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1. 发明申请

US20110027667A1 FUEL CELL, AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：燃料电池及其制造方法
公开(公告)号：US20110027667A1
公开(公告)日：2011-02-03
申请号：US12935369
申请日：2009-03-18
申请人： Masakazu Sugimoto , Masaya Yano , Hitoshi Ishizaka
发明人： Masakazu Sugimoto , Masaya Yano , Hitoshi Ishizaka
IPC分类号： H01M8/06
CPC分类号： H01M8/2475 , C01B3/065 , C01B3/08 , C01B2203/0405 , C01B2203/0465 , C01B2203/066 , H01M8/04089 , H01M8/0606 , H01M8/065 , H01M8/241 , H01M8/242 , Y02E60/362 , Y02P70/56
摘要： A fuel cell of the present invention comprises a power generating cell (C), which has at least two surfaces, a fuel gas being supplied through one of the surfaces and oxygen being supplied through the other surface, thereby generating electric power, a cell holder (6) that holds the power generating cell (c) to face the one of the surfaces inward, whereby forming an inner space together with the power generating cell (C), and a fuel generating section (B) that is arranged in the inner space of the cell holder (6) and generates the fuel gas.
摘要翻译：本发明的燃料电池包括具有至少两个表面的发电电池（C），通过一个表面供给的燃料气体和通过另一个表面供给的氧气，从而产生电力，电池座（6），其保持所述发电单元（c）向内面对所述一个表面，由此与所述发电单元（C）一起形成内部空间;以及燃料生成部（B），其布置在所述内部电池座（6）的空间并产生燃料气体。

2. 发明申请

US20070163621A1 Cleaning member for semiconductor apparatus and process for producing the same 审中-公开
标题翻译：半导体装置用清洁构件及其制造方法
公开(公告)号：US20070163621A1
公开(公告)日：2007-07-19
申请号：US10591330
申请日：2005-03-07
申请人： Hitoshi Ishizaka , Daisuke Uenda , Daisuke Hanai
发明人： Hitoshi Ishizaka , Daisuke Uenda , Daisuke Hanai
IPC分类号： B08B9/00
CPC分类号： H01L21/6715 , H01L21/6708
摘要： An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.
摘要翻译：本发明的目的是提供一种用于半导体装置的清洁部件，其能够容易地去除附着于半导体装置的内部部件的异物，从而能够为批次管理提供清晰可读的标记，并且可以防止在接触时产生颗粒晶片盒的保持部分。一种用于半导体装置的清洁部件，其特征在于，所述清洁部件包括晶片1，并且在其至少一侧上形成由通过热固化聚（酰胺酸）形成的耐热树脂制成的清洁层2，清洁层2具有暴露晶片表面的部分12; 特别是具有上述结构的半导体装置用清洁部件，其中，露出晶片表面的清洁层2中的部分12是在具有给定宽度范围的整个圆形区域中已经清除了清洁层的部分从晶片的周缘朝向其中心。

3. 发明申请

US20050244632A1 Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权
标题翻译：清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法
公开(公告)号：US20050244632A1
公开(公告)日：2005-11-03
申请号：US11014779
申请日：2004-12-20
申请人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
发明人： Makoto Namikawa , Yoshio Terada , Jirou Nukaga , Eiji Toyoda , Hirofumi Fujii , Daisuke Uenda , Asami Funatsu , Nobuaki Maruoka , Hitoshi Ishizaka , Yasuhiro Amano
IPC分类号： B08B7/00 , B32B27/06
CPC分类号： B08B1/00 , B08B7/00 , B08B7/0028 , Y10T428/2848 , Y10T428/31721
摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.
摘要翻译：提供了一种用于清除离开基板处理设备内部的异物的清洁片。清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。或者，清洁片包括维氏硬度不低于10MPa的清洁层。

4. 发明授权

US06168910A Method for removing residue and method for production of printed board having hole 失效
标题翻译：去除残留物的方法和生产具有孔的印刷板的方法
公开(公告)号：US06168910A
公开(公告)日：2001-01-02
申请号：US09334643
申请日：1999-06-17
申请人： Atsushi Hino , Hitoshi Ishizaka
发明人： Atsushi Hino , Hitoshi Ishizaka
IPC分类号： G03F726
CPC分类号： H05K3/0026 , B08B7/0042 , B23K26/066 , B23K26/067 , B23K26/0676 , H05K3/0035 , H05K2203/0557 , Y10S430/146 , Y10S438/94 , Y10S438/945
摘要： A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.
摘要翻译：公开了一种用于除去附着在形成在印刷电路板的树脂层中的孔的周边和内部的树脂层的材料的分解残渣和/或加工残留物的方法。该方法提供了在孔处拍摄具有用于激光消融的波长的激光束，从而去除分解残余物和/或加工残留物; 通过光束整形光学器件重新形成垂直于激光束前进方向的截面形状; 并拍摄重新设置的激光束同时拍摄树脂层及其附近形成的所有孔，其中印刷电路板上的总照射面积为形成在印刷电路板上的孔的总截面积的200％-10,000％。还公开了一种具有孔的印刷电路板的制造方法，所述印刷电路板具有：通过激光加工在印刷电路板的树脂层上形成孔，除去树脂层的材料的分解残渣和/或加工残渣，附着在孔的周边和内部。

