专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050130078A1 Plating using copolymer 有权
标题翻译：电镀使用共聚物
公开(公告)号：US20050130078A1
公开(公告)日：2005-06-16
申请号：US10733097
申请日：2003-12-10
申请人： Daniel Bedell , Gregory Breyta , Tom Harris , April Hixson-Goldsmith , Murali Ramasubramanian , Alfred Renaldo , Benjamin Wang
发明人： Daniel Bedell , Gregory Breyta , Tom Harris , April Hixson-Goldsmith , Murali Ramasubramanian , Alfred Renaldo , Benjamin Wang
IPC分类号： G03F7/00 , G03F7/085 , G03F7/09 , G03F7/11
CPC分类号： C09D125/18 , G03F7/085 , G03F7/094 , G03F7/11
摘要： Method of plating using a polymeric barrier layer including a polyphenolic polymer which has a repeating unit of the formula: wherein R1, R2, R3, R4, and R5 are individually hydrogen, a hydroxy group or an azo dye.
摘要翻译：使用包含具有下式重复单元的多酚聚合物的聚合物阻挡层的电镀方法：其中R 1，R 2，R 3， R 4，R 5和R 5分别是氢，羟基或偶氮染料。

2. 发明授权

US07001499B2 Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density 失效
标题翻译：用于电镀具有高饱和磁通密度的体心立方镍铁合金薄膜的方法
公开(公告)号：US07001499B2
公开(公告)日：2006-02-21
申请号：US10053785
申请日：2002-01-18
申请人： Mike Ming Yu Chen , Thomas Edward Dinan , April Hixson-Goldsmith , Murali Ramasubramanian , Neil Leslie Robertson
发明人： Mike Ming Yu Chen , Thomas Edward Dinan , April Hixson-Goldsmith , Murali Ramasubramanian , Neil Leslie Robertson
IPC分类号： C25D5/50
CPC分类号： G11B5/3163 , C25D3/562 , C25D5/50 , H01F10/14 , H01F10/26 , H01F41/26
摘要： A process for electroplating and annealing thin-films of nickel-iron alloys having from 63% to 81% iron content by weight to produce pole pieces having saturation flux density (BS) in the range from 1.9 to 2.3 T (19 to 23 kG) with acceptable magnetic anisotropy and magnetostriction and a coercivity (HC) no higher than 160 A/m (2 Oe). The desired alloy layer properties, including small crystal size and minimal impurity inclusions, can be produced by including higher relative levels of Fe++ ions in the electroplating bath while holding the bath at a lower temperature while plating from a suitable seed layer. The resulting alloy layer adopts a small crystal size (BCC) without significant inclusion of impurities, which advantageously permits annealing to an acceptable HC while retaining the high BS desired.
摘要翻译：电镀和退火铁含量为63％至81％的镍铁合金薄膜的方法，以产生具有饱和磁通密度（B S S S S）的范围在1.9至 2.3 T（19〜23kG）具有可接受的磁各向异性和磁致伸缩，矫顽力（H C C）不高于160A / m（2Oe）。包括小晶体尺寸和最小杂质夹杂物在内的期望的合金层性能可以通过在电镀浴中包含更高的相对水平的Fe ++离子而制备，同时将浴保持在较低温度，同时从合适的种子层。所得到的合金层采用小晶粒尺寸（BCC），而不显着地包含杂质，这有利地允许退火到可接受的H C，同时保持所需的高B S S S。

3. 发明申请

US20060171082A1 Combination patterning for magnetic head deposited shield and magnetic head made thereby 失效
标题翻译：由此形成磁头沉积屏蔽和磁头的组合图案
公开(公告)号：US20060171082A1
公开(公告)日：2006-08-03
申请号：US11047956
申请日：2005-01-31
申请人： April Hixson-Goldsmith
发明人： April Hixson-Goldsmith
IPC分类号： G11B5/33 , G11B5/127
CPC分类号： G11B5/3967 , G11B5/3163 , G11B5/3912 , Y10S29/016 , Y10T29/49032 , Y10T29/49041
摘要： A method for fabricating a non-electroplated shield using combination patterning and devices formed thereby are disclosed. The method includes depositing a metal layer, such as CZT, removing substantially 75% of the metal layer during a first phase using at least a first removal process and removing a remaining portion of the metal layer during a second phase using at least a second removal process. The first removal process may include depositing a first patterning layer, removing substantially 75% of the metal layer by ion-mill or similar technology and stripping the first patterning layer away. The second removal process may include depositing a second patterning layer and removing the remaining portion of the metal layer using a wet-etch or other etch process and removing the second patterning layer. The deposited metal layer may have a thickness up to several μm and the edges of the shield exhibit a unique step pattern that is visible in a cross-section view of the shield.
摘要翻译：公开了一种使用组合图案化制造非电镀屏蔽的方法以及由此形成的器件。该方法包括沉积诸如CZT的金属层，在第一阶段期间使用至少第一去除工艺去除基本上75％的金属层，并且在第二阶段期间使用至少第二次去除来除去金属层的剩余部分处理。第一去除方法可以包括沉积第一图案化层，通过离子磨或类似技术去除大体上75％的金属层，并剥离第一图案化层。第二去除过程可以包括沉积第二图案化层并使用湿蚀刻或其它蚀刻工艺去除金属层的剩余部分并去除第二图案形成层。沉积的金属层可以具有多达几个母体的厚度，并且屏蔽件的边缘呈现在屏蔽件的横截面视图中可见的唯一的台阶图案。

4. 发明申请

US20050219745A1 Inductive magnetic head with non-magnetic seed layer gap structure and method for the fabrication thereof 有权
标题翻译：具有非磁性种子层间隙结构的感应磁头及其制造方法
公开(公告)号：US20050219745A1
公开(公告)日：2005-10-06
申请号：US10813880
申请日：2004-03-30
申请人： April Hixson-Goldsmith , Jeffrey Lille
发明人： April Hixson-Goldsmith , Jeffrey Lille
IPC分类号： G11B5/147 , G11B5/187 , G11B5/23 , G11B5/235 , G11B5/31
CPC分类号： G11B5/235 , G11B5/187 , G11B5/3116 , G11B5/313 , Y10T29/49046
摘要： A magnetic head including first and a second magnetic poles with a write gap layer disposed therebetween. In a first embodiment the write gap layer includes a non-magnetic, non-conductive first sublayer which is preferably comprised of Ta or Ti which is deposited upon the first magnetic pole to act as an adhesion layer. The write gap layer then includes a second sublayer which is formed of a non-magnetic, electrically conductive material which is preferably comprised of Rh or Ru. A P2 pole tip is electroplated upon the second sublayer, where the electrically conductive second sublayer is utilized to conduct electroplating current. In an alternative embodiment the write gap layer includes a third sublayer that is etchable in a reactive ion etch (RIE) process, and formed between the first and second sublayers. The third sublayer is preferably comprised of Ta or Ti.
摘要翻译：一种磁头，包括第一和第二磁极，其间设置有写间隙层。在第一实施例中，写间隙层包括非磁性非导电的第一子层，其优选由Ta或Ti组成，其沉积在第一磁极上以用作粘附层。写间隙层然后包括由非磁性导电材料形成的第二子层，该材料优选由Rh或Ru组成。 P2极端电镀在第二子层上，其中导电的第二子层用于导电电镀电流。在替代实施例中，写间隙层包括可在反应离子蚀刻（RIE）工艺中蚀刻并形成在第一和第二子层之间的第三子层。第三子层优选由Ta或Ti组成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式