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1. 发明授权

US5201854A Electrical connector for an electrophotographic printing machine 失效
标题翻译：电子照相印刷机用电连接器
公开(公告)号：US5201854A
公开(公告)日：1993-04-13
申请号：US755945
申请日：1991-09-06
申请人： David K. Ahl , Roger M. Swanson , Timothy G. Struczewski , James C. Fox , Roy Lee , Michael Terietzki , Gary R. Skillman , Ross E. Schroll
发明人： David K. Ahl , Roger M. Swanson , Timothy G. Struczewski , James C. Fox , Roy Lee , Michael Terietzki , Gary R. Skillman , Ross E. Schroll
IPC分类号： H01R24/00 , G03G15/00 , G03G15/16 , H01R13/629
CPC分类号： H01R13/629 , G03G15/1655
摘要： An apparatus for effecting electrical connection between the main machine and a module containing the apparatus for advancing a sheet through the transfer zone and to registration for information developed on the photoreceptor belt. The connector on the main machine is mounted to permit engagement with a complementary connector on the module, but provide for movement when the module is raised slightly to contact the photoreceptor module. The apparatus minimizes which otherwise would inhibit this upward movement and detract from proper operation of the machine and the quality of the copy produced.
摘要翻译：一种用于实现主机与包含用于使纸张通过转印区前进的装置的模块之间的电连接以及用于记录在感光带上显影的信息的装置。主机上的连接器被安装以允许与模块上的互补连接器接合，但是当模块略微升高以接触感光体模块时提供移动。该装置最小化否则将阻止该向上移动并且损害机器的正常操作和产生的副本的质量。

2. 发明申请

US20120226014A1 COPOLYMERIZED POLYESTER HEAT SHRINKABLE FILM 有权
标题翻译：共聚聚酯热收缩膜
公开(公告)号：US20120226014A1
公开(公告)日：2012-09-06
申请号：US13509511
申请日：2010-11-12
申请人： Roy Lee , Jong-Ryang Kim , Won-Jae Yoon
发明人： Roy Lee , Jong-Ryang Kim , Won-Jae Yoon
IPC分类号： C08G63/199 , B29C69/02
CPC分类号： C08J5/18 , B29C55/08 , B29C61/003 , B29K2067/00 , B29K2105/0085 , B29K2105/02 , C08J2367/02
摘要： A copolymerized polyester heat shrinkable film which can be used as a label, a cap seal or a direct packaging for various containers is disclosed. The copolymerized polyester heat shrinkable film is made of a copolymerized polyester resin having alternating structures of acid moieties which are derived from acid components and diol moieties which are derived from diol components, the acid components comprising terephthalic acid, and the diol components comprising isosorbide represented by Formula 1 and ethylene glycol. The copolymerized polyester heat shrinkable film has a shrinkage initiation temperature of equal to or more than 60° C., and a maximum heat shrinkage ratio of less than 2% at 60 to 70° C., and a maximum heat shrinkage ratio of 50 to 90% at 90 to 100° C.
摘要翻译：公开了可用作标签，帽密封或用于各种容器的直接包装的共聚聚酯热收缩膜。共聚聚酯热收缩膜由共聚聚酯树脂制成，该共聚聚酯树脂具有衍生自二醇组分的酸组分和二醇部分的酸部分的交替结构，所述酸组分包含对苯二甲酸，并且所述二醇组分包含由以下物质表示的异山梨醇式1和乙二醇。共聚聚酯热收缩膜的收缩起始温度等于或高于60℃，最大热收缩率在60至70℃时小于2％，最大热收缩率为50至 90％在90至100℃