5. 发明授权

US5691210A Method for fabrication of probe structure and circuit substrate therefor 失效
标题翻译：探针结构及其电路基板的制造方法
公开(公告)号：US5691210A
公开(公告)日：1997-11-25
申请号：US728076
申请日：1996-10-09
申请人： Yoshihisa Mori , Atsushi Hino , Hitoshi Ishizaka
发明人： Yoshihisa Mori , Atsushi Hino , Hitoshi Ishizaka
IPC分类号： G01R31/26 , G01R1/04 , G01R1/06 , G01R1/073 , H01L21/66
CPC分类号： G01R1/07314 , G01R1/0483
摘要： A method for fabrication of a probe structure comprising a circuit substrate comprising a circuit pattern formed on one side or inside of an insulating substrate and a positioning member formed on either side of said insulating substrate, said positioning member being capable of positioning and retaining a test target at a testing position of the probe structure, and the circuit pattern and the positioning member being in a positional relationship which establishes a continuity between the circuit pattern and a bump contact, which method comprises determining, on the same side of the substrate on which the positioning member has been formed, the position of the bump contact according to the position of the positioning member as a reference position, and forming the bump contact capable of establishing continuity with the circuit pattern. According to the method of the present invention, a probe structure can be obtained which is capable of positioning bump contacts and test target highly accurately as compared to conventional methods. In addition, since conventional production method can be applied to the manufacture of positioning member and bump contacts, highly precise products can be produced economically. The circuit substrate of the present invention which comprises a positioning member can be beneficially used for the production of the probe structure of the present invention.
摘要翻译：一种用于制造探针结构的方法，其包括电路基板，该电路基板包括形成在绝缘基板的一侧或内侧上的电路图案和形成在所述绝缘基板两侧的定位部件，所述定位部件能够定位和保持测试目标在探针结构的测试位置，并且电路图案和定位构件处于建立电路图案和凸块接触之间的连续性的位置关系，该方法包括在衬底的同一侧上确定已经形成了定位构件，根据定位构件的位置作为基准位置的凸起接触的位置，并且形成能够与电路图案建立连续性的凸点接触。根据本发明的方法，与传统方法相比，可以获得能够高度准确地定位凸块接触和测试目标的探针结构。此外，由于可以将传统的制造方法应用于定位构件和凸起接触的制造，因此可以经济地制造高精度的产品。包括定位构件的本发明的电路基板可有利地用于制造本发明的探针结构。

6. 发明授权

US08697300B2 Fuel cell, and method for manufacturing the same 失效
标题翻译：燃料电池及其制造方法
公开(公告)号：US08697300B2
公开(公告)日：2014-04-15
申请号：US12935369
申请日：2009-03-18
申请人： Masakazu Sugimoto , Masaya Yano , Hitoshi Ishizaka
发明人： Masakazu Sugimoto , Masaya Yano , Hitoshi Ishizaka
IPC分类号： H01M8/18 , H01M8/06 , H01M8/24 , H01M2/38 , H01M2/40
CPC分类号： H01M8/2475 , C01B3/065 , C01B3/08 , C01B2203/0405 , C01B2203/0465 , C01B2203/066 , H01M8/04089 , H01M8/0606 , H01M8/065 , H01M8/241 , H01M8/242 , Y02E60/362 , Y02P70/56
摘要： A fuel cell of the present invention comprises a power generating cell (C), which has at least two surfaces, a fuel gas being supplied through one of the surfaces and oxygen being supplied through the other surface, thereby generating electric power, a cell holder (6) that holds the power generating cell (c) to face the one of the surfaces inward, whereby forming an inner space together with the power generating cell (C), and a fuel generating section (B) that is arranged in the inner space of the cell holder (6) and generates the fuel gas.
摘要翻译：本发明的燃料电池包括具有至少两个表面的发电电池（C），通过一个表面供给的燃料气体和通过另一个表面供给的氧气，从而产生电力，电池座（6），其保持所述发电单元（c）向内面对所述一个表面，由此与所述发电单元（C）一起形成内部空间;以及燃料生成部（B），其布置在所述内部电池座（6）的空间并产生燃料气体。

