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    • 1. 发明授权
    • Method of integrating slotted waveguide into CMOS process
    • 将开槽波导集成到CMOS工艺中的方法
    • US08513037B2
    • 2013-08-20
    • US13580872
    • 2011-12-02
    • Andrew T S PomereneCraig M. HillTimothy J. ConwayStewart L. Ocheltree
    • Andrew T S PomereneCraig M. HillTimothy J. ConwayStewart L. Ocheltree
    • H01P1/15
    • H01L27/13H01L21/84H01L27/1463H01L27/14683
    • A method for integrating a slotted waveguide into a CMOS process is disclosed. A slot can be patterned on a SOI wafer by etching a first pad hard mask deposited over the wafer. The slot is then filled with a nitride plug material by depositing a second pad hard mask over the first pad hard mask. A waveguide in association with one or more electronic and photonic devices can also be patterned on the SOI wafer. The trenches can be filled with an isolation material and then polished. Thereafter, the first and second pad hard masks can be stripped from the wafer. The slot can once again be filled with the nitride plug material and patterned. After forming one or more electronic and photonic devices on the wafer using a standard CMOS process, a via can be opened down to the nitride plug and the nitride plug can then be removed.
    • 公开了一种将时隙波导集成到CMOS工艺中的方法。 通过蚀刻沉积在晶片上的第一焊盘硬掩模,可以在SOI晶片上图案化槽。 然后通过在第一焊盘硬掩模上沉积第二焊盘硬掩模,然后用氮化物塞材料填充槽。 与一个或多个电子和光子器件相关联的波导也可以在SOI晶片上图案化。 沟槽可以用隔离材料填充,然后抛光。 此后,可以从晶片剥离第一和第二焊盘硬掩模。 该槽可再次填充氮化物塞材料并图案化。 在使用标准CMOS工艺在晶片上形成一个或多个电子和光子器件之后,可以将通孔向下打开到氮化物塞,然后可以去除氮化物塞。
    • 3. 发明申请
    • Multi-Thickness Semiconductor with Fully Depleted Devices and Photonic Integration
    • 具有完全耗尽器件和光子整合的多厚度半导体
    • US20100140708A1
    • 2010-06-10
    • US12328853
    • 2008-12-05
    • Craig M. HillAndrew T. PomereneDaniel N. CarothersTimothy J. ConwayVu A. Vu
    • Craig M. HillAndrew T. PomereneDaniel N. CarothersTimothy J. ConwayVu A. Vu
    • H01L27/12H01L21/84
    • H01L21/84G02B6/136H01L27/1203H01L2924/0002H01L2924/00
    • Techniques are disclosed that facilitate fabrication of semiconductors including structures and devices of varying thickness. One embodiment provides a method for semiconductor device fabrication that includes thinning a region of a semiconductor wafer upon which the device is to be formed thereby defining a thin region and a thick region of the wafer. The method continues with forming on the thick region one or more photonic devices and/or partially depleted electronic devices, and forming on the thin region one or more fully depleted electronic devices. Another embodiment provides a semiconductor device that includes a semiconductor wafer defining a thin region and a thick region. The device further includes one or more photonic devices and/or partially depleted electronic devices formed on the thick region, and one or more fully depleted electronic devices formed on the thin region. An isolation area can be formed between the thin region and the thick region.
