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    • 5. 发明授权
    • Method of making porous silicon carbide bodies
    • 制造多孔碳化硅体的方法
    • US4564496A
    • 1986-01-14
    • US742654
    • 1985-06-10
    • Ashok K. GuptaErno GyarmatiHermann KreutzRudolf MunzerAristides NaoumidisHubertus Nickel
    • Ashok K. GuptaErno GyarmatiHermann KreutzRudolf MunzerAristides NaoumidisHubertus Nickel
    • C04B38/00C04B35/573C04B41/50C01B31/36
    • C04B41/009C04B35/573C04B38/00C04B41/5059
    • Porous silicon carbide bodies are obtained by starting with a powder of particle size falling within a single sieve mesh range fraction and consisting either entirely of carbon particles or a mixture of carbon and silicon carbide particles of the same mesh fraction is mixed or coated with 15 to 30% by weight of a binder, moulded to shape, warmed in the temperature range from 40.degree. to 200.degree. C. to vaporize volatile material and then coked at a temperature rising to 850.degree. C. Then it is siliconized by raising the temperature to the range from 1650.degree. to 1950.degree. C. with gaseous silicon or impregnated with silicon by dipping the body into a silicon melt and convert it to carbide, with the excess silicon thereafter being removed by vaporizing out or by boiling in lye. Sieve mesh fractions in the region of a few hundred .mu.m are preferred, and the density of the porous body after pressing but before siliconizing should lie in the neighborhood of 0.6 to 0.7 g/cm.sup.3.
    • 多孔碳化硅体是通过以粒度落入单一筛网范围级分的粉末开始获得的,并且完全由碳颗粒组成,或者将相同网眼级分的碳和碳化硅颗粒的混合物混合或涂覆至15至 30重量%的粘合剂,模塑成型,在40℃至200℃的温度范围内加热,蒸发挥发性物质,然后在升至850℃的温度下焦化。然后将其升温至 通过将体积浸入硅熔体中并将其转化为碳化物,然后通过蒸发或通​​过在碱液中沸腾而除去过量的硅,从1650℃至1950℃的范围内,用气态硅或硅浸渍。 优选在几百微米范围内的筛网部分,压制后但在硅化之前的多孔体的密度应在0.6至0.7克/厘米3附近。
    • 6. 发明授权
    • Control device
    • 控制装置
    • US4381835A
    • 1983-05-03
    • US137524
    • 1980-04-04
    • Hasmukh R. ShahAshok K. Gupta
    • Hasmukh R. ShahAshok K. Gupta
    • G07F5/22G07F5/24G07F9/00
    • G07F5/24
    • A control device for a vending machine for setting prices and storing prices in a memory with a price-setting mode, a price verification mode and a product-vending mode. In the product-vending mode, actuation of a selection switch provides a momentary pulse through the vending circuit to enable a price to be loaded into a register for subsequent comparison with accumulated credit. That pulse is so short that a product is not vended; but it is sufficiently large to keep leakage from simulating it. Switches select the locations in memory where prices are stored, and further switches are provided to set the prices in those locations. The control device automatically responds to actuation of any of these switches to shift from the product-vending to the price-setting mode. Coin tube inventory switches are provided which have a dual function, namely, effecting emptying of the coin tubes and also placing the control device in the price verification mode. The control device is also responsive to the insertion of a coin or to the pressing of the cancel sale button to automatically take the vending machine out of the price-setting or price verification mode and place it in the product-vending mode. In the product-vending mode, the availability of coins will determine which coins will be used in dispensing the change -- three dimes being used to provide thirty cents in change if the nickel tube is empty.
    • 一种用于自动售货机的控制装置,用于在价格设定模式,价格验证模式和产品自动售货模式下设置价格和存储价格。 在产品自动售货模式中,选择开关的启动提供通过售卖电路的瞬时脉冲,以便能够将价格加载到寄存器中,以便随后与累积信用进行比较。 那个脉搏太短,一个产品没有销售; 但是足够大以防止模拟它的泄漏。 开关选择内存中存储价格的位置,并提供另外的开关来设置这些位置的价格。 控制装置自动响应任何这些开关的致动,以从产品销售转向价格设定模式。 提供了具有双重功能的投币管库存开关,即实现对硬币管的排空以及将控制装置置于价格验证模式。 控制装置还响应于硬币的插入或取消销售按钮的按压,以自动将自动售货机取消价格设定或价格验证模式并将其置于产品售货模式。 在产品自动售货模式中,硬币的可用性将决定哪些硬币将用于分配更换 - 如果镍管为空,则使用三个暗盒提供三十分之一更改。
    • 9. 发明授权
    • Method of molding bonded parts with silicon carbide surfaces
    • 用碳化硅表面模制粘结部件的方法
    • US4526649A
    • 1985-07-02
    • US594571
    • 1984-03-29
    • Ashok K. GuptaErno GyarmatiRudolf MunzerAristides Naoumidis
    • Ashok K. GuptaErno GyarmatiRudolf MunzerAristides Naoumidis
    • C04B35/573C04B37/00B44C1/22C03B29/00C03C15/00C03C25/06
    • C04B37/005C04B35/573C04B2237/083C04B2237/086C04B2237/365C04B2237/60
    • For joining molded parts having silicon carbide surfaces, the surfaces are first roughened to a depth of about 100-500 .mu.m by removal of the free silicon either by vaporization or by etching when treating silicon containing silicon carbide layers containing at least 15% weight of excessive silicon. In the alternative, when no excessive silicon is present, the roughening can be done by laser shots pitting the surface. The pores provided by such a step are then loaded with carbon by (repeated) application of a cokable resin followed by coking, said resin can be soaked into the pores or attached as silicon containing resin wafer of cokable material. The surfaces to be joined are united and are heated, preferably at from 1600.degree. to 1800.degree. C. in the presence of silicon that is either made available at the edges of the joint as a liquid or else has been provided in the joint by a synthetic resin foil in which silicon powder is dispersed.
    • 为了连接具有碳化硅表面的模制零件,首先通过汽化或通过蚀刻处理含有至少15重量%的含硅碳化物层的含硅碳化物层,通过除去游离硅来使表面粗糙至约100-500μm的深度 过多的硅。 或者,当不存在过量的硅时,粗糙化可以通过点击表面的激光射击来完成。 然后通过(重复)施加可塑性树脂,然后通过焦化将由这样的步骤提供的孔加载碳,所述树脂可以浸泡到孔中或作为含有可溶性材料的含硅树脂晶片附着。 待连接的表面被联合并且在硅存在下被优选地在1600℃至1800℃下加热,所述硅存在于作为液体的接头边缘处,或者在接头中被提供在一个 分散硅粉的合成树脂箔。