7. 发明申请

US20090242506A1 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon 审中-公开
公开(公告)号：US20090242506A1
公开(公告)日：2009-10-01
申请号：US12457183
申请日：2009-06-03
申请人： Kei Nakamura , Hitoshi Ishizaka
发明人： Kei Nakamura , Hitoshi Ishizaka
IPC分类号： H05K3/06
CPC分类号： H05K1/0269 , H01L21/4846 , H01L23/4985 , H01L23/544 , H01L2223/54473 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/056 , H05K3/303 , H05K2201/0108 , H05K2201/0969 , H05K2201/09918 , H05K2203/166 , Y02P70/613 , H01L2924/00
摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

8. 发明授权

US07561434B2 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon 失效
标题翻译：有线电路板及制造布线电路板及其上安装电子部件的方法
公开(公告)号：US07561434B2
公开(公告)日：2009-07-14
申请号：US11595984
申请日：2006-11-13
申请人： Kei Nakamura , Hitoshi Ishizaka
发明人： Kei Nakamura , Hitoshi Ishizaka
IPC分类号： H05K1/00 , H01L23/52
CPC分类号： H05K1/0269 , H01L21/4846 , H01L23/4985 , H01L23/544 , H01L24/86 , H01L2223/54473 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/056 , H05K3/303 , H05K2201/0108 , H05K2201/0969 , H05K2201/09918 , H05K2203/166 , Y02P70/613 , H01L2924/00
摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.
摘要翻译：提供了一种布线电路板，其上形成有高可靠性导电图案并且以高精度安装电子部件，并且提供了制造布线电路板并将电子部件安装在其上的方法。包括安装部分的绝缘层形成在入射角为45°的镜面光泽度为150至500％的金属支撑层上。在绝缘层上形成导电图案。通过反射型光学传感器检查导电图案的不良形状。然后，通过蚀刻金属支撑层的与安装部分重叠的部分形成开口，使得通过蚀刻暴露的绝缘层的安装部分的雾度值为20-50％，由此获得TAB带载体。此后，电子部件通过反射型光学传感器与安装部对准，使得电子部件安装在安装部上。

9. 发明授权

US07358619B2 Tape carrier for TAB 失效
标题翻译： TAB的磁带架
公开(公告)号：US07358619B2
公开(公告)日：2008-04-15
申请号：US11467437
申请日：2006-08-25
申请人： Hitoshi Ishizaka
发明人： Hitoshi Ishizaka
IPC分类号： H01L23/544 , H01L23/58 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/0097 , G03F9/7076 , G03F9/7084 , H01L23/49572 , H01L23/4985 , H01L23/544 , H01L2924/0002 , H05K1/0266 , H05K1/0269 , H05K1/0393 , H05K3/0008 , H05K3/0052 , H05K3/0082 , H05K3/108 , H05K2201/09063 , H05K2201/09918 , H05K2201/09927 , H05K2201/09936 , H05K2203/0152 , H05K2203/1545 , H05K2203/166 , H01L2924/00
摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.
摘要翻译：用于TAB的带状带状载体包括多个安装部件。在各个安装部分中，形成了电子部件的接合电极的布线图案。每个曝光区域包括预定数量的安装部件。在每个曝光区域的两侧形成对准标记和识别标记。对准标记用于曝光期间的对准。识别标记用于指定带状载体上各个曝光区域的位置。

10. 发明申请

US20070045790A1 Tape Carrier For TAB And Method Of Manufacturing The Same 失效
标题翻译： TAB的胶带载体及其制造方法
公开(公告)号：US20070045790A1
公开(公告)日：2007-03-01
申请号：US11467437
申请日：2006-08-25
申请人： Hitoshi Ishizaka
发明人： Hitoshi Ishizaka
IPC分类号： H01L23/495
CPC分类号： H05K3/0097 , G03F9/7076 , G03F9/7084 , H01L23/49572 , H01L23/4985 , H01L23/544 , H01L2924/0002 , H05K1/0266 , H05K1/0269 , H05K1/0393 , H05K3/0008 , H05K3/0052 , H05K3/0082 , H05K3/108 , H05K2201/09063 , H05K2201/09918 , H05K2201/09927 , H05K2201/09936 , H05K2203/0152 , H05K2203/1545 , H05K2203/166 , H01L2924/00
摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.
摘要翻译：用于TAB的带状带状载体包括多个安装部件。在各个安装部分中，形成了电子部件的接合电极的布线图案。每个曝光区域包括预定数量的安装部件。在每个曝光区域的两侧形成对准标记和识别标记。对准标记用于曝光期间的对准。识别标记用于指定带状载体上各个曝光区域的位置。

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