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1. 发明申请

US20120280706A1 CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TEST APPARATUS 审中-公开
标题翻译：清洁表，清洁会员，清洁方法和连续测试装置
公开(公告)号：US20120280706A1
公开(公告)日：2012-11-08
申请号：US13464861
申请日：2012-05-04
申请人： Daisuke Uenda , Makoto Namikawa , Takeshi Matsumura
发明人： Daisuke Uenda , Makoto Namikawa , Takeshi Matsumura
IPC分类号： G01R1/067 , B08B1/00 , A47L25/00 , A47L13/10
CPC分类号： B08B1/006
摘要： Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less.
摘要翻译：提供一种用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁单元，该清洁单元能够有效地除去附着在探针上的异物而不会磨损探针。本发明的清洁片是清洁片，其具有用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁层，其中清洁层的算术平均粗糙度Ra符合JIS- B-0601为100nm以下。

2. 发明申请

US20050244632A1 Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权
标题翻译：清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法
公开(公告)号：US20050244632A1
公开(公告)日：2005-11-03
申请号：US11014779
申请日：2004-12-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： B08B7/00 , B32B27/06
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译：提供了一种用于清除离开基板处理设备内部的异物的清洁片。清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。或者，清洁片包括维氏硬度不低于10MPa的清洁层。

3. 发明授权

US07793668B2 Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权
标题翻译：清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法
公开(公告)号：US07793668B2
公开(公告)日：2010-09-14
申请号：US11014779
申请日：2004-12-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： B08B3/00
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译：提供了一种用于清除离开基板处理设备内部的异物的清洁片。清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。或者，清洁片包括维氏硬度不低于10MPa的清洁层。

4. 发明申请

US20100319151A1 CLEANING SHEET, CONVEYING MEMBER USING THE SAME, AND SUBSTRATE PROCESSING EQUIPMENT CLEANING METHOD USING THEM 审中-公开
标题翻译：使用它们的清洁片，输送构件和使用它们的基板处理设备清洁方法
公开(公告)号：US20100319151A1
公开(公告)日：2010-12-23
申请号：US12851797
申请日：2010-08-06
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： A47L25/00
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译：提供了一种用于清除离开基板处理设备内部的异物的清洁片。清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。或者，清洁片包括维氏硬度不低于10MPa的清洁层。

5. 发明授权

US07575812B2 Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor 有权
标题翻译：基板处理设备的清洁基板和耐热树脂是优选的
公开(公告)号：US07575812B2
公开(公告)日：2009-08-18
申请号：US11252800
申请日：2005-10-19
申请人： Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
发明人： Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
IPC分类号： B32B27/06 , B32B7/12 , B08B7/00
CPC分类号： B32B27/28 , B32B27/06 , B32B27/34 , B32B27/36 , B32B2307/31 , B32B2307/54 , B32B2432/00 , Y10T428/28 , Y10T428/2896 , Y10T428/31504 , Y10T428/31721
摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
摘要翻译：本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

6. 发明申请

US20060141258A1 Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor 有权
标题翻译：基板处理设备的清洁基板和耐热树脂是优选的
公开(公告)号：US20060141258A1
公开(公告)日：2006-06-29
申请号：US11252800
申请日：2005-10-19
申请人： Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
发明人： Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
IPC分类号： B32B27/00
CPC分类号： B32B27/28 , B32B27/06 , B32B27/34 , B32B27/36 , B32B2307/31 , B32B2307/54 , B32B2432/00 , Y10T428/28 , Y10T428/2896 , Y10T428/31504 , Y10T428/31721
摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
摘要翻译：本发明提供一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 / 在衬底的至少一个面上的SUP> Pa至1×10 9 Pa; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

7. 发明申请

US20060105164A1 Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 审中-公开
标题翻译：清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法
公开(公告)号：US20060105164A1
公开(公告)日：2006-05-18
申请号：US11229586
申请日：2005-09-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： C23G1/00 , B08B7/00 , B32B27/04 , B32B7/12
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , C08G73/12 , C08G73/16 , C08J7/047 , C08J2409/00 , C08J2479/00 , G11B5/41 , Y10T428/28 , Y10T442/2738
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译：提供了一种用于清除离开基板处理设备内部的异物的清洁片。清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。或者，清洁片包括维氏硬度不低于10MPa的清洁层。

