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1. 发明授权

US08865393B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08865393B2
公开(公告)日：2014-10-21
申请号：US13213939
申请日：2011-08-19
申请人： Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
发明人： Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
IPC分类号： G03F7/20 , H05K3/30 , H01L21/48 , H01L23/498 , H01L21/56 , H05K3/28 , H05K3/34 , H01L23/00
CPC分类号： H05K3/305 , H01L21/4853 , H01L21/563 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H05K3/28 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49124 , H01L2924/00 , H01L2924/014
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.
摘要翻译：这里公开了一种印刷电路板及其制造方法，包括：在基底基板上形成覆盖膜层叠的保护层; 使覆盖膜层叠的保护层曝光，对保护层进行光敏化，使遮盖膜光降解; 以及显影光降解的覆盖膜和光敏保护层，以形成在保护层上露出作为基底基板的最外层的电路层的焊盘单元的开口，由此可以提高印刷电路板的生产率，而不执行分离覆盖膜的过程。

2. 发明申请

US20120055901A1 SUBSTRATE FABRICATING APPARATUS AND SUBSTRATE FABRICATING METHOD 审中-公开
标题翻译：基板制作装置和基板制造方法
公开(公告)号：US20120055901A1
公开(公告)日：2012-03-08
申请号：US12987812
申请日：2011-01-10
申请人： Chang Bo Lee , Cheol Ho Choi , Dae Jo Hong
发明人： Chang Bo Lee , Cheol Ho Choi , Dae Jo Hong
IPC分类号： H01L21/306
CPC分类号： H05K3/383 , H05K3/0085 , H05K3/3452 , H05K2203/1476
摘要： Disclosed herein are a substrate fabricating apparatus and a substrate fabricating method. The substrate fabricating apparatus includes: a first injector that injects a first etchant to a circuit layer formed as an outermost layer of a base substrate to form first type of ruggedness; and a second injector that injects a second etchant to the circuit layer formed with the first type of ruggedness to form second type of ruggedness. The present invention provides the substrate fabricating apparatus and the substrate fabricating method that inject different etchants to the circuit layer to form different ruggedness, thereby making it possible to widen the specific surface area of the circuit layer to improve adhesion between the circuit layer and the protective layer.
摘要翻译：本文公开了一种基板制造装置和基板制造方法。基板制造装置包括：第一注入器，其将第一蚀刻剂注入形成为基底基板的最外层的电路层，以形成第一类型的凹凸; 以及第二喷射器，其将第二蚀刻剂喷射到形成有第一类型的凹凸的电路层，以形成第二类型的凹凸。本发明提供了一种衬底制造装置和衬底制造方法，其将不同的蚀刻剂注入电路层以形成不同的粗糙度，从而可以拓宽电路层的比表面积，从而提高电路层与保护层之间的粘附性层。

3. 发明授权

US09107329B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US09107329B2
公开(公告)日：2015-08-11
申请号：US13232220
申请日：2011-09-14
申请人： Chang Bo Lee , Dae Jo Hong , Cheol Ho Choi
发明人： Chang Bo Lee , Dae Jo Hong , Cheol Ho Choi
IPC分类号： H05K3/00 , H05K3/24 , H05K3/34 , H01L23/00
CPC分类号： H05K3/243 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/131 , H01L2224/16225 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/12042 , H05K3/3452 , H05K2203/1383 , Y10T29/49147 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.
摘要翻译：这里公开了一种印刷电路板的制造方法。制造印刷电路板的方法包括：制备具有第一连接焊盘和第二连接焊盘的基底基板; 在所述基底基板上形成阻焊层，所述阻焊层具有用于暴露所述第一连接焊盘的第一开口; 在所述第一连接焊盘上形成第一表面处理层; 在阻焊层上形成保护膜; 形成用于暴露所述保护膜和阻焊层中的第二连接焊盘的第二开口; 以及在所述第二连接焊盘上形成第二表面处理层。

