸液体组合物，（B）通过有机过氧化物分解产生自由基的固化引发剂和（C）长度为0.5-20mm的短纤维用于通过混合和扩散100重量份来恢复混凝土表面的直径为50μm或更小的直径。（A）+（B）和1-10重量份（C）。粉末形状部分恢复材料包括（A），（C）和（D）由固化引发剂和二氧化硅砂组成的粉末形式的聚集体组合物，并用于涂覆通过混合100重量份（D），40-100重量份（A）和0.3-5重量份（C）。版权所有（C）2004，JPO

5. 发明专利

JP2007169352A Adhesive composition, adhesive, bonding method and furniture 有权
标题翻译：胶粘组合物，粘合剂，粘合方法和家具
公开(公告)号：JP2007169352A
公开(公告)日：2007-07-05
申请号：JP2005365772
申请日：2005-12-20
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO
IPC分类号： C09J4/02 , C09J5/04 , C09J11/06 , C09J179/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive rapidly curing and tightly adhering at normal temperature.
SOLUTION: The adhesive composition comprises (a) 100 pts.mass of a (meth)acrylate monomer having at least one vinyl group in the molecule, (b) 0.5-5 pts.mass of a hydro peroxide type organic peroxide, (c) a cobalt soap having 0.04-0.4 pts.mass of cobalt metal, and (d) 0.1-5 pts.mass of a polyethylene imine, and a multi package type adhesive comprising the adhesive composition and the method using the same are provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供在常温下快速固化并紧密粘合的粘合剂。粘合剂组合物包含（a）100分钟的分子中具有至少一个乙烯基的（甲基）丙烯酸酯单体，（b）0.5-5重量份的过氧化氢型有机过氧化物，（c）具有0.04-0.4质量％的钴金属的钴皂和（d）0.1-5重量份的聚乙烯亚胺，以及包含该粘合剂组合物的多包装型粘合剂及其使用方法。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006160861A Adhesive composition and conjugate using the same and method for producing adhesive composition 有权
标题翻译：粘合剂组合物及其结合方法及粘合剂组合物的制造方法
公开(公告)号：JP2006160861A
公开(公告)日：2006-06-22
申请号：JP2004353496
申请日：2004-12-07
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO , MIYASHITA YASUO
IPC分类号： C09J4/02 , C09J11/06
摘要： PROBLEM TO BE SOLVED: To provide an adhesive bonding a metal to concrete and the metal even to paper, a fabric, etc.
SOLUTION: The adhesive composition is composed of (a) an acrylic or a methacrylic ester monomer, (b) cumene hydroperoxide, (c) cobalt soap, (d) a nitrogen-containing compound and (e) a phosphoric acid (meth)acrylate. The adhesive composition comprises preferably (d) in an amount of ≥0.8 to
摘要翻译：要解决的问题：提供将金属与混凝土和金属甚至连接到纸，织物等上的粘合剂。解决方案：粘合剂组合物由（a）丙烯酸或甲基丙烯酸酯单体，（b）氢过氧化枯烯，（c）钴皂，（d）含氮化合物和（e）磷酸（甲基）丙烯酸酯。基于1摩尔（c），粘合剂组合物优选（d）的量为≥0.8至3摩尔，并且包含（b）0.5-5重量份，基于100重量份（a ）。此外，粘合剂组合物由含有（b）不含（c）和（d）的试剂A和含（c）和（d））不含（b）的试剂B的两种试剂组成。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006199775A Primer composition and bonding method by using the same 有权
标题翻译：使用该组合物的组合物和粘合方法
公开(公告)号：JP2006199775A
公开(公告)日：2006-08-03
申请号：JP2005011379
申请日：2005-01-19
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO
IPC分类号： C09D133/04 , C09D5/00 , C09D7/12 , C09J5/02
摘要： PROBLEM TO BE SOLVED: To provide a primer composition for bonding a porous material such as concrete.
SOLUTION: The primer composition contains ≥5 and ≤50 pts.mass aluminum compound generating an insoluble product by water based on 100 pts.mass water-soluble (meth)acrylic ester monomer. Preferably, in the primer composition, the aluminum compound is ethyl acetoacetatoaluminum diisopropylate. The bonding method involves coating the surface of the porous material with the primer composition, and bonding an adherend through an adhesive thereafter.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供一种用于粘结诸如混凝土的多孔材料的底漆组合物。解决方案：底漆组合物含有≥5和≤50质量份的铝化合物，通过水，基于100质量份水溶性（甲基）丙烯酸酯单体产生不溶性产物。优选地，在底漆组合物中，铝化合物是乙酰乙酰乙酸铝二异丙酯。接合方法包括用底漆组合物涂覆多孔材料的表面，然后通过粘合剂粘合被粘物。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2008007585A (meth)acrylic composition, (meth)acrylic curable composition using the same and adhesive, and method for producing microcapsule 有权
标题翻译：（METH）丙烯酸酯组合物，（甲基）丙烯酸可固化组合物及其粘合剂，以及生产微胶囊的方法
公开(公告)号：JP2008007585A
公开(公告)日：2008-01-17
申请号：JP2006177665
申请日：2006-06-28
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO
IPC分类号： C08F2/00 , B01J13/04 , C08F4/40 , C08F20/00
