专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09017528B2 Electro chemical deposition and replenishment apparatus 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US09017528B2
公开(公告)日：2015-04-28
申请号：US13445217
申请日：2012-04-12
申请人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
发明人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
IPC分类号： C25D17/00 , C25D21/18 , C25D21/22 , C25D21/10 , C25D7/12 , C25D17/06
CPC分类号： C25D21/22 , C25D17/001 , C25D17/002 , C25D17/06 , C25D21/10
摘要： A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
摘要翻译：一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块，所述补充模块具有第二阳极。处理电解质再循环隔室设置在框架中，其被构造成使得处理电解质在补充模块和沉积设备之间循环。阳极室耦合到具有第二阳极（即可溶性阳极）的工艺电解质再循环室，用于浸渍在次级阳极液中，并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。阴极室设置在耦合到处理电解质再循环隔间的框架中，该隔室具有用于浸入次级阴极电解液中的第二阴极，并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。

2. 发明申请

US20120298504A1 Electro chemical deposition and replenishment apparatus 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US20120298504A1
公开(公告)日：2012-11-29
申请号：US13445457
申请日：2012-04-12
申请人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
发明人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
IPC分类号： C25B9/08
CPC分类号： C25D21/22 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
摘要翻译：一种适于将金属沉积在基底表面上的电化学沉积装置，该装置具有构造成保持工艺电解质的框架。衬底保持器可移除地联接到框架，衬底保持器将衬底支撑在处理电解质中。阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极，阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜，阳极流体隔室作为与离子交换膜和阳极的单元从框架中移除。保持器，阳极和膜被布置在框架中，使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。

3. 发明授权

US09005409B2 Electro chemical deposition and replenishment apparatus 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US09005409B2
公开(公告)日：2015-04-14
申请号：US13445457
申请日：2012-04-12
申请人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
发明人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
IPC分类号： C25D17/02 , C25D21/22 , C25D17/00 , C25D7/12
CPC分类号： C25D21/22 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
摘要翻译：一种适于将金属沉积在基底表面上的电化学沉积装置，该装置具有构造成保持工艺电解质的框架。衬底保持器可移除地联接到框架，衬底保持器将衬底支撑在处理电解质中。阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极，阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜，阳极流体隔室作为与离子交换膜和阳极的单元从框架中移除。保持器，阳极和膜被布置在框架中，使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。

4. 发明申请

US20120298502A1 ELECTRO CHEMICAL DEPOSITION AND REPLENISHMENT APPARATUS 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US20120298502A1
公开(公告)日：2012-11-29
申请号：US13445217
申请日：2012-04-12
申请人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
发明人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
IPC分类号： C25B15/08
CPC分类号： C25D21/22 , C25D17/001 , C25D17/002 , C25D17/06 , C25D21/10
摘要： A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
摘要翻译：一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块，所述补充模块具有第二阳极。处理电解质再循环隔室设置在框架中，其被构造成使得处理电解质在补充模块和沉积设备之间循环。阳极室耦合到具有第二阳极（即可溶性阳极）的工艺电解质再循环室，用于浸渍在次级阳极液中，并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。阴极室设置在耦合到处理电解质再循环隔间的框架中，该隔室具有用于浸入次级阴极电解液中的第二阴极，并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。

5. 发明申请

US20110240481A1 SEED LAYER DEPOSITION IN MICROSCALE FEATURES 有权
标题翻译：微粒特征中的种子层沉积
公开(公告)号：US20110240481A1
公开(公告)日：2011-10-06
申请号：US12755198
申请日：2010-04-06
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76873 , H01L21/76898 , H01L2221/1089
摘要： A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.
摘要翻译：一种用于涂覆微孔孔特征的内表面的方法和系统，其制造成工件的基本平坦的表面。该方法包括提供具有阻挡金属涂层的工件，所述阻挡金属涂层沿着工件的平坦表面和微孔特征的内表面基本上连续且均匀，其中所述阻挡金属涂层通过基本上表面反应限制的工艺。工件在工件的平坦表面上设置有锚固到阻挡金属涂层的厚金属层并且设置成为位于整个和跨过工件的微尺度特征提供基本均匀的导电能力的涂层。在工件周边处的导电涂层上提供电接触路径。将工件浸入化学浴中，使所述化学浴与微孔特征的内表面完全接触，所述化学浴含有适合于电沉积的金属离子。在工件的周边施加电势，使金属离子在工件的所有表面上电沉积，包括微孔孔特征的内表面到一个步骤中的预定的涂层。

6. 发明授权

US09714474B2 Seed layer deposition in microscale features 有权
公开(公告)号：US09714474B2
公开(公告)日：2017-07-25
申请号：US12755198
申请日：2010-04-06
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D7/12 , H01L21/288 , H01L21/768 , C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76873 , H01L21/76898 , H01L2221/1089
摘要： A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.

