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    • 3. 发明申请
    • Multi-Thickness Semiconductor With Fully Depleted Devices And Photonic Integration
    • 具有完全耗尽器件和光子集成的多厚度半导体
    • US20110039388A1
    • 2011-02-17
    • US12913187
    • 2010-10-27
    • Craig M. HILLAndrew TS POMERENEDaniel N. CAROTHERSTimothy J. CONWAYVu A. VU
    • Craig M. HILLAndrew TS POMERENEDaniel N. CAROTHERSTimothy J. CONWAYVu A. VU
    • H01L21/336H01L21/762
    • H01L21/84G02B6/136H01L27/1203H01L2924/0002H01L2924/00
    • Techniques are disclosed that facilitate fabrication of semiconductors including structures and devices of varying thickness. One embodiment provides a method for semiconductor device fabrication that includes thinning a region of a semiconductor wafer upon which the device is to be formed thereby defining a thin region and a thick region of the wafer. The method continues with forming on the thick region one or more photonic devices and/or partially depleted electronic devices, and forming on the thin region one or more fully depleted electronic devices. Another embodiment provides a semiconductor device that includes a semiconductor wafer defining a thin region and a thick region. The device further includes one or more photonic devices and/or partially depleted electronic devices formed on the thick region, and one or more fully depleted electronic devices formed on the thin region. An isolation area can be formed between the thin region and the thick region.
    • 公开了促进包括不同厚度的结构和器件的半导体的制造的技术。 一个实施例提供了一种用于半导体器件制造的方法,其包括使要形成器件的半导体晶片的区域变薄从而限定晶片的薄区域和厚区域。 该方法继续在厚区域上形成一个或多个光子器件和/或部分耗尽的电子器件,并且在薄区域上形成一个或多个完全耗尽的电子器件。 另一个实施例提供一种半导体器件,其包括限定薄区域和厚区域的半导体晶片。 该器件还包括形成在厚区域上的一个或多个光子器件和/或部分耗尽的电子器件,以及形成在薄区域上的一个或多个完全耗尽的电子器件。 可以在薄区域和厚区域之间形成隔离区域。