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1. 发明授权

US07815289B2 Micro-fluid ejection heads and methods for bonding substrates to supports 有权
标题翻译：微流体喷射头和将基底粘合到支撑体上的方法
公开(公告)号：US07815289B2
公开(公告)日：2010-10-19
申请号：US11848246
申请日：2007-08-31
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： B41J2/04
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
摘要翻译：基本上平面的微流体喷射装置，其中微流体喷射头气密地密封并结合到支撑材料上，以及将硅装置（例如微流体喷射头）接合到支撑材料的方法。

2. 发明授权

US08071275B2 Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods 有权
标题翻译：通过该方法制造的晶片光致抗蚀剂层和晶片的表面上的平坦化不均匀的方法
公开(公告)号：US08071275B2
公开(公告)日：2011-12-06
申请号：US12100716
申请日：2008-04-10
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： G03F7/26
CPC分类号： G03F7/094
摘要： A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.
摘要翻译：晶片具有基板及其上的光致抗蚀剂层，其表面通过在光致抗蚀剂层的起始表面上定位而形成平面化的灰度掩模，该灰度掩模具有与存在于起始表面上的不均匀性的梯度高度分布相关联的图案，图案化使用灰度掩模的光致抗蚀剂层在光致抗蚀剂层中产生其图案，其实际上在凹凸的梯度高度分布下的光致抗蚀剂层中产生均匀度的轮廓，并且显影图案化的光致抗蚀剂层，使得只有去除其对应于位于均匀轮廓之上的凹凸的梯度高度轮廓的三维部分，其实际上留在光致抗蚀剂层上形成的基本上更均匀且因此基本上处于平坦状态的所得表面之后。

3. 发明申请

US20100045736A1 MODULAR MICRO-FLUID EJECTION HEAD ASSEMBLY 有权
标题翻译：模块化微流体喷射头组件
公开(公告)号：US20100045736A1
公开(公告)日：2010-02-25
申请号：US12195451
申请日：2008-08-21
申请人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
发明人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
IPC分类号： B41J2/14 , B21D53/76
CPC分类号： B41J2/1623 , B41J2/14072 , B41J2/16 , Y10T29/49401
摘要： A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.
摘要翻译：微流体喷射头组件和使用单独制造的电气部件制造微流体喷射头的方法。微流体喷射头具有至少一个基底基板，至少一个附着在基底基板上的流体喷射致动器基板; 以及至少第一逻辑部件基板，其密封到基底基板。流体喷射器致动器基板和第一逻辑部件基板彼此电连通。

4. 发明申请

US20110205305A1 HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE 有权
标题翻译：硅胶衬垫加热硅胶衬垫
公开(公告)号：US20110205305A1
公开(公告)日：2011-08-25
申请号：US13102091
申请日：2011-05-06
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过模具的金属将基板前部的导体连接到模具前部的加热元件。

5. 发明申请

US20100230047A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS 有权
标题翻译：微流体喷射头和用于将基材粘合到支撑物上的方法
公开(公告)号：US20100230047A1
公开(公告)日：2010-09-16
申请号：US12786462
申请日：2010-05-25
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： C09J5/02
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
摘要翻译：基本上平面的微流体喷射装置，其中微流体喷射头气密地密封并结合到支撑材料上，以及将硅装置（例如微流体喷射头）接合到支撑材料的方法。

6. 发明申请

US20100229391A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS 有权
公开(公告)号：US20100229391A1
公开(公告)日：2010-09-16
申请号：US12786457
申请日：2010-05-25
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： B21D53/76
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.

7. 发明申请

US20090256891A1 HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS 有权
标题翻译：硅胶衬垫上加热硅胶的加热器及其制作方法
公开(公告)号：US20090256891A1
公开(公告)日：2009-10-15
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , H01L21/00
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

8. 发明申请

US20090058945A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS 有权
标题翻译：微流体喷射头和用于将基材粘合到支撑物上的方法
公开(公告)号：US20090058945A1
公开(公告)日：2009-03-05
申请号：US11848246
申请日：2007-08-31
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： B41J2/04 , C09J5/02
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
摘要翻译：基本上平面的微流体喷射装置，其中微流体喷射头气密地密封并结合到支撑材料上，以及将硅装置（例如微流体喷射头）接合到支撑材料的方法。

9. 发明授权

US07938513B2 Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips 有权
标题翻译：具有硅芯片的加热芯片粘合在硅衬底上以及制造加热器芯片的方法
公开(公告)号：US07938513B2
公开(公告)日：2011-05-10
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , B21D53/76
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

10. 发明申请

US20090258322A1 METHODS FOR PLANARIZING UNEVENNESS ON SURFACE OF WAFER PHOTORESIST LAYER AND WAFERS PRODUCED BY THE METHODS 有权
标题翻译：在方法生产的波长光电子层和波长表面上平坦化的方法
公开(公告)号：US20090258322A1
公开(公告)日：2009-10-15
申请号：US12100716
申请日：2008-04-10
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： G03F7/20
CPC分类号： G03F7/094
摘要： A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.
摘要翻译：晶片具有基板及其上的光致抗蚀剂层，其表面通过在光致抗蚀剂层的起始表面上定位而形成平面化的灰度掩模，该灰度掩模具有与存在于起始表面上的不均匀性的梯度高度分布相关联的图案，图案化使用灰度掩模的光致抗蚀剂层在光致抗蚀剂层中产生其图案，其实际上在凹凸的梯度高度分布下的光致抗蚀剂层中产生均匀度的轮廓，并且显影图案化的光致抗蚀剂层，使得只有去除其对应于位于均匀轮廓之上的凹凸的梯度高度轮廓的三维部分，其实际上留在光致抗蚀剂层上形成的基本上更均匀且因此基本上处于平坦状态的所得表面之后。

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