7. 发明申请

US20120152752A1 SEED LAYER DEPOSITION IN MICROSCALE FEATURES 审中-公开
标题翻译：微粒特征中的种子层沉积
公开(公告)号：US20120152752A1
公开(公告)日：2012-06-21
申请号：US12971744
申请日：2010-12-17
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D5/00 , C25D5/48 , C25D5/02
CPC分类号： C25D5/02 , C25D5/10 , C25D5/50 , H01L24/11 , H01L2224/11462 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2924/01322 , H01L2924/14 , H01L2924/00 , H01L2224/1146
摘要： A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.
摘要翻译：提供了一种在沉积工件上形成金属特征的方法。该方法包括在工件上提供用于焊接电子器件的凸块下金属层，将基本上纯的锡层直接沉积到凸块下金属层上，并将锡银合金层沉积到基本上纯的锡层上。

8. 发明授权

US09257319B2 Parallel single substrate processing system with alignment features on a process section frame 有权
标题翻译：平行单基板处理系统，具有过程段框架上的对准特征
公开(公告)号：US09257319B2
公开(公告)日：2016-02-09
申请号：US13488297
申请日：2012-06-04
申请人： Arthur Keigler
发明人： Arthur Keigler
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces and a substrate holder assembly having a number of substrate holders and configured for transporting substrates as a unit. The substrate holder assembly and each of the substrate holders are configured for removable coupling to the process section frame, each substrate holder configured to hold at least one of the substrates. The process section frame has alignment features disposed so that, on coupling of the substrate holder assembly with the process section frame, the alignment features interface with each substrate holder of the substrate holder assembly and locate each substrate holder in repeatable alignment, at corresponding coupling of each substrate holder and the process section frame, with respect to a predetermined feature of the process section.
摘要翻译：一种用于流体处理衬底表面的系统，其布置在具有工艺部分的流体中，所述工艺部分具有框架，所述工艺部分具有多个工艺元件，以处理衬底表面而不接触衬底表面;以及衬底保持器组件，其具有多个衬底保持器并且构造成用于传送作为一个单位。衬底保持器组件和每个衬底保持器被构造成用于可移除地连接到工艺段框架，每个衬底保持器被配置成保持至少一个衬底。处理部分框架具有对准特征，其布置成使得在衬底保持器组件与过程部分框架的联接时，对准特征与衬底保持器组件的每个衬底保持器接合并且将每个衬底保持器定位成可重复对准，每个衬底保持器和处理部分框架相对于处理部分的预定特征。

9. 发明授权

US09117856B2 Substrate loader and unloader having an air bearing support 有权
标题翻译：底板装载机和卸载机具有空气轴承支撑
公开(公告)号：US09117856B2
公开(公告)日：2015-08-25
申请号：US13279414
申请日：2011-10-24
申请人： Daniel Goodman , Arthur Keigler , Freeman Fisher
发明人： Daniel Goodman , Arthur Keigler , Freeman Fisher
IPC分类号： A47J45/00 , H01L21/67 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67092 , H01L21/6838 , H01L21/68764 , H01L21/68785
摘要： A substrate separation chuck which is adapted to separate a substrate from an adhering surface. The substrate separation chuck has a support adapted to support the adhering surface. An air bearing surface is adapted to support the substrate, the air bearing surface axially moveable relative to the support. The air bearing surface has a first position adjacent the substrate with the substrate coupled to the adhering surface. The air bearing surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the air bearing surface.
摘要翻译：一种衬底分离卡盘，其适于将基底与粘附表面分离。衬底分离卡盘具有适于支撑粘附表面的支撑件。空气轴承表面适于支撑基底，空气轴承表面相对于支撑件可轴向移动。空气轴承表面具有与衬底相邻的第一位置，衬底与粘附表面相连。空气轴承表面可以从第一位置移动到第二位置，从而将基板与粘合表面分离，而不会在基板和空气轴承表面之间接触。

10. 发明授权

US08512543B2 Method for fluid processing a workpiece 有权
标题翻译：流体处理工件的方法
公开(公告)号：US08512543B2
公开(公告)日：2013-08-20
申请号：US12963991
申请日：2010-12-09
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： C25D5/08 , C25D7/12 , H01L21/00
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.
摘要翻译：一种流体处理半导体工件的方法，包括将具有能够容纳流体的壳体布置在工件夹持器上，保持工件的工件保持器，提供连接到壳体的搅拌系统，并且包括设置在壳体内的邻近工件保持器的构件并且通过以非均匀的振荡运动基本上平行于工件的表面移动构件来搅动流体，该非均匀振荡运动是一系列基本上连续的几何非对称振荡，其中该系列的每个连续振荡是几何不对称的具有至少两个基本上连续的相对冲程，其中基本上连续的不对称振荡的每个基本上连续行程的反转位置相对于振荡的每个紧接在前的基本上连续的行程的中心点非对称地设置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式