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    • 3. 发明申请
    • METHOD FOR EXTRACTING INFORMATION FOR A CIRCUIT DESIGN
    • 提取电路设计信息的方法
    • US20120180013A1
    • 2012-07-12
    • US13427486
    • 2012-03-22
    • David J. WidigerRonald D. RoseSandy K. KaoLewis W. Dewey, IIIGerald F. Plumb
    • David J. WidigerRonald D. RoseSandy K. KaoLewis W. Dewey, IIIGerald F. Plumb
    • G06F17/50
    • G06F17/5036
    • The present disclosure is directed to a method for extracting information for a circuit design. The method includes establishing a reflexive relationship between a plurality of design shapes corresponding to a plurality of circuit components in the circuit design. The method includes receiving a design change for at least one design shape of the plurality of design shapes. The method includes identifying a set of changed shapes, a set of affected shapes, and a set of involved shapes. The method includes extracting at least one of a capacitance, an inductance or a resistance for the updated circuit design based on at least one of the set of changed shapes, the set of affected shapes and the set of involved shapes. The method includes updating the plurality of circuit components in the circuit design based on at least one of the set of changed shapes and the set of affected shapes.
    • 本公开涉及一种用于提取电路设计的信息的方法。 该方法包括在与电路设计中的多个电路部件相对应的多个设计形状之间建立反射关系。 该方法包括接收多个设计形状的至少一个设计形状的设计变化。 该方法包括识别一组改变的形状,一组受影响的形状以及一组涉及的形状。 该方法包括基于变化的形状,受影响的形状的集合和所涉及的形状的集合中的至少一个来提取用于更新的电路设计的电容,电感或电阻中的至少一个。 所述方法包括基于所述一组改变的形状和所述一组受影响的形状中的至少一个来更新所述电路设计中的所述多个电路部件。
    • 5. 发明授权
    • Method for extracting information for a circuit design
    • 电路设计信息提取方法
    • US08612918B2
    • 2013-12-17
    • US13427486
    • 2012-03-22
    • David J. WidigerRonald D. RoseSandy K KaoLewis W Dewey, IIIGerald F Plumb
    • David J. WidigerRonald D. RoseSandy K KaoLewis W Dewey, IIIGerald F Plumb
    • G06F17/50
    • G06F17/5036
    • The present disclosure is directed to a method for extracting information for a circuit design. The method includes establishing a reflexive relationship between a plurality of design shapes corresponding to a plurality of circuit components in the circuit design. The method includes receiving a design change for at least one design shape of the plurality of design shapes. The method includes identifying a set of changed shapes, a set of affected shapes, and a set of involved shapes. The method includes extracting at least one of a capacitance, an inductance or a resistance for the updated circuit design based on at least one of the set of changed shapes, the set of affected shapes and the set of involved shapes. The method includes updating the plurality of circuit components in the circuit design based on at least one of the set of changed shapes and the set of affected shapes.
    • 本公开涉及一种用于提取电路设计的信息的方法。 该方法包括在与电路设计中的多个电路部件相对应的多个设计形状之间建立反射关系。 该方法包括接收多个设计形状的至少一个设计形状的设计变化。 该方法包括识别一组改变的形状,一组受影响的形状以及一组涉及的形状。 该方法包括基于变化的形状,受影响的形状的集合和所涉及的形状的集合中的至少一个来提取用于更新的电路设计的电容,电感或电阻中的至少一个。 所述方法包括基于所述一组改变的形状和所述一组受影响的形状中的至少一个来更新所述电路设计中的所述多个电路部件。
    • 8. 发明授权
    • Rapid estimation of temperature rise in wires due to Joule heating
    • 快速估算由于焦耳加热引起的电线温升
    • US08640062B2
    • 2014-01-28
    • US13157980
    • 2011-06-10
    • Kanak B. AgarwalSani R. NassifRonald D. RoseChenggang Xu
    • Kanak B. AgarwalSani R. NassifRonald D. RoseChenggang Xu
    • G06F17/50
    • G06F17/5036G06F17/5018
    • A mechanism is provided for rapid estimation of temperature rise in wires due to Joule heating. The mechanism provides fast and accurate estimation of temperature rise in wires due to self heating. Fast estimation is important to handle millions of nets at the full-chip level. The mechanism models lateral heat flow by considering longitudinal heat flow along the wire and lateral thermal coupling to the other wires in the same level. Lateral heat flow can have a significant effect on the temperature rise. The mechanism also models vertical heat flow to the substrate and the heat sink by considering thermal conductivities of vias and inter-layer dielectric (ILD). The mechanism efficiently solves the thermal system to enable physical design optimizations (e.g., wire sizing, etc.) for fixing electromigration violations.
    • 提供了一种用于快速估计由于焦耳加热引起的电线温升的机制。 该机构可以快速,准确地估计由于自加热引起的导线温升。 快速估计对于在全芯片级处理数百万网络很重要。 该机制通过考虑沿着导线的纵向热流动并在同一水平的横向热耦合到另一条导线来模拟横向热流。 横向热流可以对温升产生显着影响。 该机制还通过考虑通孔和层间电介质(ILD)的热导率来模拟垂直热流到衬底和散热片。 该机制有效地解决了热系统,以实现用于固定电迁移违规的物理设计优化(例如,线尺寸等)。
    • 10. 发明申请
    • Rapid Estimation of Temperature Rise in Wires Due to Joule Heating
    • 由于焦耳加热引起的电线温升的快速估计
    • US20120317529A1
    • 2012-12-13
    • US13157980
    • 2011-06-10
    • Kanak B. AgarwalSani R. NassifRonald D. RoseChenggang Xu
    • Kanak B. AgarwalSani R. NassifRonald D. RoseChenggang Xu
    • G06F17/50G06F9/455
    • G06F17/5036G06F17/5018
    • A mechanism is provided for rapid estimation of temperature rise in wires due to Joule heating. The mechanism provides fast and accurate estimation of temperature rise in wires due to self heating. Fast estimation is important to handle millions of nets at the full-chip level. The mechanism models lateral heat flow by considering longitudinal heat flow along the wire and lateral thermal coupling to the other wires in the same level. Lateral heat flow can have a significant effect on the temperature rise. The mechanism also models vertical heat flow to the substrate and the heat sink by considering thermal conductivities of vias and inter-layer dielectric (ILD). The mechanism efficiently solves the thermal system to enable physical design optimizations (e.g., wire sizing, etc.) for fixing electromigration violations.
    • 提供了一种用于快速估计由于焦耳加热引起的电线温升的机制。 该机构可以快速,准确地估计由于自加热引起的导线温升。 快速估计对于在全芯片级处理数百万网络很重要。 该机制通过考虑沿着导线的纵向热流动并在同一水平的横向热耦合到另一条导线来模拟横向热流。 横向热流可以对温升产生显着影响。 该机制还通过考虑通孔和层间电介质(ILD)的热导率来模拟垂直热流到衬底和散热片。 该机制有效地解决了热系统,以实现用于固定电迁移违规的物理设计优化(例如,线尺寸等)。