3. 发明授权

US5164813A New diode structure 失效
标题翻译：新二极管结构
公开(公告)号：US5164813A
公开(公告)日：1992-11-17
申请号：US700107
申请日：1991-05-08
申请人： Scott C. Blackstone , Philip L. Hower , Elizabeth M. Roughan , Christopher H. Doucette , Roy Lee , Carolyn Q. Cotnam
发明人： Scott C. Blackstone , Philip L. Hower , Elizabeth M. Roughan , Christopher H. Doucette , Roy Lee , Carolyn Q. Cotnam
IPC分类号： H01L21/18 , H01L21/329 , H01L23/051 , H01L29/861
CPC分类号： H01L29/66113 , H01L21/187 , H01L23/051 , H01L24/01 , H01L29/861 , H01L29/8613 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/12043
摘要： A new diode structure is provided by bonding two semiconductor materials together having a low capacitance, a large contact area and mechanical ruggedness. The cross-sectional area of at least one of the semiconductor materials is reduced in the region of the bond resulting in a structure with either an hourglass or truncated hourglass-like cross-section. A diode PN junction is contained in the neighborhood of the area of reduced cross section. The diode so constructed provides a sufficient spacing between the unbonded semiconductor regions to reduce total packaged diode capacitance without introducing a spacer layer. The diode is processed to limit the area of the PN junction formed therein to the region of the bonding between the semiconductor materials, without limiting the metallized contact area, further controlling the diode capacitance as well as other electrical characteristics. The outer ends of the diode parallel to the bond, comprising typically P and N type semiconductor regions, are typically connected to metal leads which comprise the diode leads and the diode is packaged to form a mechanically and electrically stable low capacitance diode. This diode can be encapsulated such that no void or cavity exists within the interior of the structure without changing the diode construction process.
摘要翻译：通过将两个半导体材料结合在一起，具有低电容，大的接触面积和机械坚固性来提供新的二极管结构。至少一种半导体材料的横截面面积在结合区域中减小，从而产生具有沙漏或截短的沙漏状横截面的结构。二极管PN结包含在减小截面的区域附近。如此构造的二极管在未连接的半导体区域之间提供足够的间隔，以减少总封装的二极管电容而不引入间隔层。处理二极管以限制形成在其中的PN结的区域到半导体材料之间的接合区域，而不限制金属化接触面积，进一步控制二极管电容以及其它电特性。平行于键合的二极管的外端，通常包括P型和N型半导体区，通常连接到包括二极管引线的金属引线，并且二极管被封装以形成机械和电气稳定的低电容二极管。该二极管可以被封装成使得在结构内部不存在空隙或空腔而不改变二极管构造过程。

4. 发明授权

US09169365B2 Copolymerized polyester heat shrinkable film 有权
标题翻译：共聚聚酯热收缩薄膜
公开(公告)号：US09169365B2
公开(公告)日：2015-10-27
申请号：US13509511
申请日：2010-11-12
申请人： Roy Lee , Jong-Ryang Kim , Won-Jae Yoon
发明人： Roy Lee , Jong-Ryang Kim , Won-Jae Yoon
IPC分类号： B29C69/02 , C08J5/18 , B29C55/08 , B29C61/00 , C08G63/199 , B29K67/00 , B29K105/00 , B29K105/02
CPC分类号： C08J5/18 , B29C55/08 , B29C61/003 , B29K2067/00 , B29K2105/0085 , B29K2105/02 , C08J2367/02
摘要： A copolymerized polyester heat shrinkable film which can be used as a label, a cap seal or a direct packaging for various containers is disclosed. The copolymerized polyester heat shrinkable film is made of a copolymerized polyester resin having alternating structures of acid moieties which are derived from acid components and diol moieties which are derived from diol components, the acid components comprising terephthalic acid, and the diol components comprising isosorbide 1,4-cyclohexanedimethanol and ethylene glycol. The copolymerized polyester heat shrinkable film has a shrinkage initiation temperature of equal to or more than 60° C., and a maximum heat shrinkage ratio of less than 2% at 60 to 70° C., and a maximum heat shrinkage ratio of 50 to 90% at 90 to 100° C.
摘要翻译：公开了可用作标签，帽密封或用于各种容器的直接包装的共聚聚酯热收缩膜。共聚聚酯热收缩膜由共聚聚酯树脂制成，该共聚聚酯树脂具有衍生自二醇组分的酸组分和二醇部分的酸部分的交替结构，包含对苯二甲酸的酸组分和包含异山梨醇1的二醇组分， 4-环己烷二甲醇和乙二醇。共聚聚酯热收缩膜的收缩起始温度等于或高于60℃，最大热收缩率在60至70℃时小于2％，最大热收缩率为50至 90％在90至100℃

5. 发明授权

US08633295B2 Blend of polylactic acid resin and copolyester resin, and molded product using same 有权
标题翻译：聚乳酸树脂和共聚酯树脂的共混物，以及使用它们的成型体
公开(公告)号：US08633295B2
公开(公告)日：2014-01-21
申请号：US13698930
申请日：2011-05-19
申请人： Roy Lee , Jong-Ryang Kim , Kye-Yune Lee , Jong-Wook Shin , Young-Man Yoo
发明人： Roy Lee , Jong-Ryang Kim , Kye-Yune Lee , Jong-Wook Shin , Young-Man Yoo
IPC分类号： C08L67/04 , C08L67/03 , C08J5/00
CPC分类号： C08L67/02 , C08L67/04 , C08L2666/18
摘要： A blend of polylactic acid resin and copolyester resin and a molded article using the same having superior impact resistance and heat resistance are disclosed. The blend of polylactic acid resin and copolyester resin includes: 5 to 95 weight % of polylactic acid resin; and 5 to 95 weight % of copolyester resin which is a copolymerization product of an acid component including terephthalic acid and a diol component including 5 to 99 mol % of 1,4-cyclohexanedimethanol and 1 to 60 mol % of isosorbide(bio monomer), and has a repeated structure of an acid moiety derived from the acid component and a diol moiety derived from the diol component.
摘要翻译：公开了聚乳酸树脂和共聚酯树脂的共混物和具有优异的耐冲击性和耐热性的使用该共聚酯树脂的模塑制品。聚乳酸树脂和共聚酯树脂的共混物包括：5至95重量％的聚乳酸树脂; 和5〜95重量％的共聚酯树脂，其为包含对苯二甲酸的酸成分和包含5〜99摩尔％的1,4-环己烷二甲醇和1〜60摩尔％的异山梨醇（生物单体）的二醇成分的共聚产物，并且具有衍生自酸组分的酸部分和衍生自二醇组分的二醇部分的重复结构。