    • 公开了促进包括不同厚度的结构和器件的半导体的制造的技术。 一个实施例提供了一种用于半导体器件制造的方法,其包括使要形成器件的半导体晶片的区域变薄从而限定晶片的薄区域和厚区域。 该方法继续在厚区域上形成一个或多个光子器件和/或部分耗尽的电子器件,并且在薄区域上形成一个或多个完全耗尽的电子器件。 另一个实施例提供一种半导体器件,其包括限定薄区域和厚区域的半导体晶片。 该器件还包括形成在厚区域上的一个或多个光子器件和/或部分耗尽的电子器件,以及形成在薄区域上的一个或多个完全耗尽的电子器件。 可以在薄区域和厚区域之间形成隔离区域。
    • 4. 发明授权
    • Methods and apparatus for monitoring system performance
    • 监测系统性能的方法和装置
    • US5067099A
    • 1991-11-19
    • US335464
    • 1989-04-10
    • Patricia M. McCownTimothy J. ConwayKarl M. Jessen
    • Patricia M. McCownTimothy J. ConwayKarl M. Jessen
    • G06F11/22G06F11/25G06F11/34
    • G06F11/2257G06F11/34
    • Method and apparatus for performing system monitoring and diagnostics is disclosed. In performing system monitoring, data is acquired from the system under test and compared to an event model. The event model comprises a database having event records which pre-define events which can occur. Each event record includes a state vector dependency which lists the events which must occur prior to the pre-defined event occurring and one or more critical parameters defining the data which must occur during the system's performance for the event to have occurred. Event recognition is performed by comparing each event record to acquired operational data and to events already recognized. Associated with each event record in the database is an intelligent data acquisition action which defines an action to be taken as a result of the event record being recognized. These actions can modify the performance of the system being monitored or the acquisition of data. Additionally, the results of the event recognition step can be further analyzed in a computer.
    • 公开了用于执行系统监视和诊断的方法和装置。 在执行系统监视时,从被测系统中获取数据,并与事件模型进行比较。 事件模型包括具有预定义可能发生的事件的事件记录的数据库。 每个事件记录包括一个状态向量依赖关系,其列出必须在预定义事件发生之前发生的事件以及一个或多个关键参数,该关键参数定义在系统执行事件期间必须发生的数据。 通过将每个事件记录与获取的操作数据和已经识别的事件进行比较来执行事件识别。 与数据库中的每个事件记录相关联的是智能数据采集动作,其定义由于识别事件记录而被采取的动作。 这些操作可以修改正在监视的系统或数据采集的性能。 此外,可以在计算机中进一步分析事件识别步骤的结果。
    • 6. 发明授权
    • Multi-thickness semiconductor with fully depleted devices and photonic integration
    • 具有完全耗尽器件和光子整合的多厚度半导体
    • US07847353B2
    • 2010-12-07
    • US12328853
    • 2008-12-05
    • Craig M. HillAndrew T. PomereneDaniel N. CarothersTimothy J. ConwayVu A. Vu
    • Craig M. HillAndrew T. PomereneDaniel N. CarothersTimothy J. ConwayVu A. Vu
    • H01L27/12
    • H01L21/84G02B6/136H01L27/1203H01L2924/0002H01L2924/00
    • Techniques are disclosed that facilitate fabrication of semiconductors including structures and devices of varying thickness. One embodiment provides a method for semiconductor device fabrication that includes thinning a region of a semiconductor wafer upon which the device is to be formed thereby defining a thin region and a thick region of the wafer. The method continues with forming on the thick region one or more photonic devices and/or partially depleted electronic devices, and forming on the thin region one or more fully depleted electronic devices. Another embodiment provides a semiconductor device that includes a semiconductor wafer defining a thin region and a thick region. The device further includes one or more photonic devices and/or partially depleted electronic devices formed on the thick region, and one or more fully depleted electronic devices formed on the thin region. An isolation area can be formed between the thin region and the thick region.