4. 发明申请

US20120103662A1 Printed circuit board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120103662A1
公开(公告)日：2012-05-03
申请号：US13064331
申请日：2011-03-18
申请人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
发明人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
IPC分类号： H05K1/02 , B05D5/00 , H05K3/10 , H05K3/22
CPC分类号： H05K3/3452 , H05K3/3436 , H05K2203/0278 , H05K2203/1476 , Y10T29/49155 , Y10T156/10
摘要： Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.
摘要翻译：这里公开了一种印刷电路板，其包括形成在其上形成有电路图案的基板的一个表面上的第一低粘度阻焊层和堆叠在第一阻焊层上的第二高粘度阻焊层，由此有利于控制阻焊剂（SR）的应用厚度的偏差，同时对基板具有优异的粘附性及其制造方法。

5. 发明申请

US20100052152A1 Semiconductor package transformer 失效
标题翻译：半导体封装变压器
公开(公告)号：US20100052152A1
公开(公告)日：2010-03-04
申请号：US12461869
申请日：2009-08-26
申请人： Cheol Ho Choi
发明人： Cheol Ho Choi
IPC分类号： H01L23/482 , H01L23/538
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
摘要翻译：本发明涉及一种半导体封装变压器。提供了一种半导体封装变压器，其包括：在其前表面上形成插入有安装在基板上的芯片的半导体封装的开口的窗口，并且在其上表面上形成露出部分; 以及形成在壳体的底面上的多个孔。

6. 发明授权

US09060458B2 Method for manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US09060458B2
公开(公告)日：2015-06-16
申请号：US13137352
申请日：2011-08-08
申请人： Yoong Oh , Cheol Ho Choi
发明人： Yoong Oh , Cheol Ho Choi
IPC分类号： H05K3/02 , H05K3/10 , H05K3/00 , H05K1/00 , H05K1/03 , H05K3/46
CPC分类号： H05K3/4652 , H05K2203/0733 , H05K2203/1189 , Y10T29/49155
摘要： A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed; forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of the insulating films.
摘要翻译：制造多层印刷电路板的方法包括：以预定间隔在第一铜层的一个表面上形成第一凸块; 在所述第一铜层上提供绝缘层，所述第一凸块穿过所述绝缘层; 在绝缘层的顶部堆叠第二铜层; 通过图案化第一铜层和第二铜层来形成电路; 在其上形成有电路的绝缘层的顶表面和底表面上层压绝缘膜; 在第三铜层和第四铜层的一个表面上以预定间隔形成第二凸起; 并且在绝缘膜的顶表面和底表面上堆叠设置有第二凸起的第三铜层和第四铜层。

7. 发明授权

US08489222B2 Machine and method for grinding spacer grid of nuclear fuel assembly 有权
标题翻译：用于研磨核燃料组件的间隔栅格的机器和方法
公开(公告)号：US08489222B2
公开(公告)日：2013-07-16
申请号：US12857530
申请日：2010-08-16
申请人： Chang Kug Kim , Deuk Yeon Kim , Jung Hwan Hong , Hang Rae Kim , Cheol Ho Choi
发明人： Chang Kug Kim , Deuk Yeon Kim , Jung Hwan Hong , Hang Rae Kim , Cheol Ho Choi
IPC分类号： G06F19/00
CPC分类号： B24B51/00 , B24B1/00 , B24B27/0076 , B24B49/02 , B25J11/0065 , G21C3/3424
摘要： A machine and a method for grinding a spacer grid of a nuclear fuel assembly. The machine includes a spacer grid holding unit, a first rectangular coordinates robot for grinding an outer surface of the spacer grid, a second rectangular coordinates robot for grinding a corner of the spacer grid, and a control unit. The spacer grid holding unit includes a holding jig onto which the spacer grid is seated and held, and a rotary index table which is coupled to the holding jig to rotate the holding jig. The first and second rectangular coordinates robots are provided at predetermined positions adjacent to the spacer grid holding unit. The control unit controls the spacer grid holding unit, the first and second rectangular coordinates robots and all programs required to conduct the operation for grinding the spacer grid.
摘要翻译：一种用于研磨核燃料组件的间隔栅格的机器和方法。该机器包括间隔栅格保持单元，用于研磨间隔栅格的外表面的第一直角坐标机器人，用于研磨间隔栅格的角部的第二直角坐标机器人和控制单元。间隔栅格保持单元包括保持夹具，间隔栅格被放置在其上并保持在该保持夹具上;旋转分度台，其连接到保持夹具以旋转保持夹具。第一和第二直角坐标机器人设置在与间隔栅格保持单元相邻的预定位置处。控制单元控制间隔栅格保持单元，第一和第二直角坐标机器人以及进行用于研磨间隔栅格的操作所需的所有程序。