6. 发明申请

US20130072642A1 BLEND OF POLYLACTIC ACID RESIN AND COPOLYESTER RESIN, AND MOLDED PRODUCT USING SAME 有权
标题翻译：聚乳酸树脂和共聚酯树脂的混合物，以及使用其的成型产品
公开(公告)号：US20130072642A1
公开(公告)日：2013-03-21
申请号：US13698930
申请日：2011-05-19
申请人： Roy Lee , Jong-Ryang Kim , Kye-Yune Lee , Jong-Wook Shin , Young-Man Yoo
发明人： Roy Lee , Jong-Ryang Kim , Kye-Yune Lee , Jong-Wook Shin , Young-Man Yoo
IPC分类号： C08L67/04 , C08L67/03
CPC分类号： C08L67/02 , C08L67/04 , C08L2666/18
摘要： A blend of polylactic acid resin and copolyester resin and a molded article using the same having superior impact resistance and heat resistance are disclosed. The blend of polylactic acid resin and copolyester resin includes: 5 to 95 weight % of polylactic acid resin; and 5 to 95 weight % of copolyester resin which is a copolymerization product of an acid component including terephthalic acid and a diol component including 5 to 99 mol % of 1,4-cyclohexanedimethanol and 1 to 60 mol % of isosorbide(bio monomer), and has a repeated structure of an acid moiety derived from the acid component and a diol moiety derived from the diol component.
摘要翻译：公开了聚乳酸树脂和共聚酯树脂的共混物和具有优异的耐冲击性和耐热性的使用该共聚酯树脂的模塑制品。聚乳酸树脂和共聚酯树脂的共混物包括：5至95重量％的聚乳酸树脂; 和5〜95重量％的共聚酯树脂，其为包含对苯二甲酸的酸成分和包含5〜99摩尔％的1,4-环己烷二甲醇和1〜60摩尔％的异山梨醇（生物单体）的二醇成分的共聚产物，并且具有衍生自酸组分的酸部分和衍生自二醇组分的二醇部分的重复结构。

7. 发明申请

US20120177854A1 POLYESTER RESIN AND METHOD FOR PREPARING THE SAME 审中-公开
标题翻译：聚酯树脂及其制备方法
公开(公告)号：US20120177854A1
公开(公告)日：2012-07-12
申请号：US13394805
申请日：2010-09-13
申请人： Roy Lee , Jong-Ryang Kim , Jae-Bong Lim , Won-Jae Yoon , Dong-Jin Kim , Jyu-Tae Park , Yoo-Jin Lee
发明人： Roy Lee , Jong-Ryang Kim , Jae-Bong Lim , Won-Jae Yoon , Dong-Jin Kim , Jyu-Tae Park , Yoo-Jin Lee
IPC分类号： C08G63/672 , B32B1/02
CPC分类号： C08G63/672 , C08G63/78 , G06F8/65 , Y10T428/1352
摘要： A polyester resin copolymerized with isosorbide and 1,4-cyclohexane dimethanol and having an improved impact strength, and a method for preparing the same are disclosed. The copolymerized polyester resin has an alternating structure of acid moieties which are derived from acid components and diol moieties which are derived from diol components, wherein the acid components comprise terephthalic acid, and the diol components comprise (i) 5˜99 mol % of 1,4-cyclohexanedimethanol and (ii) 1˜60 mol % of isosorbide with respect to the total diol components.
摘要翻译：与异山梨醇和1,4-环己烷二甲醇共聚并具有改善的冲击强度的聚酯树脂及其制备方法。共聚聚酯树脂具有衍生自酸组分的酸性部分和衍生自二醇组分的二醇部分的交替结构，其中酸组分包括对苯二甲酸，并且二醇组分包含（i）5〜99mol％的1 ，4-环己烷二甲醇和（ii）1至60摩尔％的异山梨醇相对于总二醇组分。

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