    • 公开了促进包括不同厚度的结构和器件的半导体的制造的技术。 一个实施例提供了一种用于半导体器件制造的方法,其包括使要形成器件的半导体晶片的区域变薄从而限定晶片的薄区域和厚区域。 该方法继续在厚区域上形成一个或多个光子器件和/或部分耗尽的电子器件,并且在薄区域上形成一个或多个完全耗尽的电子器件。 另一个实施例提供一种半导体器件,其包括限定薄区域和厚区域的半导体晶片。 该器件还包括形成在厚区域上的一个或多个光子器件和/或部分耗尽的电子器件,以及形成在薄区域上的一个或多个完全耗尽的电子器件。 可以在薄区域和厚区域之间形成隔离区域。
    • 9. 发明授权
    • Methods and apparatus for performing system fault diagnosis
    • 执行系统故障诊断的方法和装置
    • US5099436A
    • 1992-03-24
    • US266722
    • 1988-11-03
    • Patricia M. McCownTimothy J. Conway
    • Patricia M. McCownTimothy J. Conway
    • G06F11/25G06F11/34
    • G06F11/2257G06F11/34Y10S706/911
    • A diagnostic tool based on a hybrid knowledge representation of a system under test is disclosed. Data collected from the system during its operation is compared to an event based representation of the system which comprises a plurality of predefined events. An event is recognized when the collected data matches the event's critical parameter. The recognized event is analyzed and an associated set of ambiguity group effects, which specify components to be re-ranked in an ambiguity group according to an associated ranking effect. Additonally, a symptom-fault model and a failure model can be analyzed to determine symptom-fault relationships and failure modes which are applicable to the system operation. Each applicable symptom-fault relationship and failure mode is also associated with a set of ambiguity group effects which rerank the ambiguity group. A structural model is analyzed starting with the components in the ambiguity group having the greatest probability of failure. As a result of the analysis, maintenance options specifying tests to be performed on the system are output.
    • 公开了一种基于被测系统的混合知识表示的诊断工具。 在系统运行期间收集的数据与包括多个预定义事件的系统的基于事件的表示进行比较。 当收集的数据与事件的关键参数匹配时,会识别事件。 分析识别的事件和相关的一组模糊组效应,其根据相关的排序效果来指定要在歧义组中重新排列的组件。 此外,可以分析症状 - 故障模型和故障模型,以确定适用于系统操作的症状 - 故障关系和故障模式。 每个适用的症状 - 故障关系和故障模式也与重新设定歧义组的一组模糊组效应相关联。 从具有最大故障概率的模糊组中的组件开始分析结构模型。 作为分析的结果,输出指定要在系统上执行的测试的维护选项。
    • 10. 发明授权
    • Method for manufacturing multiple layers of waveguides
    • 制造多层波导的方法
    • US08192638B2
    • 2012-06-05
    • US12517692
    • 2008-08-29
    • Andrew T. S. PomereneTimothy J. ConwayCraig M. HillMark Jaso
    • Andrew T. S. PomereneTimothy J. ConwayCraig M. HillMark Jaso
    • B29D11/00G02B6/10G02F1/00
    • G02B6/12002B82Y20/00G02B6/1223G02B6/132G02B6/136
    • A method for manufacturing multiple layers of waveguides is disclosed. Initially, a first cladding layer is deposited on a substrate, a first inner cladding layer is then deposited on the first cladding layer, and a first waveguide material is deposited on the first inner cladding layer. The first inner cladding layer and the first waveguide material are then selectively etched to form a first waveguide layer. Next, a second inner cladding layer followed by a second cladding layer are deposited on the first waveguide layer. The second inner cladding layer and the second cladding layer are removed by using a chemical-mechanical polishing process selective to the first waveguide material. A third inner cladding layer followed by a second waveguide material are deposited on the first waveguide material. The third inner cladding layer and the second waveguide material are then selectively etched to form a second waveguide layer. Finally, a fourth inner cladding layer followed by a third cladding layer are deposited on the second waveguide layer.
    • 公开了制造多层波导的方法。 首先,在基板上沉积第一包层,然后在第一包层上沉积第一内包层,在第一内包层上沉积第一波导材料。 然后选择性地蚀刻第一内包层和第一波导材料以形成第一波导层。 接下来,在第一波导层上沉积第二内包层和第二覆层。 通过使用对第一波导材料选择性的化学机械抛光工艺来除去第二内包层和第二包覆层。 在第一波导材料上沉积第三内包层和第二波导材料。 然后选择性地蚀刻第三内包层和第二波导材料以形成第二波导层。 最后,在第二波导层上沉积第四内包层和第三覆层。