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1. 发明申请

US20060120660A1 Optically enabled hybrid semiconductor package 有权
标题翻译：光功能混合半导体封装
公开(公告)号：US20060120660A1
公开(公告)日：2006-06-08
申请号：US11005297
申请日：2004-12-07
申请人： David Rolston , Tomasz Maj , Richard Mainardi , Shao-Wei Fu , Gary Moskovitz
发明人： David Rolston , Tomasz Maj , Richard Mainardi , Shao-Wei Fu , Gary Moskovitz
IPC分类号： G02B6/26 , G02B6/12 , G02B6/36
CPC分类号： G02B6/43 , G02B6/421 , G02B6/4214 , G02B6/4224 , G02B6/4232 , G02B6/4292 , H01L2224/81801
摘要： The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.
摘要翻译：本发明提供了一种用于与印刷电路板（PWB）的光波导的光学侧耦合的独立的光学混合IC（OHIC）封装。 OHIC封装包括集成电路（IC）封装。它还包括具有光学耦合小面并且适于结合到集成电路（IC）封装的独立的光学子组件（OSA），其中OSA包括光电子器件和光学通道，所述光电子器件被光耦合所述光通道在所述光电子器件和所述光学耦合面之间中继光，其中所述OSA机械地和电气地结合到所述IC封装，从而在所述光电子器件和所述IC封装之间提供电耦合，通过光耦合面侧耦合到光波导。本发明还提供了一种用于创建OHIC包装的方法。

2. 发明授权

US07200295B2 Optically enabled hybrid semiconductor package 有权
标题翻译：光功能混合半导体封装
公开(公告)号：US07200295B2
公开(公告)日：2007-04-03
申请号：US11005297
申请日：2004-12-07
申请人： David R. Rolston , Tomasz Maj , Richard Mainardi , Shao-Wei Fu , Gary Moskovitz
发明人： David R. Rolston , Tomasz Maj , Richard Mainardi , Shao-Wei Fu , Gary Moskovitz
IPC分类号： G02B6/12 , H01L21/00
CPC分类号： G02B6/43 , G02B6/421 , G02B6/4214 , G02B6/4224 , G02B6/4232 , G02B6/4292 , H01L2224/81801
摘要： The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.
摘要翻译：本发明提供了一种用于与印刷电路板（PWB）的光波导的光学侧耦合的独立的光学混合IC（OHIC）封装。 OHIC封装包括集成电路（IC）封装。它还包括具有光学耦合小面并且适于结合到集成电路（IC）封装的独立的光学子组件（OSA），其中OSA包括光电子器件和光学通道，所述光电子器件被光耦合所述光通道在所述光电子器件和所述光学耦合面之间中继光，其中所述OSA机械地和电气地结合到所述IC封装，从而在所述光电子器件和所述IC封装之间提供电耦合，通过光耦合面侧耦合到光波导。本发明还提供了一种用于创建OHIC包装的方法。

3. 发明申请

US20070258683A1 OPTICALLY-ENABLED INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：光电式集成电路封装
公开(公告)号：US20070258683A1
公开(公告)日：2007-11-08
申请号：US11745081
申请日：2007-05-07
申请人： David Rolston , Richard Mainardi , Shao-Wei Fu
发明人： David Rolston , Richard Mainardi , Shao-Wei Fu
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/3897 , G02B6/4292 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.
摘要翻译：提出了一种用于将电路板连接到光纤的光学启用集成电路（IC）封装。 IC封装包括具有与光纤预对准的激光器的OSA。 OSA还包括用于连接到微芯片的标准电接口和用于连接到光纤的标准光接口。还提出了将光连接器和电缆连接到集成电路封装的一套机械概念，可用于任何类型的光连接器，如单光纤套管，MT-RJ型光学套管和2-D MT型光学套管。

4. 发明授权

US07517159B1 Two substrate parallel optical sub-assembly 有权
标题翻译：两个基板平行光学子组件
公开(公告)号：US07517159B1
公开(公告)日：2009-04-14
申请号：US11862594
申请日：2007-09-27
申请人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
发明人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
IPC分类号： G02B6/36 , G02B6/30
CPC分类号： G02B6/4214 , G02B6/423 , G02B6/4246 , G02B6/4249
摘要： There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the packages with respect to each other; and each one of the packages with respect to the structure.
摘要翻译：提供了一种用于组装光学组件的组件的光学组件和方法，该方法包括：提供用于引导光的结构; 提供嵌入所述结构中的固定布置的多个光纤，所述光纤用于将来自所述结构的耦合表面的光耦合; 使第一包装抵靠耦合表面，使得包含在第一包装中的多个元件中的每个元件基本上与多个光纤中的第一组光纤中的每一个对齐; 并且邻近所述第一包装使所述第二包装抵靠所述联接表面，并且使得所述第一和第二包装间隔开间隔; 并且包括在所述第二封装中的多个元件中的每个元件基本上与所述多根光纤中的第二组光纤中的每一个对准，所述间隙在以下中的任一个的位置中提供公差：包装; 包装相对于彼此; 以及相对于结构的每个包装。

