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    • 1. 发明授权
    • High voltage generation and control in source-side injection programming of non-volatile memory
    • 非易失性存储器的源侧注入编程中的高压发生和控制
    • US07894263B2
    • 2011-02-22
    • US11864825
    • 2007-09-28
    • Dana LeeHock So
    • Dana LeeHock So
    • G11C16/04
    • G11C16/10G11C11/5628G11C16/0483G11C16/24G11C16/3418G11C2211/565
    • Non-volatile memory is programmed using source side hot electron injection. To generate a high voltage bit line for programming, the bit line corresponding to a selected memory cell is charged to a first level using a first low voltage. A second low voltage is applied to unselected bit lines adjacent to the selected bit line after charging. Because of capacitive coupling between the adjacent bit lines and the selected bit line, the selected bit line is boosted above the first voltage level by application of the second low voltage to the unselected bit lines. The column control circuitry for such a memory array does not directly apply the high voltage and thus, can be designed to withstand lower operating voltages, permitting low operating voltage circuitry to be used.
    • 使用源侧热电子注入编程非易失性存储器。 为了产生用于编程的高电压位线,对应于所选存储单元的位线使用第一低电压被充电到第一电平。 在充电之后,将第二低电压施加到与选定位线相邻的未选位线。 由于相邻位线与所选位线之间的电容耦合,所选择的位线通过将第二低电压施加到未选定的位线而升高到高于第一电压电平。 用于这种存储器阵列的列控制电路不直接施加高电压,因此可被设计为承受较低的工作电压,允许使用低工作电压电路。
    • 2. 发明申请
    • High Voltage Generation and Control in Source-Side Injection Programming of Non-Volatile Memory
    • 非易失性存储器的源侧注入编程中的高压产生和控制
    • US20090086542A1
    • 2009-04-02
    • US11864825
    • 2007-09-28
    • Dana LeeHock So
    • Dana LeeHock So
    • G11C16/00
    • G11C16/10G11C11/5628G11C16/0483G11C16/24G11C16/3418G11C2211/565
    • Non-volatile memory is programmed using source side hot electron injection. To generate a high voltage bit line for programming, the bit line corresponding to a selected memory cell is charged to a first level using a first low voltage. A second low voltage is applied to unselected bit lines adjacent to the selected bit line after charging. Because of capacitive coupling between the adjacent bit lines and the selected bit line, the selected bit line is boosted above the first voltage level by application of the second low voltage to the unselected bit lines. The column control circuitry for such a memory array does not directly apply the high voltage and thus, can be designed to withstand lower operating voltages, permitting low operating voltage circuitry to be used.
    • 使用源侧热电子注入编程非易失性存储器。 为了产生用于编程的高电压位线,对应于所选存储单元的位线使用第一低电压被充电到第一电平。 在充电之后,将第二低电压施加到与选定位线相邻的未选位线。 由于相邻位线与所选位线之间的电容耦合,所选择的位线通过将第二低电压施加到未选定的位线而升高到高于第一电压电平。 用于这种存储器阵列的列控制电路不直接施加高电压,因此可被设计为承受较低的工作电压,允许使用低工作电压电路。
    • 3. 发明授权
    • High voltage generation and control in source-side injection programming of non-volatile memory
    • 非易失性存储器的源侧注入编程中的高压发生和控制
    • US08406052B2
    • 2013-03-26
    • US13028847
    • 2011-02-16
    • Dana LeeHock So
    • Dana LeeHock So
    • G11C16/04
    • G11C16/10G11C11/5628G11C16/0483G11C16/24G11C16/3418G11C2211/565
    • Non-volatile memory is programmed using source side hot electron injection. To generate a high voltage bit line for programming, the bit line corresponding to a selected memory cell is charged to a first level using a first low voltage. A second low voltage is applied to unselected bit lines adjacent to the selected bit line after charging. Because of capacitive coupling between the adjacent bit lines and the selected bit line, the selected bit line is boosted above the first voltage level by application of the second low voltage to the unselected bit lines. The column control circuitry for such a memory array does not directly apply the high voltage and thus, can be designed to withstand lower operating voltages, permitting low operating voltage circuitry to be used.
