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1. 发明申请

US20130027885A1 HEAT SPREADER FOR MULTI-CHIP MODULES 审中-公开
标题翻译：多芯片模块的散热器
公开(公告)号：US20130027885A1
公开(公告)日：2013-01-31
申请号：US13189855
申请日：2011-07-25
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.
摘要翻译：多芯片电子模块包括具有第一端部，第二端部，第一表面部分和相对的第二表面部分的电路板。多个电子部件被安装到电路板的第一表面部分。散热构件被支撑在电路板的第一表面部分处。散热器包括具有第一端，第二端，第一表面和第二表面的主体。第一端部部分和第一端部限定流体入口，并且第二端部部分和第二端部限定流体出口。第二表面与多个电子部件热接触。散热构件和电路板限定具有多个基本上平行的流动路径的封闭流体管道。

2. 发明授权

US08582297B2 Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics 有权
标题翻译：定制热界面，优化机械负载和导热特性
公开(公告)号：US08582297B2
公开(公告)日：2013-11-12
申请号：US13020102
申请日：2011-02-03
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
IPC分类号： H05K7/20
CPC分类号： F28F13/00 , B23P2700/10 , F28F2013/006 , H01L23/433 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , H01L2924/00
摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要翻译：一种通过冷却板冷却一个或多个设备的方法，系统和装置。示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。

3. 发明申请

US20120199333A1 CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THERMAL CONDUCTIVITY CHARACTERISTICS 有权
标题翻译：定制的热接口优化机械负载和热导率特性
公开(公告)号：US20120199333A1
公开(公告)日：2012-08-09
申请号：US13020102
申请日：2011-02-03
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
IPC分类号： F28F7/00 , B23P11/00
CPC分类号： F28F13/00 , B23P2700/10 , F28F2013/006 , H01L23/433 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , H01L2924/00
摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要翻译：一种通过冷却板冷却一个或多个设备的方法，系统和装置。示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。

4. 发明授权

US06436223B1 Process and apparatus for improved module assembly using shape memory alloy springs 失效
标题翻译：使用形状记忆合金弹簧改进模块组装的工艺和装置
公开(公告)号：US06436223B1
公开(公告)日：2002-08-20
申请号：US09250312
申请日：1999-02-16
申请人： David L. Edwards , Enrique C. Abreu , Ronald L. Hering , David C. Olson
发明人： David L. Edwards , Enrique C. Abreu , Ronald L. Hering , David C. Olson
IPC分类号： B32B3100
CPC分类号： H01L21/68778 , F16F2224/0258 , H01L21/67092 , H01L21/67144 , Y10S148/908 , Y10S269/903 , Y10T29/53978
摘要： A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.
摘要翻译：用于组装半导体模块的夹具和工艺。每个模块包括衬底和附接到衬底的盖。所述固定装置包括适于接纳所述基板的基板和包含接合所述盖的形状记忆合金弹簧的弹簧加载装置。形状记忆合金弹簧在室温下施加较小的力，并且在用于将盖附着到基底上的粘结剂的粘结温度下提高力。该过程包括以下步骤：（a）将模块加载到组装夹具中并在室温下将形状记忆合金弹簧对准模块; （b）将灯具和模块放入加热室; （c）将夹具和模块加热到足以粘结的温度并高于形状记忆合金弹簧转变温度范围，使得弹簧在模块上施加升高的力; 和（d）将夹具和模块配合在转变温度以下，使得弹簧在模块上施加较小的力，并在较低温度下分离弹簧。

5. 发明授权

US08554335B2 Method and apparatus for disconnecting the tip electrode during MRI 失效
标题翻译：在MRI期间断开尖端电极的方法和装置
公开(公告)号：US08554335B2
公开(公告)日：2013-10-08
申请号：US13186194
申请日：2011-07-19
申请人： Masoud Ameri , Greg P. Carpenter , David C. Olson
发明人： Masoud Ameri , Greg P. Carpenter , David C. Olson
IPC分类号： A61N1/37
CPC分类号： A61N1/056 , A61N1/086 , A61N2001/0585 , Y10S128/901
摘要： A medical device includes a pulse generator, a lead, and an electrode. The lead includes an electrode and a lead conductor connecting the pulse generator with the electrode via first and second conductive paths. The medical device includes first and second switches. The first switch is disposed along the first conductive path and includes an open state in the presence of a magnetic field and a closed state in the absence of the magnetic field. The second switch is disposed along the second conductive path and includes an open state when a voltage applied across the second switch is at or below a threshold voltage and a closed state when the voltage applied across the second switch exceeds a threshold voltage.
摘要翻译：医疗装置包括脉冲发生器，引线和电极。引线包括通过第一和第二导电路径将脉冲发生器与电极连接的电极和引线导体。医疗装置包括第一和第二开关。第一开关沿着第一导电路径设置并且在没有磁场的情况下存在磁场和闭合状态的情况下包括打开状态。当施加在第二开关上的电压处于或低于阈值电压时，第二开关沿着第二导电路径设置并且当施加在第二开关上的电压超过阈值电压时处于闭合状态。

