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    • 2. 发明申请
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法以及氮化物半导体激光光源的制造装置
    • US20110174288A1
    • 2011-07-21
    • US13064534
    • 2011-03-30
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • F24B1/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 4. 发明授权
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置
    • US07833834B2
    • 2010-11-16
    • US11237946
    • 2005-09-29
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • H01L21/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 5. 发明申请
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置
    • US20060068516A1
    • 2006-03-30
    • US11237946
    • 2005-09-29
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • H01L21/00B29C65/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the, cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,杆或盖的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 6. 发明授权
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置
    • US07691729B2
    • 2010-04-06
    • US11889767
    • 2007-08-16
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • H01L21/20
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor, laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体的方法,激光光源具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 7. 发明申请
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置
    • US20070292980A1
    • 2007-12-20
    • US11889767
    • 2007-08-16
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • H01L21/00B29C65/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor, laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体的方法,激光光源具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 10. 发明授权
    • Light receiving element and light receiving device incorporating circuit and optical disk drive
    • 光接收元件和光接收装置并入电路和光盘驱动器
    • US07307326B2
    • 2007-12-11
    • US10499357
    • 2002-12-10
    • Shigeki HayashidaTatsuya MoriokaYoshihiko TaniIsamu OhkuboHideo Wada
    • Shigeki HayashidaTatsuya MoriokaYoshihiko TaniIsamu OhkuboHideo Wada
    • H01L31/00H01L31/0232
    • H01L31/103H01L31/02161
    • A light receiving device includes a silicon substrate, a first P type diffusion layer on the silicon substrate, and a P type semiconductor layer on the P type diffusion layer. On a surface part of the P type semiconductor layer, two N type diffusion layers as light receiving parts, and a second P type diffusion layer between the two N type diffusion layers are provided. On the P type semiconductor layer, an antireflection film structure composed of a first silicon oxide formed by thermal oxidation and a second silicon oxide formed by CVD is provided. A film thickness of the first silicon oxide is set at about 15 nm, thus a defect in a interface between the first silicon oxide and the P type semiconductor layer is prevented. A film thickness of the second silicon oxide is set at about 100 nm, thus a leak current between cathodes is prevented when a power supply voltage is applied for long period of time.
    • 光接收装置包括硅衬底,硅衬底上的第一P型扩散层和P型扩散层上的P型半导体层。 在P型半导体层的表面部分设置有作为光接收部的两个N型扩散层和在两个N型扩散层之间的第二P型扩散层。 在P型半导体层上,提供了由通过热氧化形成的第一氧化硅和通过CVD形成的第二氧化硅构成的抗反射膜结构。 第一氧化硅的膜厚设定为约15nm,因此防止了第一氧化硅与P型半导体层之间的界面的缺陷。 第二氧化硅的膜厚设定为约100nm,因此长时间施加电源电压时,能够防止阴极之间的漏电流。