摘要： PROBLEM TO BE SOLVED: To provide a (meth)acrylic adhesive having ultra high-speed sticking properties. SOLUTION: A (meth)acrylic composition in the form of a microcapsule contains a (meth)acrylic monomer and a reducing agent, wherein the (meth)acrylic monomer contains a (meth)acrylic monomer having two or more vinyl groups. A (meth)acrylic curable composition and a (meth)acrylic adhesive each comprises the (meth)acrylic composition, a polymerization initiator, and optionally a (meth)acrylic monomer. The (meth)acrylic composition is provided by a method for producing a microcapsule, the method comprising the steps of adding a water-soluble polymerization initiator to water and further adding a (meth)acrylic monomer and a reducing agent with stirring, wherein the (meth)acrylic monomer contains a (meth)acrylic monomer having two or more vinyl groups. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有超高速粘着性的（甲基）丙烯酸系粘合剂。解决方案：微胶囊形式的（甲基）丙烯酸组合物含有（甲基）丙烯酸单体和还原剂，其中（甲基）丙烯酸单体含有具有两个或多个乙烯基的（甲基）丙烯酸单体。（甲基）丙烯酸系固化性组合物和（甲基）丙烯酸类粘合剂各自包含（甲基）丙烯酸类组合物，聚合引发剂和任选的（甲基）丙烯酸类单体。（甲基）丙烯酸组合物由微胶囊的制造方法提供，该方法包括以下步骤：向水中加入水溶性聚合引发剂，并在搅拌下进一步加入（甲基）丙烯酸单体和还原剂，其中（甲基）丙烯酸类单体含有具有两个以上乙烯基的（甲基）丙烯酸单体。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005064168A Metal-based circuit board and its manufacturing method 有权
标题翻译：金属电路板及其制造方法
公开(公告)号：JP2005064168A
公开(公告)日：2005-03-10
申请号：JP2003291094
申请日：2003-08-11
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO , OKAJIMA YOSHIHIKO , OGATA YOICHI
IPC分类号： H05K1/05 , H01L23/12 , H01L23/36 , H05K1/02 , H05K3/44
CPC分类号： H01L2224/48091 , H01L2924/19105 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a metal-based circuit board which is kept high in both thermal conductivity and heat cycle durability. SOLUTION: The metal-based circuit board is used for a hybrid integrated circuit including both an electronic part releasing much heat and an electronic part requiring high thermal shock durability. The metal-based circuit board is composed of a metal plate and an insulating layer formed on the one main surface of the metal plate, and the circuits are formed on the one main surface of the metal plate through the intermediary of the insulating layer. The insulating layer is equipped with one region formed of a high-thermal conductivity insulating layer and the other region formed of silicone resin having JIS A hardness of 90 or below, and it is preferable that the region formed of a high-thermal conductivity insulating layer is formed of epoxy resin loaded with a high thermal conductivity filler. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种保持热导率和热循环耐久性高的金属基电路板。解决方案：金属基电路板用于混合集成电路，其包括释放大量热量的电子部件和需要高热冲击耐久性的电子部件。金属基电路板由金属板和形成在金属板的一个主表面上的绝缘层构成，并且电路通过绝缘层形成在金属板的一个主表面上。绝缘层配备有由高导热性绝缘层形成的一个区域和由JIS A硬度为90以下的有机硅树脂形成的另一区域，优选由高导热性绝缘层由负载高导热性填料的环氧树脂形成。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004075819A Lightweight acrylic curable composition 有权
公开(公告)号：JP2004075819A
公开(公告)日：2004-03-11
申请号：JP2002236810
申请日：2002-08-15
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： NAKANO TATSUO , ANDO TOSHIHIRO
IPC分类号： C08L101/00 , C08F2/44 , C08F265/06 , C08K5/09 , C08K5/101 , C08K5/14 , C08K7/22
摘要： PROBLEM TO BE SOLVED: To provide a highly homogeneous two-component lightweight acrylic curable composition as a repairing material readily curable at normal temperatures for use in civil engineering and construction activities, especially a lightweight restorative material, and to provide a method for producing the composition. SOLUTION: The lightweight acrylic curable composition comprises (A) 100 pts. vol. of such a liquid composition that the viscosity of a solution containing an oligomer or polymer prepared by dissolving the oligomer or polymer in a polymerizable acrylic monomer and containing 0.5-3.0 pt(s). wt. of an organic peroxide is 2-50 Pas at a service temperature and (B) 200-350 pts. vol. of a powdery lightweight aggregate composition prepared by incorporating 100 pts. wt. of a lightweight aggregate with 0.05-0.5 pt. wt., on a metal basis, of a metallic soap as a curing initiator generating radicals by decomposing the organic peroxide. COPYRIGHT: (C)2004,JPO

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