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1. 发明专利

JP2004267965A Substrate processing apparatus and method for changeover of processing liquid 审中-公开
公开(公告)号：JP2004267965A
公开(公告)日：2004-09-30
申请号：JP2003064972
申请日：2003-03-11
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： YOSHIDA TAKESHI , TANIGUCHI HIDEYUKI , INOUE KAZUKI , KAWAKAMI SHIGENORI
IPC分类号： G02F1/13 , B08B3/02 , G02F1/1333 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To control time loss and resource loss involved during changeover of processing liquids.
SOLUTION: A substrate processing apparatus of the present invention has a changeover valve unit 71 among a nozzle 59, processing liquid lines 81 and 83 for supplying processing liquids A and B, and a pure water line 85. Moreover, by opening or closing valves 75, 77 and 79 of the aforementioned changeover valve unit 71, it is possible to individually open or close a communication state among the nozzle 59, the processing liquid lines 81 and 83, and the pure water line 85. For this reason, it is possible to perform a changeover between the processing liquids A and B while they are prevented from mixing with each other on a primary side beyond the valves 75 and 77 of the changeover valve unit 71 operating for the respective processing liquid lines 81 and 83, and to perform a cleaning using a pure water and a purge processing using processing liquids A and B scheduled for use next time, on pipelines of secondary side from the valves 75 and 77 for changing over the processing liquids.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2007258442A Substrate supporting structure, heat treatment apparatus using same, sheet-like article used for substrate supporting structure, and manufacturing method of substrate supporting structure 有权
标题翻译：基板支撑结构，使用相同的热处理装置，用于基板支撑结构的板状物，以及基板支撑结构的制造方法
公开(公告)号：JP2007258442A
公开(公告)日：2007-10-04
申请号：JP2006080864
申请日：2006-03-23
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： FUKUMOTO YASUHIRO , TSUJI MASAO , MIYAUCHI HIROSHI , TANIGUCHI HIDEYUKI
IPC分类号： H01L21/683 , H01L21/027
CPC分类号： B25B11/005 , H01L21/67103 , H01L21/6838 , H01L21/68735 , H01L21/68742 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To provide a substrate supporting structure capable of preferably supporting a substrate, and to provide a heat treatment apparatus using the same, a sheet-like article to be used for the substrate supporting structure and a manufacturing method of the substrate supporting structure. SOLUTION: In the heat treatment apparatus, a supporting sheet 11 is provided on the upper surface of a heat treatment plate 1. On the upper surface of the supporting sheet 11, a convex portion 13 for abutting on and supporting the substrate W and a lip portion 15 for abutting on the circumferential edge portion of the substrate W are formed. Formed by etching processing, the convex portion can be formed without cutting unlike laser processing. Thus, the substrate W can be appropriately supported using the supporting structure T for supporting the substrate W by the convex portion 13 and the lip portion 15. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够优选地支撑基板的基板支撑结构，并提供使用该基板支撑结构的热处理装置，用于基板支撑结构的片状制品和制造方法基板支撑结构。解决方案：在热处理设备中，在热处理板1的上表面上设置有支撑片11.在支撑片11的上表面上，用于抵接并支撑衬底W的凸部13 形成用于抵接在基板W的周缘部的唇部15。通过蚀刻处理形成，与激光加工不同，可以形成凸部。因此，可以使用用于通过凸部13和唇部15支撑基板W的支撑结构T来适当地支撑基板W.版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007258443A Heat treatment apparatus, and substrate sucking method 有权
标题翻译：热处理装置和底板取材方法
公开(公告)号：JP2007258443A
公开(公告)日：2007-10-04
申请号：JP2006080865
申请日：2006-03-23
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： FUKUMOTO YASUHIRO , TSUJI MASAO , MIYAUCHI HIROSHI , TANIGUCHI HIDEYUKI
IPC分类号： H01L21/027 , H01L21/02 , H01L21/683
CPC分类号： B25B11/005 , H01L21/67103 , H01L21/6838 , H01L21/68735 , H01L21/68742 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a substrate sucking method capable of sucking a substrate while preventing a sheet-like article to be provided on the upper surface of a heat treatment plate from moving for the heat treatment plate. SOLUTION: A convex portion 13 for abutting on and supporting the substrate W and a sealing section 15 for sealing the side of a micro-space ms are formed on the supporting sheet 11 provided on the upper surface of the heat treatment plate 1. Also, a groove portion 25 is formed so as to communicate with an exhaust port 21 for exhausting a gas in the micro-space ms, on the upper surface of the heat treatment plate 1. When the substrate W is sucked, the gas in the groove portion 25 is exhausted together with the gas in the micro-space ms through the exhaust port 21. Accordingly, by sucking the supporting sheet 11 in the groove portion 25, the sheet 11 is closely attached on the heat treatment plate 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种能够在防止在热处理板的上表面上设置片状物品而移动用于热处理板的同时吸附基板的热处理装置和基板吸附方法。解决方案：在设置在热处理板1的上表面上的支撑片11上形成有用于抵接和支撑基板W的凸部13和密封微空间ms侧的密封部15 而且，形成有与热处理板1的上表面的微空间ms内的气体排出用排气口21连通的槽部25.当吸附基板W时，槽部25通过排气口21与微空间ms内的气体一起排出。因此，通过将支撑片11吸附在槽部25中，将片11紧贴在热处理板1上。 P>版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007258441A Heat treatment apparatus 有权
标题翻译：热处理设备
公开(公告)号：JP2007258441A
公开(公告)日：2007-10-04
申请号：JP2006080863
申请日：2006-03-23
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： FUKUMOTO YASUHIRO , TSUJI MASAO , MIYAUCHI HIROSHI , TANIGUCHI HIDEYUKI
IPC分类号： H01L21/027
CPC分类号： B25B11/005 , H01L21/67103 , H01L21/6838 , H01L21/68735 , H01L21/68742 , H01L21/6875
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of preventing wrinkles on a sheet-like article even if the sheet-like article to be provided on the upper surface of a heat treatment plate expands or is shrunk for a heat treatment plate.
