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    • 2. 发明授权
    • Complementary transistor structure and method for manufacture
    • 互补晶体管结构及其制造方法
    • US4951115A
    • 1990-08-21
    • US319374
    • 1989-03-06
    • David L. HarameGary L. PattonJohannes M. C. Stork
    • David L. HarameGary L. PattonJohannes M. C. Stork
    • H01L29/73H01L21/331H01L21/82H01L21/8228H01L27/082H01L29/732
    • H01L21/82H01L27/0826
    • A complementary bipolar transistor structure having one symmetrical intrinsic region for both the NPN and PNP transistors and a method for fabricating the structure. The transistor structure includes a vertical NPN transistor operating in the upward direction and a vertical PNP transistor operating in a downward direction. In the method, the sub-emitter and the sub-collector regions are formed by depositing a first epitaxial layer of semiconductor material of a first conductivity type on the surface of a semiconductor substrate of a second conductivity type, and forming the sub-collector by etching a shallow trench in the first layer and depositing semiconductor material of a second conductivity type by LTE and planarizing. The intrinsic regions for both of the transistors are formed by depositing a second layer of semiconductor material of the second conductivity type on the surface of the first layer and a third layer of semiconductor material of the first conductivity type on the surface of the second layer by either LTE or MBE. In one embodiment, the second and third layers are provided with a uniform vertical doping profile for one thickness of the layer and a graded doping profile for the remaining thickness in which the minimum doping level for both graded portions is at the junction between the second and third layers. The second layer forms the base and the third layer forms the collector for one transistor while at the same time the second layer forms a collector and the third layer forms the base for the other transistor. The performance of the intrinsic base and collector regions can be further improved by forming the second and third layers with a compound semiconductor material, such as, the compound of Si-Ge to create a heterojunction transistor. Device and intrinsic region isolation is effected by a combination of deep trench and shallow trench processes and reach-through regions for the sub-emitter and sub-collector are formed. A layer of polysilicon is deposited and selectively etched to form an extrinsic collector region for one transistor and extrinsic base regions for the other transistor. A further layer of single crystal silicon is deposited to form the extrinsic base region for one transistor and the emitter for the other transistor.
    • 4. 发明授权
    • Semiconductor device with self-aligned contact to buried subcollector
    • 具有自对准接触的半导体器件与埋层子集电极
    • US5119157A
    • 1992-06-02
    • US664681
    • 1991-03-05
    • David L. HarameBernard S. MeyersonJohannes M. C. Stork
    • David L. HarameBernard S. MeyersonJohannes M. C. Stork
    • H01L21/20H01L21/74H01L21/8228H01L21/8238H01L27/06H01L29/08
    • H01L29/0821H01L21/743H01L21/82285H01L21/8238H01L27/0623
    • A P- semiconductor material substrate which has been ion-implanted with N-type dopants to form an N+ subcollector layer is annealed in Argon to further remove implant damage and drive the dopant ions deeper into the P substrate. Next a lightly doped N- epitaxial layer is grown on the N+ subcollector layer. This forms the blanket collector. A P- well region is formed by growing a pad oxide of 10 nm on the N-epi layer and a 200 nm layer of nitride is then deposited on top of the layer oxide. A photoresist etch mask is used to pattern the P- well region. A reactive ion etch is performed through the dielectric oxide and nitride layers, through the epitaxial layer and stopping in the subcollector layer. A layer of low temperature expitaxial material is grown over the structure using ultra-high vacuum/chemical vapor depositions such that the epitaxial layer extends above the surface of the epitaxial layer and includes a P+ heavily doped layer and a lightly P-doped surface layer. The heavily doped P+ layer provides the low resistance contact to the collector region and the lightly doped P-layer is the collector region and its thickness is determined by the diffusion of the heavily doped layer during the entire process.
    • 已经用N型掺杂剂离子注入以形成N +子集电极层的P-半导体材料衬底在氩气中退火以进一步消除注入损伤并且将掺杂剂离子更深地驱动到P衬底中。 接下来,在N +子集电极层上生长轻掺杂的N外延层。 这形成了毯子收集器。 通过在N外延层上生长10nm的衬垫氧化物形成P-阱区,然后在层氧化物的顶部上沉积200nm的氮化物层。 使用光致抗蚀剂蚀刻掩模来图案化P-阱区域。 通过电介质氧化物层和氮化物层通过外延层进行反应离子蚀刻,并在子集电极层中停止。 使用超高真空/化学气相沉积在结构上生长一层低温外延材料,使得外延层在外延层的表面上延伸,并且包括P +重掺杂层和轻掺杂P掺杂表面层。 重掺杂的P +层向集电极区提供低电阻接触,轻掺杂的P层是集电极区,其厚度由整个工艺中重掺杂层的扩散决定。
    • 8. 发明申请
    • LOCAL WIRING FOR A BIPOLAR JUNCTION TRANSISTOR INCLUDING A SELF-ALIGNED EMITTER REGION
    • 用于包括自对准发射极区域的双极晶体管的本地布线
    • US20140021587A1
    • 2014-01-23
    • US13551971
    • 2012-07-18
    • David L. HarameZhong-Xiang HeQizhi Liu
    • David L. HarameZhong-Xiang HeQizhi Liu
    • H01L29/66H01L29/73
    • H01L29/66234H01L29/0804H01L29/66287H01L29/73H01L29/732
    • Aspects of the invention provide for a bipolar transistor of a self-aligned emitter. In one embodiment, the invention provides a method of forming local wiring for a bipolar transistor with a self-aligned sacrificial emitter, including: performing an etch to remove the sacrificial emitter to form an emitter opening between two nitride spacers; depositing an in-situ doped emitter into the emitter opening; performing a recess etch to partially remove a portion of the in-situ doped emitter; depositing a silicon dioxide layer over the recessed in-situ doped emitter; planarizing the silicon dioxide layer via chemical mechanical polishing; etching an emitter trench over the recessed in-situ doped emitter; and depositing tungsten and forming a tungsten wiring within the emitter trench via chemical mechanical polishing.
    • 本发明的方面提供了一种自对准发射极的双极晶体管。 在一个实施例中,本发明提供了一种用于具有自对准牺牲发射器的双极晶体管的局部布线的方法,包括:执行蚀刻以去除牺牲发射极以在两个氮化物间隔物之间​​形成发射极开口; 将原位掺杂的发射体沉积到发射极开口中; 执行凹陷蚀刻以部分去除原位掺杂发射体的一部分; 在凹入的原位掺杂发射体上沉积二氧化硅层; 通过化学机械抛光使二氧化硅层平坦化; 在凹入的原位掺杂发射体上蚀刻发射极沟槽; 并通过化学机械抛光沉积钨并在发射器沟槽内形成钨布线。