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1. 发明专利

JP2013101741A Circuit board, substrate for suspension, suspension, suspension with element, and hard disk drive 有权
标题翻译：电路板，悬挂基板，悬架，悬挂元件和硬盘驱动
公开(公告)号：JP2013101741A
公开(公告)日：2013-05-23
申请号：JP2012229015
申请日：2012-10-16
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KANKE SATORU , AMAGAI KEI , TAKACHI KIYOHIRO , SAKAYORI KATSUYA , KAWASAKI HIROSHI , YAMAZAKI TAKESHI , UCHIYA NAOYUKI
IPC分类号： G11B5/60 , G11B21/21 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a circuit board that has a laminate structure where two conductor layers are laminated via an insulator layer, the circuit board having less warpage.SOLUTION: A circuit board contains a metal support substrate, a first insulator layer formed on the metal support substrate, a conductor layer formed on the first insulator layer, and a second insulator layer formed on the conductor layer. At least one of the first insulator layer and second insulator layer contains a specific polyimide resin represented by formula (1).
摘要翻译：要解决的问题：为了提供具有层压结构的电路板，其中两个导体层经由绝缘体层层合，电路板具有较小的翘曲。电路板包括金属支撑基板，形成在金属支撑基板上的第一绝缘体层，形成在第一绝缘体层上的导体层和形成在导体层上的第二绝缘体层。第一绝缘体层和第二绝缘体层中的至少一个含有由式（1）表示的特定聚酰亚胺树脂。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011243271A Circuit substrate, substrate for suspension, suspension, suspension with elements and hard disk drive 有权
标题翻译：电路基板，悬架基板，悬架，悬挂元件和硬盘驱动
公开(公告)号：JP2011243271A
公开(公告)日：2011-12-01
申请号：JP2011093526
申请日：2011-04-19
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KAWASAKI HIROSHI , SAKAYORI KATSUYA , TAKACHI KIYOHIRO
IPC分类号： G11B5/60 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To provide a circuit substrate with small warpage which has a laminated structure obtained by laminating two conductor layers via an insulator layer.SOLUTION: A circuit substrate comprises a metallic supporting substrate, a first insulator layer formed on the metallic supporting substrate, a first conductor layer formed on the first insulator layer, a second insulator layer formed on the first conductor layer, a second conductor layer formed on the second insulator layer and a third insulator layer formed on the second conductor layer. The linear thermal expansion coefficient of the first insulator layer is greater than the linear thermal expansion coefficient of the metallic supporting substrate, and at least one of the linear thermal expansion coefficients of the second insulator layer and the third insulator layer is less than the linear thermal expansion coefficient of the metallic supporting substrate.
摘要翻译：要解决的问题：提供具有小翘曲的电路基板，该电路基板具有通过绝缘层层压两个导体层而获得的层叠结构。解决方案：电路基板包括金属支撑基板，形成在金属支撑基板上的第一绝缘体层，形成在第一绝缘体层上的第一导体层，形成在第一导体层上的第二绝缘体层，第二导体层，形成在第二绝缘体层上，第三绝缘体层形成在第二导体层上。第一绝缘体层的线性热膨胀系数大于金属支撑衬底的线性热膨胀系数，并且第二绝缘体层和第三绝缘体层的线性热膨胀系数中的至少一个小于线性热膨胀系数金属支撑基体的膨胀系数。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2008310946A Substrate for suspension, method for producing the same, magnetic head suspension, and hard disk drive 有权
标题翻译：用于悬挂的基板，其制造方法，磁头悬挂和硬盘驱动
公开(公告)号：JP2008310946A
公开(公告)日：2008-12-25
申请号：JP2008115592
申请日：2008-04-25
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： HITOMI YOICHI , MOMOSE TERUHISA , KUMON SHINJI , SAKAYORI KATSUYA , TAKACHI KIYOHIRO
IPC分类号： G11B5/60 , C08G73/10 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a suspension nearly free from warpage even when its rigidity is lowered. SOLUTION: The substrate 10 for the suspension comprises a metal substrate 1, an insulating layer 2 formed on the metal substrate 1, a wiring layer 3 formed on the insulating layer 2, and a cover layer 4 covering the wiring layer 3. The material of the insulating layer 2 is different from the material of the cover layer 4, and their coefficients of moisture-absorption expansion are within the range from 0×10 -6 /%RH to 30×10 -6 /%RH. The difference between the coefficients of moisture-absorption expansion of these materials is not more than 5×10 -6 /%RH. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使刚性降低，也提供一种几乎没有翘曲的悬浮液的基板。解决方案：用于悬架的基板10包括金属基板1，形成在金属基板1上的绝缘层2，形成在绝缘层2上的布线层3和覆盖布线层3的覆盖层4。绝缘层2的材料与覆盖层4的材料不同，它们的吸湿膨胀系数在0×10 -6 /％RH至30×10 10的范围内 -6 /％RH。这些材料的吸湿膨胀系数之间的差异不大于5×10 -6 /％RH。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2013093081A Method for designing circuit board, method for manufacturing circuit board, circuit board, substrate for suspension, suspension, suspension with element, and hard disk drive 审中-公开
标题翻译：设计电路板的方法，制造电路板的方法，电路板，用于悬架的衬底，悬架，悬挂元件和硬盘驱动
公开(公告)号：JP2013093081A
公开(公告)日：2013-05-16
申请号：JP2011235414
申请日：2011-10-26
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KAWASAKI HIROSHI , SAKAYORI KATSUYA , TAKACHI KIYOHIRO
IPC分类号： G11B5/60 , G11B21/21 , H05K1/05 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for designing a circuit board capable of reducing warpage of a circuit board having a stacked structure in which two conductor layers are stacked through an insulating layer.SOLUTION: The method for designing the circuit board having a metal supporting substrate 1, a first insulating layer 2 formed on the metal supporting substrate, a first conductor layer 3 formed on the first insulating layer, a second insulating layer 4 formed on the first conductor layer, a second conductor layer 5 formed on the second insulating layer and a third insulating layer 6 formed on the second conductor layer includes a condition determining step of determining that the thicknesses and the coefficients of linear thermal expansion of the first insulating layer, the second insulating layer and the third insulating layer satisfy a specific relational expression with respect to the coefficient of linear thermal expansion of the metal supporting substrate.
摘要翻译：解决的问题：提供一种能够减少具有层叠结构的电路板的翘曲的电路板的设计方法，其中两个导体层通过绝缘层堆叠。解决方案：设计具有金属支撑基板1的电路板的方法，形成在金属支撑基板上的第一绝缘层2，形成在第一绝缘层上的第一导体层3，形成在第一绝缘层4上的第二绝缘层4 第一导体层，形成在第二绝缘层上的第二导体层5和形成在第二导体层上的第三绝缘层6包括条件确定步骤，确定第一绝缘层的线性热膨胀的厚度和系数第二绝缘层和第三绝缘层相对于金属支撑基板的线性热膨胀系数满足特定关系式。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012093746A Photosensitive resin composition, pattern formation material and pattern formation method 有权
标题翻译：光敏树脂组合物，图案形成材料和图案形成方法
公开(公告)号：JP2012093746A
公开(公告)日：2012-05-17
申请号：JP2011217212
申请日：2011-09-30
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： AMAGAI KEI , SAKAYORI KATSUYA , TAKACHI KIYOHIRO , FUKUDA TOSHIHARU
IPC分类号： G03F7/038 , C08G73/10 , G03F7/004
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of reducing a developing time and obtaining an excellent pattern shape.SOLUTION: A photosensitive resin composition contains a polyimide precursor including a structure represented by the following formula (1) and a photobase generator. (In the formula (1), R1 is a tetravalent organic group, R2 is a bivalent organic group, R3 is a hydrogen atom or univalent organic group, R4 is a hydrogen atom or at least one kind of organic group selected from the group consisting of organic groups of specific structure, and at least a part of R4 is an organic group. The plural R1, R2, R3, and R4 may be all the same or different from each other. )
摘要翻译：解决的问题：提供能够减少显影时间并获得优异图案形状的感光性树脂组合物。解决方案：感光性树脂组合物含有包含由下式（1）表示的结构的聚酰亚胺前体和光碱产生剂。（式（1）中，R 1为四价有机基团，R 2为二价有机基团，R 3为氢原子或一价有机基团，R 4为氢原子或至少1种选自的具体结构的有机基团，R4的至少一部分是有机基团，多个R 1，R 2，R 3和R 4可以相同或不同。）版权所有（C）2012 ，JPO＆INPIT