8. 发明申请

US20100175716A1 Cleaning Member, Delivery Member with Cleaning Function, and Method of Cleaning Substrate Processing Apparatus 审中-公开
标题翻译：清洁部件，具有清洁功能的输送部件以及清洁基板处理装置的方法
公开(公告)号：US20100175716A1
公开(公告)日：2010-07-15
申请号：US12377063
申请日：2007-06-28
申请人： Yuki Sugo , Yoshio Terada , Daisuke Uenda , Makoto Namikawa , Yoshinori Yoshida , Youhei Maeno
发明人： Yuki Sugo , Yoshio Terada , Daisuke Uenda , Makoto Namikawa , Yoshinori Yoshida , Youhei Maeno
IPC分类号： B08B7/02 , A46D1/00
CPC分类号： H01L21/67046 , B08B1/00 , B08B7/0028 , C23C16/4407
摘要： Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.
摘要翻译：本发明提供一种清洁部件，其能够简单，准确且充分地除去微小的异物，优选亚微米级的异物，而不会污染清洁部位。还提供具有清洁功能的传送部件，其具有清洁部件，以及使用具有清洁功能的传送部件清洁基板处理设备的方法。本发明的清洁部件具有在柱面结构的突起长宽比为5以上的表面上具有多个柱状结构的突起的清洗层。

9. 发明授权

US08841757B2 Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device 有权
标题翻译：倒装型半导体背面的薄膜，用于半导体背面的切割带集成膜，倒装芯片型半导体背面制造薄膜的方法以及半导体器件
公开(公告)号：US08841757B2
公开(公告)日：2014-09-23
申请号：US13298614
申请日：2011-11-17
申请人： Daisuke Uenda , Takeshi Matsumura , Koichi Inoue , Miki Morita
发明人： Daisuke Uenda , Takeshi Matsumura , Koichi Inoue , Miki Morita
IPC分类号： H01L21/00 , H01L23/552 , H01L21/683 , H01L21/56 , H01L23/544
CPC分类号： H01L23/552 , H01L21/563 , H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16245 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2924/01019 , H01L2924/01037 , H01L2924/01055 , H01L2924/01079 , Y10T428/28 , H01L2924/00
摘要： An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.
摘要翻译：可以在倒装芯片连接到被粘物的半导体元件的背面设置电磁波屏蔽层，并且可以制造具有电磁波屏蔽层的半导体器件，而不会降低生产率。本发明提供了一种用于倒装芯片型半导体的背面的薄膜，该薄膜将形成在半导体元件的背面，该半导体元件倒装芯片连接到具有粘合剂层和电磁波屏蔽层的被粘物。

10. 发明申请

US20070163621A1 Cleaning member for semiconductor apparatus and process for producing the same 审中-公开
标题翻译：半导体装置用清洁构件及其制造方法
公开(公告)号：US20070163621A1
公开(公告)日：2007-07-19
申请号：US10591330
申请日：2005-03-07
申请人： Hitoshi Ishizaka , Daisuke Uenda , Daisuke Hanai
发明人： Hitoshi Ishizaka , Daisuke Uenda , Daisuke Hanai
IPC分类号： B08B9/00
CPC分类号： H01L21/6715 , H01L21/6708
摘要： An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.
摘要翻译：本发明的目的是提供一种用于半导体装置的清洁部件，其能够容易地去除附着于半导体装置的内部部件的异物，从而能够为批次管理提供清晰可读的标记，并且可以防止在接触时产生颗粒晶片盒的保持部分。一种用于半导体装置的清洁部件，其特征在于，所述清洁部件包括晶片1，并且在其至少一侧上形成由通过热固化聚（酰胺酸）形成的耐热树脂制成的清洁层2，清洁层2具有暴露晶片表面的部分12; 特别是具有上述结构的半导体装置用清洁部件，其中，露出晶片表面的清洁层2中的部分12是在具有给定宽度范围的整个圆形区域中已经清除了清洁层的部分从晶片的周缘朝向其中心。

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