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    • 5. 发明授权
    • Contactless nonvolatile memory device and method of forming the same
    • 非接触非易失性存储器件及其形成方法
    • US07276415B2
    • 2007-10-02
    • US11590620
    • 2006-10-31
    • Wook-Hyun KwonChan-Kwang ParkSang-Pil Sim
    • Wook-Hyun KwonChan-Kwang ParkSang-Pil Sim
    • H01L21/8247
    • H01L27/11521H01L27/115
    • A method of forming a contactless nonvolatile memory device includes preparing a semiconductor substrate including a cell array region, forming a plurality of mask patterns being parallel to each other on the semiconductor substrate in the cell array region, etching the semiconductor substrate using the mask patterns as an etch mask to form a plurality of recess regions, forming a gate insulating layer on sidewalls and bottoms of the recess regions, forming a floating gate layer on an upper surface of the semiconductor substrate to fill the recess regions, planarizing the floating gate layer to expose upper surfaces of the mask patterns and to form floating gate patterns in the recess regions, forming buried impurity diffusion regions in the semiconductor substrate under the mask patterns, forming an intergate dielectric layer, forming a control gate layer, and patterning the control gate layer, the intergate dielectric layer and the floating gate pattern to form a plurality of parallel word lines crossing the mask patterns, floating gates between the word lines and the recess regions, and an intergate dielectric pattern between the floating gates and the word lines, and to expose the recess regions and the mask patterns between word lines.
    • 一种形成非接触非易失性存储器件的方法包括:制备包括单元阵列区域的半导体衬底,在单元阵列区域中的半导体衬底上形成彼此平行的多个掩模图案,使用掩模图案蚀刻半导体衬底 蚀刻掩模以形成多个凹陷区域,在所述凹陷区域的侧壁和底部上形成栅极绝缘层,在所述半导体衬底的上表面上形成浮栅,以填充所述凹陷区域,将所述浮栅层平坦化为 露出掩模图案的上表面并在凹陷区域中形成浮置栅极图案,在掩模图案之下的半导体衬底中形成掩埋的杂质扩散区域,形成栅间电介质层,形成控制栅极层,以及图案化控制栅极层 ,隔间电介质层和浮栅图案,以形成多个平行 与文字线和凹槽区域之间的浮动栅极以及浮动栅极和字线之间的隔间电介质图案,以及露出凹槽区域和字线之间的掩模图案。
    • 6. 发明授权
    • Fabrication method and structure for providing a recessed channel in a nonvolatile memory device
    • 用于在非易失性存储器件中提供凹陷通道的制造方法和结构
    • US07531409B2
    • 2009-05-12
    • US11583796
    • 2006-10-20
    • Sang-Pil SimKwang-soo KimChan-Kwang ParkHeon-Kyu Lee
    • Sang-Pil SimKwang-soo KimChan-Kwang ParkHeon-Kyu Lee
    • H01L21/336
    • H01L27/11524H01L21/28273H01L27/0207H01L27/115H01L27/11519H01L27/11521
    • A method of fabricating a nonvolatile memory device includes preparing a semiconductor substrate including a cell array region. The method also includes forming a recessed region in the cell array region by etching the semiconductor substrate. The method includes etching at least a portion of the semiconductor substrate that partially includes the recessed region and forming first and second trenches that differ in depth, intersect the recessed region, and link with each other. The method includes forming a device isolation layer having rugged bottoms and defining an active region by filling an insulating material in the first and second trenches. The method includes forming a gate insulation layer on the semiconductor substrate of the active region including the recessed region and forming a gate structure on the gate insulation layer, to fill the recessed region, the gate structure including a floating gate, an intergate insulating pattern, and a control gate.
    • 制造非易失性存储器件的方法包括制备包括单元阵列区域的半导体衬底。 该方法还包括通过蚀刻半导体衬底在电池阵列区域中形成凹陷区域。 该方法包括蚀刻半导体衬底的至少一部分,其部分地包括凹陷区域并形成深度不同,与凹陷区域相交并彼此连接的第一和第二沟槽。 该方法包括形成具有粗糙底部的器件隔离层,并且通过在第一和第二沟槽中填充绝缘材料来限定有源区。 该方法包括在包括凹陷区域的有源区的半导体衬底上形成栅极绝缘层,并在栅极绝缘层上形成栅极结构,以填充凹陷区域,栅极结构包括浮置栅极,栅极间绝缘图案, 和控制门。
    • 7. 发明申请
    • FABRICATION METHOD AND STRUCTURE FOR PROVIDING A RECESSED CHANNEL IN A NONVOLATILE MEMORY DEVICE
    • 用于在非易失性存储器件中提供被记录的通道的制造方法和结构
    • US20090200596A1
    • 2009-08-13
    • US12417127
    • 2009-04-02
    • Sang-Pil SimKwang-soo KimChan-Kwang ParkHeon-Kyu Lee
    • Sang-Pil SimKwang-soo KimChan-Kwang ParkHeon-Kyu Lee
    • H01L29/788
    • H01L27/11524H01L27/0207H01L27/115H01L27/11519H01L27/11521H01L29/40114
    • A method of fabricating a nonvolatile memory device includes preparing a semiconductor substrate including a cell array region. The method also includes forming a recessed region in the cell array region by etching the semiconductor substrate. The method includes etching at least a portion of the semiconductor substrate that partially includes the recessed region and forming first and second trenches that differ in depth, intersect the recessed region, and link with each other. The method includes forming a device isolation layer having rugged bottoms and defining an active region by filling an insulating material in the first and second trenches. The method includes forming a gate insulation layer on the semiconductor substrate of the active region including the recessed region and forming a gate structure on the gate insulation layer, to fill the recessed region, the gate structure including a floating gate, an intergate insulating pattern, and a control gate.
    • 制造非易失性存储器件的方法包括制备包括单元阵列区域的半导体衬底。 该方法还包括通过蚀刻半导体衬底在电池阵列区域中形成凹陷区域。 该方法包括蚀刻半导体衬底的至少一部分,其部分地包括凹陷区域并形成深度不同,与凹陷区域相交并彼此连接的第一和第二沟槽。 该方法包括形成具有粗糙底部的器件隔离层,并且通过在第一和第二沟槽中填充绝缘材料来限定有源区。 该方法包括在包括凹陷区域的有源区的半导体衬底上形成栅极绝缘层,并在栅极绝缘层上形成栅极结构,以填充凹陷区域,栅极结构包括浮置栅极,栅极间绝缘图案, 和控制门。