6. 发明公开

KR20200126396A 기능성 필름, 편광판 및 화상 표시 장치 审中-公开
公开(公告)号：KR20200126396A
公开(公告)日：2020-11-06
申请号：KR20207027434
申请日：2019-02-27
申请人： DAINIPPON PRINTING CO LTD
发明人： KANKE SATORU , TAKACHI KIYOHIRO , ISHIDA KAZUTOSHI , IWASAKI TOSHIKI , SATO MASAHARU , OOMORI HIROAKI , OGAWA TOMOHIRO
IPC分类号： G02B1/14 , B32B7/023 , B32B27/20 , G02B5/30 , G02F1/1335 , H01L27/32
摘要： 하드코팅층과기능층사이의밀착성및 원하는광학특성의양립을실현가능한기능성필름그리고이것을구비한편광판및 화상표시장치를제공한다. 본발명의일 양태에의하면, 바인더수지(13) 및복수의무기입자(14)를포함하는하드코팅층(12)과, 하드코팅층(12)의표면(12A)에밀착한기능층(16)을구비하는기능성필름(10)이며, 하드코팅층(12)은, 하드코팅층(12)의표면(12A)으로부터깊이 100 nm까지의제1 영역 R1 내에무기입자(14)의치밀도가 60% 이상인층상영역을갖고, 하드코팅층(12)의표면(12A)으로부터 100 nm를초과하는제2 영역 R2에서의무기입자(14)의치밀도가 59% 이하인, 기능성필름(10)이제공된다.

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