6. 发明申请

US20110319778A1 CARDIAC FUNCTION MONITOR USING INFORMATION INDICATIVE OF LEAD MOTION 有权
标题翻译：心脏功能监测器使用信号指示铅运动
公开(公告)号：US20110319778A1
公开(公告)日：2011-12-29
申请号：US13168531
申请日：2011-06-24
申请人： Robert J. Sweeney , Allan C. Shuros , Krzysztof Z. Siejko , David C. Olson , Frank Ingle
发明人： Robert J. Sweeney , Allan C. Shuros , Krzysztof Z. Siejko , David C. Olson , Frank Ingle
IPC分类号： A61B5/0245 , A61N1/365
CPC分类号： A61N1/36514 , A61B5/02133 , A61B5/026 , A61N1/08 , A61N1/36142 , A61N1/36578
摘要： Systems and methods to monitor cardiac function using information indicative of lead motion are described. In an example, a system including an implantable medical device can include a receiver circuit configured to be electrically coupled to conductor comprising a portion of an implantable lead and be configured to obtain information indicative of a movement of the implantable lead due at least in part to a motion of a heart. The system can include a sensing circuit configured to obtain information indicative of cardiac electrical activity. The system can include a processor circuit configured to construct a template representative of a contraction of the heart, where the template can be constructed using the information indicative of the movement of the implantable lead due at least in part to the motion of the heart during the contraction, and using the information indicative of the cardiac electrical activity sensed during the contraction.
摘要翻译：描述使用指示引导运动的信息来监测心脏功能的系统和方法。在一个示例中，包括可植入医疗装置的系统可以包括被配置为电耦合到导体的接收器电路，该导体包括可植入引线的一部分，并且被配置为获得指示可植入引线的移动的信息，一个心脏的动作。该系统可以包括被配置为获得指示心脏电活动的信息的感测电路。该系统可以包括配置成构造代表心脏收缩的模板的处理器电路，其中可以使用指示可植入导线的运动的信息来构建模板，至少部分地由于心脏的运动并且使用指示在收缩期间感测到的心脏电活动的信息。

7. 发明申请

US20110276104A1 METHOD AND APPARATUS FOR DISCONNECTING THE TIP ELECTRODE DURING MRI 失效
标题翻译：在MRI中断开TIP电极的方法和装置
公开(公告)号：US20110276104A1
公开(公告)日：2011-11-10
申请号：US13186194
申请日：2011-07-19
申请人： Masoud Ameri , Greg P. Carpenter , David C. Olson
发明人： Masoud Ameri , Greg P. Carpenter , David C. Olson
IPC分类号： A61N1/37 , H01H77/06 , A61N1/375
CPC分类号： A61N1/056 , A61N1/086 , A61N2001/0585 , Y10S128/901
摘要： A medical device includes a pulse generator, a lead, and an electrode. The lead includes an electrode and a lead conductor connecting the pulse generator with the electrode via first and second conductive paths. The medical device includes first and second switches. The first switch is disposed along the first conductive path and includes an open state in the presence of a magnetic field and a closed state in the absence of the magnetic field. The second switch is disposed along the second conductive path and includes an open state when a voltage applied across the second switch is at or below a threshold voltage and a closed state when the voltage applied across the second switch exceeds a threshold voltage.
摘要翻译：医疗装置包括脉冲发生器，引线和电极。引线包括通过第一和第二导电路径将脉冲发生器与电极连接的电极和引线导体。医疗装置包括第一和第二开关。第一开关沿着第一导电路径设置并且在没有磁场的情况下存在磁场和闭合状态的情况下包括打开状态。当施加在第二开关上的电压处于或低于阈值电压时，第二开关沿着第二导电路径设置并且当施加在第二开关上的电压超过阈值电压时处于闭合状态。