8. 发明授权

US08143715B2 Semiconductor package transformer 失效
标题翻译：半导体封装变压器
公开(公告)号：US08143715B2
公开(公告)日：2012-03-27
申请号：US12461869
申请日：2009-08-26
申请人： Cheol Ho Choi
发明人： Cheol Ho Choi
IPC分类号： H01L23/482 , H01L23/538
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
摘要翻译：本发明涉及一种半导体封装变压器。提供了一种半导体封装变压器，其包括：在其前表面上形成插入有安装在基板上的芯片的半导体封装的开口的窗口，并且在其上表面上形成露出部分; 以及形成在壳体的底面上的多个孔。

9. 发明授权

US08728186B2 Vacuum cleaner and dust separating apparatus thereof 有权
标题翻译：吸尘器及其除尘装置
公开(公告)号：US08728186B2
公开(公告)日：2014-05-20
申请号：US13600906
申请日：2012-08-31
申请人： Tak Soo Kim , Cheol Ho Choi , Jun Won Seo , Jin Ho Lee , Keon Soo Choi
发明人： Tak Soo Kim , Cheol Ho Choi , Jun Won Seo , Jin Ho Lee , Keon Soo Choi
IPC分类号： B01D50/00
CPC分类号： A47L9/1625 , A47L5/362 , A47L9/0081 , A47L9/1666 , A47L9/1683 , A47L9/1691
摘要： A vacuum cleaner provided with a dust separating apparatus which has an improved aesthetic quality and has an increased size without increasing the height of the vacuum cleaner. The dust-separating apparatus is easily detachable with respect to a vacuum cleaner body, and is provided with a cover that is easily detachable when dirt collected in the dust collecting compartment is discarded. The vacuum cleaner includes a first cyclone part and a second cyclone part, and a first dust collecting compartment configured to collect dirt separated from the first cyclone part is formed at a lower side of the first cyclone part and the second cyclone part.
摘要翻译：一种具有灰尘分离装置的真空吸尘器，其具有改善的美学质量并且具有增加的尺寸而不增加真空吸尘器的高度。灰尘分离装置相对于真空吸尘器本体容易拆卸，并且设置有当废弃收集在集尘室中的污物时易于拆卸的盖。真空吸尘器包括第一旋风部分和第二旋风部分，并且构造成收集从第一旋风部分分离的污物的第一集尘室形成在第一旋风部分和第二旋风部分的下侧。

10. 发明申请

US20130055691A1 VACUUM CLEANER AND DUST SEPARATING APPARATUS THEREOF 有权
标题翻译：真空清洁器及其分离装置
公开(公告)号：US20130055691A1
公开(公告)日：2013-03-07
申请号：US13600906
申请日：2012-08-31
申请人： Tak Soo Kim , Cheol Ho Choi , Jun Won Seo , Jin Ho Lee , Keon Soo Choi
发明人： Tak Soo Kim , Cheol Ho Choi , Jun Won Seo , Jin Ho Lee , Keon Soo Choi
IPC分类号： B01D45/12 , B01D50/00
CPC分类号： A47L9/1625 , A47L5/362 , A47L9/0081 , A47L9/1666 , A47L9/1683 , A47L9/1691
摘要： A vacuum cleaner provided with a dust separating apparatus which has an improved aesthetic quality and has an increased size without increasing the height of the vacuum cleaner. The dust-separating apparatus is easily detachable with respect to a vacuum cleaner body, and is provided with a cover that is easily detachable when dirt collected in the dust collecting compartment is discarded. The vacuum cleaner includes a first cyclone part and a second cyclone part, and a first dust collecting compartment configured to collect dirt separated from the first cyclone part is formed at a lower side of the first cyclone part and the second cyclone part.
摘要翻译：一种具有灰尘分离装置的真空吸尘器，其具有改善的美学质量并且具有增加的尺寸而不增加真空吸尘器的高度。灰尘分离装置相对于真空吸尘器本体容易拆卸，并且设置有当废弃收集在集尘室中的污物时易于拆卸的盖。真空吸尘器包括第一旋风部分和第二旋风部分，并且构造成收集从第一旋风部分分离的污物的第一集尘室形成在第一旋风部分和第二旋风部分的下侧。

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