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    • 4. 发明申请
    • Flexible Circuit Electrode Array
    • 柔性电路电极阵列
    • US20090264972A1
    • 2009-10-22
    • US12163658
    • 2008-06-27
    • David Daomin ZhouRobert J. GreenbergJordan Matthew NeysmithBoon-Khai NgJames Singleton Little
    • David Daomin ZhouRobert J. GreenbergJordan Matthew NeysmithBoon-Khai NgJames Singleton Little
    • A61N1/05B29C70/88B05D5/12
    • A61N1/0543A61N1/0541H05K1/036H05K1/0393H05K1/118H05K3/28H05K2201/0133H05K2201/0195Y10T156/1002
    • A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) depositing a second soft polymer layer on the top polymer layer; (f) providing holes in the second soft polymer layer and in the top polymer layer for bond pads and electrodes; and (g) preparing electrodes in the provided holes.
    • 一种柔性电路电极阵列,包括:聚合物基层; 沉积在所述聚合物基层上的金属痕迹,包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及通过软聚合物的基底和顶层的部分或全部涂层。 一种制备柔性电路电极阵列的方法,包括:(a)提供第一软聚合物层; (b)在第一软聚合物层上沉积第一基底层; (c)在基层上提供金属薄膜; (d)在金属薄膜上沉积顶部聚合物层; (e)在顶部聚合物层中提供孔; (f)在顶部聚合物层上沉积第二软聚合物层; (g)在第二软聚合物层中为接合焊盘和电极提供孔; 和(h)在所提供的孔中制备电极。 一种制备柔性电路电极阵列的方法,包括:(a)提供第一软聚合物层; (b)在第一软聚合物层上沉积第一基底层; (c)在基层上提供金属薄膜; (d)在金属薄膜上沉积顶部聚合物层; (e)在顶部聚合物层上沉积第二软聚合物层; (f)在第二软聚合物层和顶部聚合物层中提供用于接合焊盘和电极的孔; 和(g)在所提供的孔中制备电极。