SOLUTION: A supporting sheet 11 is provided on the upper surface of the heat treatment plate W. On the supporting sheet 11, a first opening A1 is formed on the outside by a sealing portion 15. A guide 21 for positioning the substrate W in a horizontal direction is inserted into the first opening A1. A gap for allowing expansion/shrinkage due to thermal expansion of the sheet-like article 11 is formed between the guide 21 and the first opening A1. Accordingly, even if the supporting sheet 11 expands or is shrunk, the guide 21 never interfere the expansion/shrinkage of the supporting sheet 11. Thus, wrinkles or warpage on the supporting sheet 11 can be prevented.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使设置在热处理板的上表面上的片状物品膨胀或收缩，也能够提供能够防止片状物品上的褶皱的热处理装置治疗板。解决方案：在热处理板W的上表面上设置支撑片11.在支撑片11上，通过密封部分15在外侧形成第一开口A1。水平方向的W被插入到第一开口A1中。在引导件21和第一开口A1之间形成有由于片状物11的热膨胀引起的膨胀/收缩的间隙。因此，即使支撑片材11膨胀或收缩，引导件21也不会妨碍支撑片材11的膨胀/收缩。因此，可以防止支撑片材11上的褶皱或翘曲。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006041048A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2006041048A
公开(公告)日：2006-02-09
申请号：JP2004216285
申请日：2004-07-23
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： KOUGAKI KOUICHI , TANIGUCHI HIDEYUKI , HAYASHI TOYOHIDE , INOUE KAZUKI , YOSHIDA TAKESHI
IPC分类号： H01L21/304 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving the storage efficiency of equipment in an equipment box.
SOLUTION: The equipment box 4 is supported at its front-side lower end rotatably on a support shaft 5 extending nearly horizontally, and tilted toward the front on the support shaft 5 as a fulcrum to be drawn out of a frame 1. Wires such as signal lines for signal transmission and reception, feed lines for power supply, etc., are connected to respective pieces of equipment in the equipment box 4. The respective wires are arranged extending into the frame 1 through nearby the support shaft 5. Consequently, the respective wires need not be made unnecessarily long even in the constitution wherein the equipment box 4 is drawn out of the frame 1 to eliminate the need to secure a wide space for storing the wires.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供能够提高设备箱内的设备的存储效率的基板处理装置。解决方案：设备箱4在其前侧下端可旋转地支撑在几乎水平延伸的支撑轴5上，并且以支撑轴5的前方作为支点倾斜以从框架1拉出。诸如用于信号发送和接收的信号线，用于电源的馈线等的电线连接到设备箱4中的各个设备。各个电线通过附近的支撑轴5布置成延伸到框架1中。因此，即使在将设备箱4从框架1中拉出的结构中，也不需要使各个电线不必要地长，从而不需要确保用于存放电线的宽的空间。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006032858A Substrate treating device 有权
标题翻译：基板处理设备
公开(公告)号：JP2006032858A
公开(公告)日：2006-02-02
申请号：JP2004213531
申请日：2004-07-21
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： KOUGAKI KOUICHI , TANIGUCHI HIDEYUKI , HAYASHI TOYOHIDE , INOUE KAZUKI , YOSHIDA TAKESHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate treating device for supplying a rinse liquid to the entire region of the surface of a substrate without any irregularities without causing any inconveniences, such as the drying marks of chemicals.