5. 发明授权

US07537394B2 Method for assembling a two substrate parallel optical sub-assembly 有权
标题翻译：一种用于组装两个基板平行光学子组件的方法
公开(公告)号：US07537394B2
公开(公告)日：2009-05-26
申请号：US12131461
申请日：2008-06-02
申请人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
发明人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
IPC分类号： G02B6/36 , G02B6/30
CPC分类号： G02B6/4214 , G02B6/423 , G02B6/4246 , G02B6/4249
摘要： There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the packages with respect to each other; and each one of the packages with respect to the structure.
摘要翻译：提供了一种用于组装光学组件的组件的光学组件和方法，该方法包括：提供用于引导光的结构; 提供嵌入所述结构中的固定布置的多个光纤，所述光纤用于将来自所述结构的耦合表面的光耦合; 使第一包装抵靠耦合表面，使得包含在第一包装中的多个元件中的每个元件基本上与多个光纤中的第一组光纤中的每一个对齐; 并且邻近所述第一包装使所述第二包装抵靠所述联接表面，并且使得所述第一和第二包装间隔开间隔; 并且包括在所述第二封装中的多个元件中的每个元件基本上与所述多根光纤中的第二组光纤中的每一个对准，所述间隙在以下中的任一个的位置中提供公差：包装; 包装相对于彼此; 以及相对于结构的每个包装。

6. 发明申请

US20090087146A1 METHOD FOR ASSEMBLING A TWO SUBSTRATE PARALLEL OPTICAL SUB-ASSEMBLY 有权
标题翻译：用于组装两个基板并联光学子组件的方法
公开(公告)号：US20090087146A1
公开(公告)日：2009-04-02
申请号：US12131461
申请日：2008-06-02
申请人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
发明人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
IPC分类号： G02B6/26
CPC分类号： G02B6/4214 , G02B6/423 , G02B6/4246 , G02B6/4249
摘要： There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the packages with respect to each other; and each one of the packages with respect to the structure.
摘要翻译：提供了一种用于组装光学组件的组件的光学组件和方法，该方法包括：提供用于引导光的结构; 提供嵌入所述结构中的固定布置的多个光纤，所述光纤用于将来自所述结构的耦合表面的光耦合; 使第一包装抵靠耦合表面，使得包含在第一包装中的多个元件中的每个元件基本上与多个光纤中的第一组光纤中的每一个对齐; 并且邻近所述第一包装使所述第二包装抵靠所述联接表面，并且使得所述第一和第二包装间隔开间隔; 并且包括在所述第二封装中的多个元件中的每个元件基本上与所述多根光纤中的第二组光纤中的每一个对准，所述间隙在以下中的任一个的位置中提供公差：包装; 包装相对于彼此; 以及相对于结构的每个包装。

7. 发明申请

US20100172609A1 METHOD AND DEVICE TO IMPROVE SIGNAL-TO-NOISE RATIO IN HIGH-SPEED OPTICAL DATA COMMUNICATIONS 审中-公开
标题翻译：在高速光学数据通信中提高信号噪声比的方法和装置
公开(公告)号：US20100172609A1
公开(公告)日：2010-07-08
申请号：US12501110
申请日：2009-07-10
申请人： David R. Rolston , Rajiv Iyer , Shao-Wei Fu , Richard Mainardi , Eric Schneider , Shuang Jin
发明人： David R. Rolston , Rajiv Iyer , Shao-Wei Fu , Richard Mainardi , Eric Schneider , Shuang Jin
IPC分类号： G02B6/10
CPC分类号： H01S5/02276 , G02B6/4201 , G02B6/4249 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/3011 , H01L2924/30111 , H01S5/02248 , H01S5/423 , H05K1/0274 , H05K1/141 , H01L2924/00014 , H01L2924/00
摘要： There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.
摘要翻译：描述了包括ICB基板的光电集成电路板（ICB）; 位于ICB基板上的线性阵列阵列，用于与光纤阵列的光学连接，每个单元包括：芯片接合焊盘和垂直腔表面发射激光器（VCSEL）和光电检测器之一; ICB衬底上的多个ICB接合焊盘，至少对应于线阵列中的多个单元的ICB接合焊盘的数量，其中沿着线性阵列的每个连续的ICB接合焊盘位于线性阵列的交替侧上; 并且以一对一的关系将每个ICB接合焊盘连接到线性阵列的一个单元的相应管芯接合焊盘。