8. 发明授权

US08738111B2 Cardiac contraction detection using information indicative of lead motion 有权
标题翻译：使用指示引导运动的信息进行心脏收缩检测
公开(公告)号：US08738111B2
公开(公告)日：2014-05-27
申请号：US13168507
申请日：2011-06-24
申请人： Robert J. Sweeney , Allan C. Shuros , Krzysztof Z. Siejko , David C. Olson , Frank Ingle
发明人： Robert J. Sweeney , Allan C. Shuros , Krzysztof Z. Siejko , David C. Olson , Frank Ingle
IPC分类号： A61B5/02 , A61B5/04 , A61B5/05 , A61N1/00
CPC分类号： A61N1/36514 , A61B5/02133 , A61B5/026 , A61N1/08 , A61N1/36142 , A61N1/36578
摘要： Systems and methods for cardiac contraction detection using information indicative of lead motion are described. In an example, an implantable medical device can include a receiver circuit configured to be electrically coupled to conductor comprising a portion of an implantable lead and be configured to obtain information indicative of a movement of the implantable lead due at least in part to a motion of a heart. The device can include a processor circuit configured to determine whether a cardiac mechanical contraction occurred during a specified interval included in the obtained information indicative of the movement of the implantable lead. The processor circuit can be configured to determine information about the cardiac mechanical contraction using the obtained information indicative of the movement of the implantable lead.
摘要翻译：描述使用指示引导运动的信息进行心脏收缩检测的系统和方法。在一个示例中，可植入医疗设备可以包括被配置为电耦合到导体的接收器电路，该导体包括可植入引线的一部分，并被配置为获得指示可植入引线的运动的信息，至少部分地由一个心脏。该装置可以包括处理器电路，该处理器电路被配置为确定在所获得的指示可植入引线的运动的信息中包括的指定间隔期间是否发生心脏机械收缩。处理器电路可以被配置为使用获得的指示可植入引线的移动的信息来确定关于心脏机械收缩的信息。

9. 发明授权

US08032228B2 Method and apparatus for disconnecting the tip electrode during MRI 有权
标题翻译：在MRI期间断开尖端电极的方法和装置
公开(公告)号：US08032228B2
公开(公告)日：2011-10-04
申请号：US12329383
申请日：2008-12-05
申请人： Masoud Ameri , Greg P. Carpenter , David C. Olson
发明人： Masoud Ameri , Greg P. Carpenter , David C. Olson
IPC分类号： A61N1/37
CPC分类号： A61N1/056 , A61N1/086 , A61N2001/0585 , Y10S128/901
摘要： A medical device includes a pulse generator, a lead, and an electrode. The lead includes an electrode and a lead conductor connecting the pulse generator with the electrode via first and second conductive paths. The medical device includes first and second switches. The first switch includes a non-conductive state in the presence of a magnetic field, the non-conductive state preventing formation of the first conductive path between the pulse generator and the electrode. The second switch includes a non-conductive state that prevents formation of the second conductive path between the pulse generator and the electrode. The first switch in the non-conductive state and the second switch in the non-conductive state electrically shields the electrode from electromagnetic radiation and induced voltages during a magnetic resonance imaging procedure.
摘要翻译：医疗装置包括脉冲发生器，引线和电极。引线包括通过第一和第二导电路径将脉冲发生器与电极连接的电极和引线导体。医疗装置包括第一和第二开关。第一开关包括在存在磁场的情况下的非导通状态，非导电状态阻止脉冲发生器和电极之间的第一导电路径的形成。第二开关包括防止在脉冲发生器和电极之间形成第二导电路径的非导电状态。在非导电状态的第一开关和非导电状态的第二开关在磁共振成像过程期间电屏蔽电磁辐射和感应电压。

10. 发明授权

US5556024A Apparatus and method for removing known good die using hot shear process 失效
公开(公告)号：US5556024A
公开(公告)日：1996-09-17
申请号：US315319
申请日：1994-09-29
申请人： David C. Olson , Robert Phillips, III
发明人： David C. Olson , Robert Phillips, III
IPC分类号： B23K1/018 , G01R1/04 , G01R31/28 , H01L21/60 , H05K13/04 , H05K3/30 , B23K3/00
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

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