    • 使用源侧热电子注入编程非易失性存储器。 为了产生用于编程的高电压位线,对应于所选存储单元的位线使用第一低电压被充电到第一电平。 在充电之后,将第二低电压施加到与选定位线相邻的未选位线。 由于相邻位线与所选位线之间的电容耦合,所选择的位线通过将第二低电压施加到未选定的位线而升高到高于第一电压电平。 用于这种存储器阵列的列控制电路不直接施加高电压,因此可被设计为承受较低的工作电压,允许使用低工作电压电路。
    • 4. 发明申请
    • High Voltage Generation And Control In Source-Side Injection Programming Of Non-Volatile Memory
    • 非易失性存储器的源侧注入编程中的高压发生和控制
    • US20110134694A1
    • 2011-06-09
    • US13028847
    • 2011-02-16
    • Dana LeeHock So
    • Dana LeeHock So
    • G11C16/04G11C16/10G11C16/06
    • G11C16/10G11C11/5628G11C16/0483G11C16/24G11C16/3418G11C2211/565
    • Non-volatile memory is programmed using source side hot electron injection. To generate a high voltage bit line for programming, the bit line corresponding to a selected memory cell is charged to a first level using a first low voltage. A second low voltage is applied to unselected bit lines adjacent to the selected bit line after charging. Because of capacitive coupling between the adjacent bit lines and the selected bit line, the selected bit line is boosted above the first voltage level by application of the second low voltage to the unselected bit lines. The column control circuitry for such a memory array does not directly apply the high voltage and thus, can be designed to withstand lower operating voltages, permitting low operating voltage circuitry to be used.
    • 使用源侧热电子注入编程非易失性存储器。 为了产生用于编程的高电压位线,对应于所选存储单元的位线使用第一低电压被充电到第一电平。 在充电之后,将第二低电压施加到与选定位线相邻的未选位线。 由于相邻位线与所选位线之间的电容耦合,所选择的位线通过将第二低电压施加到未选定的位线而升高到高于第一电压电平。 用于这种存储器阵列的列控制电路不直接施加高电压,因此可被设计为承受较低的工作电压,允许使用低工作电压电路。
    • 7. 发明申请
    • Multi-bit-per-cell flash EEPROM memory with refresh
    • 多单元快闪EEPROM存储器刷新
    • US20050174844A1
    • 2005-08-11
    • US11101938
    • 2005-04-07
    • Hock SoSau Wong
    • Hock SoSau Wong
    • G11C16/02B64C27/00G01N29/14G01N29/22G06F11/10G11C11/56G11C16/06G11C29/42G11C29/50G11C11/34
    • G06F11/1072B64C27/006G01N29/14G01N29/227G06F11/106G11C11/56G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C16/04G11C16/10G11C16/3418G11C16/3431G11C16/3459G11C29/00G11C29/028G11C29/50G11C29/50004G11C2211/5634
    • A multibit-per-cell non-volatile memory divides the suitable threshold voltages of memory cells into ranges corresponding to allowed states for storage of data and ranges corresponding to forbidden zones indicating a data error. A read process in accordance automatically checks whether a threshold voltage is in a forbidden zone. In an alternative embodiment, a refresh process includes reprogramming the threshold voltage into an allowed state. In the case of a flash memory, a refresh reads a sector of the memory and saves corrected data from the sector in a buffer or another sector. The corrected data from the buffer or other sector can be written back in the original sector, or the corrected data can be left in the other sector with addresses of the original sector being mapped to the other sector. Refresh process for the non-volatile memory can be perform in response to detecting a threshold voltage in a forbidden zone, as part of a power-up procedure for the memory, or periodically with a period on the order of days, weeks, or months. As a further aspect, the allowed states correspond to gray coded digital values so that allowed states that are adjacent in threshold voltage correspond to multibit values that differ in only a single bit. Error detection and correction codes can be used to identify data errors and generate corrected data for refresh operations.
    • 多单元单元非易失性存储器将存储器单元的适当阈值电压划分为对应于用于存储数据的允许状态的范围和对应于指示数据错误的禁止区域的范围。 读取过程自动检查阈值电压是否处于禁止区。 在替代实施例中,刷新过程包括将阈值电压重新编程为允许状态。 在闪速存储器的情况下,刷新读取存储器的扇区,并将来自扇区的校正数据保存在缓冲器或另一扇区中。 来自缓冲器或其他扇区的校正数据可以被写回到原始扇区中,或者校正的数据可以留在另一扇区中,原始扇区的地址映射到另一个扇区。 非易失性存储器的刷新过程可以响应于检测到禁止区域中的阈值电压而进行,作为存储器的加电过程的一部分,或者周期性地在几天,几周或几个月的周期内 。 作为另一方面,允许的状态对应于灰度编码数字值,使得在阈值电压中相邻的允许状态对应于仅在单个位中不同的多位值。 错误检测和校正码可用于识别数据错误,并生成用于刷新操作的校正数据。