8. 发明授权

US07729581B2 Optically-enabled integrated circuit package 有权
标题翻译：光电集成电路封装
公开(公告)号：US07729581B2
公开(公告)日：2010-06-01
申请号：US11745081
申请日：2007-05-07
申请人： David Robert Cameron Rolston , Richard Mainardi , Shao-Wei Fu
发明人： David Robert Cameron Rolston , Richard Mainardi , Shao-Wei Fu
IPC分类号： G02B6/26 , G02B6/30 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4232 , G02B6/3897 , G02B6/4292 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.
摘要翻译：提出了一种用于将电路板连接到光纤的光学启用集成电路（IC）封装。 IC封装包括具有与光纤预对准的激光器的OSA。 OSA还包括用于连接到微芯片的标准电接口和用于连接到光纤的标准光接口。还提出了将光连接器和电缆连接到集成电路封装的一套机械概念，可用于任何类型的光连接器，如单光纤套管，MT-RJ型光学套管和2-D MT型光学套管。

9. 发明申请

US20090087145A1 TWO SUBSTRATE PARALLEL OPTICAL SUB-ASSEMBLY 有权
标题翻译：两个基板并联光电子总成
公开(公告)号：US20090087145A1
公开(公告)日：2009-04-02
申请号：US11862594
申请日：2007-09-27
申请人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
发明人： David R. Rolston , Richard Mainardi , Shao-Wei Fu , Robert Varano
IPC分类号： G02B6/26
CPC分类号： G02B6/4214 , G02B6/423 , G02B6/4246 , G02B6/4249
摘要： There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the packages with respect to each other; and each one of the packages with respect to the structure.
摘要翻译：提供了一种用于组装光学组件的组件的光学组件和方法，该方法包括：提供用于引导光的结构; 提供嵌入所述结构中的固定布置的多个光纤，所述光纤用于将来自所述结构的耦合表面的光耦合; 使第一包装抵靠耦合表面，使得包含在第一包装中的多个元件中的每个元件基本上与多个光纤中的第一组光纤中的每一个对齐; 并且邻近所述第一包装使所述第二包装抵靠所述联接表面，并且使得所述第一和第二包装间隔开间隔; 并且包括在所述第二封装中的多个元件中的每个元件基本上与所述多根光纤中的第二组光纤中的每一个对准，所述间隙在以下中的任一个的位置中提供公差：包装; 包装相对于彼此; 以及相对于结构的每个包装。

10. 发明申请

US20120141073A1 OPTICAL SUB-ASSEMBLY WITH STRAIN RELIEF FEATURE 审中-公开
标题翻译：具有应变消除特征的光学分组合
公开(公告)号：US20120141073A1
公开(公告)日：2012-06-07
申请号：US12958051
申请日：2010-12-01
申请人： Richard Mainardi , David R. Rolston
发明人： Richard Mainardi , David R. Rolston
IPC分类号： G02B6/36
CPC分类号： G02B6/3893 , G02B6/3821 , G02B6/3885 , G02B6/3887 , G02B6/421 , G02B6/4292
摘要： The present document describes an optical interconnect module for interfacing optical fibers. An optical interconnect module in accordance with an embodiment comprises a casing including a projection and an optical sub-assembly including an interlock portion for receiving the projection of the casing. The optical sub-assembly carries a plurality of optical fibers, and couples face to face with an optical cable assembly for aligning the corresponding fibers together. The optical cable assembly is usually provided in an optical cable connector, along with a spring which compresses when the optical cable connector is inserted in the optical interconnect module. The pressure provided by the spring is transmitted to the optical sub-assembly. The optical sub-assembly applies this pressure to the projection received in the notch thereof for maintaining a tight engagement with the optical cable assembly. With this arrangement it is possible shorten the optical sub-assembly, save circuit board space and reduce the length of the optical fibers, which results in optical interconnect modules which may achieve high speed short-reach optical data connectivity in a small form factor and at low cost.
摘要翻译：本文件描述了用于光纤接口的光学互连模块。根据实施例的光学互连模块包括包括突起的壳体和包括用于接收壳体的突起的互锁部分的光学子组件。光学子组件携带多个光纤，并且与光缆组件面对面地耦合，以将相应的光纤对准在一起。光缆组件通常设置在光缆连接器中，以及当光缆连接器插入光学互连模块时压缩的弹簧。由弹簧提供的压力传递到光学子组件。光学子组件将该压力施加到容纳在其凹口中的突起上，以保持与光缆组件的紧密接合。通过这种布置，可以缩短光学子组件，节省电路板空间并减少光纤的长度，这导致光学互连模块，其可以以小尺寸实现高速短距离光数据连接，并且在低成本。

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