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    • 2. 发明授权
    • Weak-link capacitor
    • 弱连接电容
    • US07955945B1
    • 2011-06-07
    • US12892055
    • 2010-09-28
    • Shawn M. DirkRoss S. JohnsonDavid R. WheelerGregory R. Bogart
    • Shawn M. DirkRoss S. JohnsonDavid R. WheelerGregory R. Bogart
    • H01L21/20
    • H01G4/18H01G4/232H01G4/306
    • A process for making a dielectric material where a precursor polymer selected from poly(phenylene vinylene) polyacetylene, poly(p-phenylene), poly(thienylene vinylene), poly(1,4-naphthylene vinylene), and poly(p-pyridine vinylene) is energized said by exposure by radiation or increase in temperature to a level sufficient to eliminate said leaving groups contained within the precursor polymer, thereby transforming the dielectric material into a conductive polymer. The leaving group in the precursor polymer can be a chloride, a bromide, an iodide, a fluoride, an ester, an xanthate, a nitrile, an amine, a nitro group, a carbonate, a dithiocarbamate, a sulfonium group, an oxonium group, an iodonium group, a pyridinium group, an ammonium group, a borate group, a borane group, a sulphinyl group, or a sulfonyl group.
    • 一种制备介电材料的方法,其中前体聚合物选自聚(亚苯基亚乙烯基)聚乙炔,聚(对亚苯基),聚(亚苯基亚乙烯基),聚(1,4-亚萘基亚乙烯基)和聚(对 - 吡啶亚乙烯基) )通过辐射曝光或者将温度升高到足以消除前体聚合物中包含的所述离去基团的水平,从而将电介质材料转化为导电聚合物而被激发。 前体聚合物中的离去基团可以是氯化物,溴化物,碘化物,氟化物,酯,黄原酸酯,腈,胺,硝基,碳酸酯,二硫代氨基甲酸酯,锍基,氧鎓基 ,碘鎓基,吡啶鎓基,铵基,硼酸酯基,硼烷基,亚磺酰基或磺酰基。
    • 4. 发明授权
    • Electrochemical assembly of organic molecules by the reduction of iodonium salts
    • 通过还原碘鎓盐来电化学组装有机分子
    • US07550071B1
    • 2009-06-23
    • US11065894
    • 2005-02-25
    • Shawn M. DirkStephen W. HowellDavid R. Wheeler
    • Shawn M. DirkStephen W. HowellDavid R. Wheeler
    • C25D7/12C25D11/00C25B3/00C25B3/12
    • C25D9/02C23C18/1896
    • Methods are described for the electrochemical assembly of organic molecules on silicon, or other conducting or semiconducting substrates, using iodonium salt precursors. Iodonium molecules do not assemble on conducting surfaces without a negative bias. Accordingly, the iodonium salts are preferred for patterning applications that rely on direct writing with negative bias. The stability of the iodonium molecule to acidic conditions allows them to be used with standard silicon processing. As a directed assembly process, the use of iodonium salts provides for small features while maintaining the ability to work on a surface and create structures on a wafer level. Therefore, the process is amenable for mass production. Furthermore, the assembled monolayer (or multilayer) is chemically robust, allowing for subsequent chemical manipulations and the introduction of various molecular functionalities for various chemical and biological applications.
    • 描述了使用碘鎓盐前体在硅或其它导电或半导体衬底上电化学组装有机分子的方法。 碘分子不会在没有负偏压的导电表面上组装。 因此,碘鎓盐优选用于依赖于负偏压的直接写入的图案化应用。 碘分子在酸性条件下的稳定性允许它们与标准硅处理一起使用。 作为定向组装方法,碘鎓盐的使用提供小特征,同时保持在表面上工作的能力并在晶片级上产生结构。 因此,该方法适合批量生产。 此外,组装的单层(或多层)是化学稳健的,允许随后的化学操作和引入用于各种化学和生物应用的各种分子功能。
    • 5. 发明授权
    • Weak-link capacitor
    • 弱连接电容
    • US08426321B1
    • 2013-04-23
    • US13099143
    • 2011-05-02
    • Shawn M. DirkRoss S. JohnsonDavid R. WheelerGregory R. Bogart
    • Shawn M. DirkRoss S. JohnsonDavid R. WheelerGregory R. Bogart
    • H01L21/31H01L21/469
    • H01G4/18H01G4/232H01G4/306
    • A process for making a dielectric material where a precursor polymer selected from poly(phenylene vinylene)polyacetylene, poly(p-phenylene), poly(thienylene vinylene), poly(1,4-naphthylene vinylene), and poly(p-pyridine vinylene) is energized said by exposure by radiation or increase in temperature to a level sufficient to eliminate said leaving groups contained within the precursor polymer, thereby transforming the dielectric material into a conductive polymer. The leaving group in the precursor polymer can be a chloride, a bromide, an iodide, a fluoride, an ester, an xanthate, a nitrile, an amine, a nitro group, a carbonate, a dithiocarbamate, a sulfonium group, an oxonium group, an iodonium group, a pyridinium group, an ammonium group, a borate group, a borane group, a sulphinyl group, or a sulfonyl group.
    • 一种制备介电材料的方法,其中前体聚合物选自聚(亚苯基亚乙烯基)聚乙炔,聚(对亚苯基),聚(亚苯基亚乙烯基),聚(1,4-亚萘基亚乙烯基)和聚(对 - 吡啶亚乙烯基) )通过辐射曝光或者将温度升高到足以消除前体聚合物中包含的所述离去基团的水平,从而将电介质材料转化为导电聚合物而被激发。 前体聚合物中的离去基团可以是氯化物,溴化物,碘化物,氟化物,酯,黄原酸酯,腈,胺,硝基,碳酸酯,二硫代氨基甲酸酯,锍基,氧鎓基 ,碘鎓基,吡啶鎓基,铵基,硼酸酯基,硼烷基,亚磺酰基或磺酰基。
    • 10. 发明授权
    • Thermally switchable dielectrics
    • 可热切换电介质
    • US08427809B1
    • 2013-04-23
    • US13034535
    • 2011-02-24
    • Shawn M. DirkRoss S. Johnson
    • Shawn M. DirkRoss S. Johnson
    • H01G7/00H01R4/24H01R4/26H01R11/20H01R33/02H01R33/08
    • H01G7/04H01L28/40H01L51/0038Y02T10/7022
    • Precursor polymers to conjugated polymers, such as poly(phenylene vinylene), poly(poly(thiophene vinylene), poly(aniline vinylene), and poly(pyrrole vinylene), can be used as thermally switchable capacitor dielectrics that fail at a specific temperature due to the non-conjugated precursor polymer irreversibly switching from an insulator to the conjugated polymer, which serves as a bleed resistor. The precursor polymer is a good dielectric until it reaches a specific temperature determined by the stability of the leaving groups. Conjugation of the polymer backbone at high temperature effectively disables the capacitor, providing a ‘built-in’ safety mechanism for electronic devices.
    • 共轭聚合物的前体聚合物如聚(亚苯基亚乙烯基),聚(聚(噻吩亚乙烯基),聚(苯胺亚乙烯基)和聚(吡咯亚乙烯基))可用作在特定温度下失效的热可切换电容器电介质 对非共轭前体聚合物不可逆地从绝缘体切换到共轭聚合物,其用作渗流电阻器,前体聚合物是很好的电介质,直到达到由离去基团的稳定性确定的特定温度。聚合物的共轭 高温骨架有效禁用电容器,为电子设备提供“内置”安全机制。