SOLUTION: A first rinse liquid fixing nozzle 8 and a second rinse liquid fixing nozzle 9 are arranged adjacently on the upper surface of a splash guard 5. The rinse liquid from the first rinse liquid fixing nozzle 8 is supplied to the rotation center of the surface of a wafer W rotated by a spin chuck 3, while the rinse liquid from the second rinse liquid fixing nozzle 9 is supplied to a 1/4 circular (sector) region that orthogonally crosses a projection straight line L in a plan view and is at the downstream side in the rotary direction of the wafer W from the projection straight line L in a semicircular region at the side of the first rinse liquid fixing nozzle 8 (the side of the second rinse liquid fixing nozzle 9) to a straight line D in parallel with the surface of the wafer W, thus supplying a sufficient amount of rinse liquid to the entire region of the surface of the wafer W.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于将冲洗液体供应到基板表面的整个区域而没有任何不规则性的基板处理装置，而不会引起诸如化学品的干燥痕迹的任何不便。解决方案：第一冲洗液体固定喷嘴8和第二冲洗液体固定喷嘴9相邻布置在防溅罩5的上表面上。来自第一漂洗液固定喷嘴8的冲洗液体被供应到旋转中心通过旋转卡盘3旋转的晶片W的表面，同时来自第二冲洗液体固定喷嘴9的冲洗液体被供给到在平面图中正交地穿过突出直线L的1/4圆形（扇形）区域并且在第一冲洗液固定喷嘴8侧（第二冲洗液固定喷嘴9侧）的半圆形区域中的投影直线L向晶片W的旋转方向的下游侧延伸至直线线D与晶片W的表面平行，从而向晶片W的表面的整个区域提供足够量的冲洗液。（C）2006，JPO和NCIPI

7. 发明专利

JP2006024793A Chemical solution recovering method and board processing device 审中-公开
标题翻译：化学解决方案回收方法和板加工设备
公开(公告)号：JP2006024793A
公开(公告)日：2006-01-26
申请号：JP2004202268
申请日：2004-07-08
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： KOUGAKI KOUICHI , TANIGUCHI HIDEYUKI , HAYASHI TOYOHIDE , INOUE KAZUKI , YOSHIDA TAKESHI
IPC分类号： H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a chemical solution recovering method and a board processing device, wherein the lifetime of a filter can be prolonged for removing a chemical solution to be repeatedly used for a board processing or a contaminant in the chemical solution.
SOLUTION: While a predetermined time period passes from a chemical solution feeding start to a wafer, the chemical solution used for the process of the wafer is discarded to a high-density discharge drain through a common line 15 and a branch discarding line 24. The chemical solution used for the process of the wafer, after the passage of the predetermined time period, is recovered to a recovery tank 22 through the common line 15 and a branch recovering line 23. For this reason, even if a large amount of contaminants, such as polymer or the like, are removed from the wafer at an initial stage after a supply start of the chemical solution, a large amount of contaminants can be prevented from being mixed to the chemical solution in the recovery tank 22. As a result, the lifetime of a front-stage filter 35 or of the like for removing the contaminants from the chemical solution to be reused can be prolonged, and also the lifetime of the chemical solution to be repeatedly used can be prolonged.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供化学溶液回收方法和板处理装置，其中可以延长过滤器的寿命以除去化学溶液以重复用于板处理或化学溶液中的污染物。解决方案：在从化学溶液供给开始到晶片的预定时间段期间，用于晶片处理的化学溶液通过公共线15和分支丢弃线被丢弃到高密度排放漏极用于晶片处理的化学溶液经过预定时间段后，通过公共管线15和分支回收管线23回收到回收罐22中。因此，即使大量的污染物如聚合物等在化学溶液供应开始后的初始阶段从晶片中除去，可以防止大量污染物与回收罐22中的化学溶液混合。作为结果，可以延长用于从要再次使用的化学溶液中除去污染物的前级过滤器35等的寿命，并且可以重复使用的化学溶液的寿命渴望。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006019584A Substrate treatment equipment 审中-公开
标题翻译：基板处理设备
公开(公告)号：JP2006019584A
公开(公告)日：2006-01-19
申请号：JP2004197030
申请日：2004-07-02
申请人： Dainippon Screen Mfg Co Ltd , 大日本スクリーン製造株式会社
发明人： KOUGAKI KOUICHI , TANIGUCHI HIDEYUKI , HAYASHI TOYOHIDE , INOUE KAZUKI , YOSHIDA TAKESHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide substrate treatment equipment comprising a plurality of treatment chambers, capable of reducing a capacity required for exhausting power.
SOLUTION: A plurality of treatment chambers 21-24 storing a plurality of treatment parts 41-44, respectively, are arranged in a two-floor construction along a transportation path 30 in which a transportation unit 20 is arranged. A piping chamber 31 where treatment liquid pipings connected to treatment parts 41-44 are collectively arranged and stored is disposed between a pair of the laminated treatment chambers 21 and 22 and the other pair of laminated treatment chambers 23 and 24. The piping chamber 31 is connected to a power usage connection box arranged below the treatment parts 41 and 42 on a first floor. The power usage connection box is connected to the exhausting power usage of a factory through an exhaust collective chamber.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够降低排气功率所需容量的多个处理室的基板处理设备。解决方案：分别存储多个处理部分41-44的多个处理室21-24沿着布置有传送单元20的传送路径30布置成两层结构。在一对层叠处理室21,22和另一对层叠处理室23,24之间配置有与处理部41-44连接的处理液管道共同配置并存放的配管室31。连接到在一楼设置在治疗部分41和42下方的电力使用连接盒。电力使用接线盒通过排气集合室连接到工厂的排气功率。版权所有（C）2006，JPO＆NCIPI

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