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1. 发明申请

US20120103662A1 Printed circuit board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120103662A1
公开(公告)日：2012-05-03
申请号：US13064331
申请日：2011-03-18
申请人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
发明人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
IPC分类号： H05K1/02 , B05D5/00 , H05K3/10 , H05K3/22
CPC分类号： H05K3/3452 , H05K3/3436 , H05K2203/0278 , H05K2203/1476 , Y10T29/49155 , Y10T156/10
摘要： Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.
摘要翻译：这里公开了一种印刷电路板，其包括形成在其上形成有电路图案的基板的一个表面上的第一低粘度阻焊层和堆叠在第一阻焊层上的第二高粘度阻焊层，由此有利于控制阻焊剂（SR）的应用厚度的偏差，同时对基板具有优异的粘附性及其制造方法。

2. 发明申请

US20060272299A1 Cyclone dust collecting apparatus 审中-公开
标题翻译：旋风除尘装置
公开(公告)号：US20060272299A1
公开(公告)日：2006-12-07
申请号：US11317619
申请日：2005-12-23
申请人： Cheol-ho Choi
发明人： Cheol-ho Choi
IPC分类号： B01D50/00
CPC分类号： A47L9/1608 , A47L9/122 , A47L9/165 , A47L9/1658 , A47L9/1683
摘要： A cyclone dust collecting apparatus according to an embodiment of the present invention, comprises a housing centrifugally separating and collecting dust from drawn-in air and discharging cleaned air, a housing cover connected to an upper part of the housing, a discharge cover openably connected to a lower part of the housing, and a filter assembly. The housing includes an air inlet, a cyclone unit centrifugally separating dust from external air drawn in through the air inlet, an inflow guide pipe having a substantially curved shape and guiding the whole air drawn in through the air inlet to the cyclone unit, a dust collection unit formed at one side of the cyclone unit to collect the separated dust, and an air outlet where the dust-separated air is discharged.
摘要翻译：根据本发明的一个实施例的旋风除尘装置包括：壳体，其从抽吸空气中离心分离和收集灰尘并排出净化空气;壳体盖，连接到壳体的上部;排出盖，可开启地连接到壳体的下部和过滤器组件。壳体包括空气入口，将通过空气入口吸入的外部空气离心分离的旋风单元，具有基本弯曲形状的流入导管，并将通过空气入口吸入的整个空气引导到旋风单元，灰尘收集单元形成在旋风单元的一侧以收集分离的灰尘，以及排出空气的空气出口。

3. 发明授权

US07053541B2 Rail in flat type cathode ray tube 失效
公开(公告)号：US07053541B2
公开(公告)日：2006-05-30
申请号：US10289422
申请日：2002-11-07
申请人： Bum-Sik Seo , Cheol-Ho Choi
发明人： Bum-Sik Seo , Cheol-Ho Choi
IPC分类号： H01J29/07 , H01J29/81
CPC分类号： H01J29/073 , H01J2229/0716
摘要： A rail of a flat type cathode ray tube is disclosed, wherein the flat type cathode ray tube comprises a panel having a deposited fluorescent surface therein and of which interior and exterior surfaces are substantially flat, a funnel connected to the panel; a shadow mask arranged with the inner surface of the panel with a predetermined gap, and a rail fixed to the panel and combined with the shadow mask. In the flat type cathode ray tube, if a height of the rail is L, the rail maintains a predetermined gap of 0.1L˜0.3L with the panel and is fixed by a frit glass.

4. 发明申请

US20100291488A1 Manufacturing method for multilayer core board 审中-公开
标题翻译：多层芯板的制造方法
公开(公告)号：US20100291488A1
公开(公告)日：2010-11-18
申请号：US12805371
申请日：2010-07-27
申请人： Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
发明人： Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
IPC分类号： H05K13/00 , B05D5/12 , G03F7/20
CPC分类号： H05K3/108 , H05K3/181 , H05K3/4661 , H05K2201/0344 , Y10T29/49124 , Y10T428/31678
摘要： A method for manufacturing a cone board including: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; and forming a first nickel layer on at least one surface of the core insulation layer by electroless plating
摘要翻译：一种锥形板的制造方法，包括：制备包含一种或多种选自环氧树脂和双马来酰亚胺三嗪树脂的树脂的芯绝缘层; 以及通过无电镀在所述芯绝缘层的至少一个表面上形成第一镍层

5. 发明申请

US20100052152A1 Semiconductor package transformer 失效
标题翻译：半导体封装变压器
公开(公告)号：US20100052152A1
公开(公告)日：2010-03-04
申请号：US12461869
申请日：2009-08-26
申请人： Cheol Ho Choi
发明人： Cheol Ho Choi
IPC分类号： H01L23/482 , H01L23/538
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
摘要翻译：本发明涉及一种半导体封装变压器。提供了一种半导体封装变压器，其包括：在其前表面上形成插入有安装在基板上的芯片的半导体封装的开口的窗口，并且在其上表面上形成露出部分; 以及形成在壳体的底面上的多个孔。

6. 发明授权

US06797781B2 Blends of fluoropolymer and plasticized polyvinyl chloride 有权
标题翻译：含氟聚合物和增塑聚氯乙烯的共混物
公开(公告)号：US06797781B2
公开(公告)日：2004-09-28
申请号：US10133525
申请日：2002-04-26
申请人： Biing-Lin Lee , James L. White , Cheol-Ho Choi , Maryellen Cobb , Raman Patel
发明人： Biing-Lin Lee , James L. White , Cheol-Ho Choi , Maryellen Cobb , Raman Patel
IPC分类号： C08L2706
CPC分类号： C08L23/0846 , C08L23/04 , C08L23/0815 , C08L27/06 , C08L27/12 , C08L51/003 , C08L51/06 , C08L2205/02 , C08L2205/03 , C08L2666/06 , C08L2666/02
摘要： A melt-mixed blend of plasticized PVC, fluoropolymers, and a compatibilizer having acrylate functionality exhibits good mechanical and dielectric properties and is useful for wiring and cable applications.
摘要翻译：具有丙烯酸酯官能团的增塑PVC，含氟聚合物和增容剂的熔融混合共混物具有良好的机械和介电性能，并且可用于布线和电缆应用。

7. 发明授权

US09107329B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US09107329B2
公开(公告)日：2015-08-11
申请号：US13232220
申请日：2011-09-14
申请人： Chang Bo Lee , Dae Jo Hong , Cheol Ho Choi
发明人： Chang Bo Lee , Dae Jo Hong , Cheol Ho Choi
IPC分类号： H05K3/00 , H05K3/24 , H05K3/34 , H01L23/00
CPC分类号： H05K3/243 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/131 , H01L2224/16225 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/12042 , H05K3/3452 , H05K2203/1383 , Y10T29/49147 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.
摘要翻译：这里公开了一种印刷电路板的制造方法。制造印刷电路板的方法包括：制备具有第一连接焊盘和第二连接焊盘的基底基板; 在所述基底基板上形成阻焊层，所述阻焊层具有用于暴露所述第一连接焊盘的第一开口; 在所述第一连接焊盘上形成第一表面处理层; 在阻焊层上形成保护膜; 形成用于暴露所述保护膜和阻焊层中的第二连接焊盘的第二开口; 以及在所述第二连接焊盘上形成第二表面处理层。

8. 发明授权

US08865393B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08865393B2
公开(公告)日：2014-10-21
申请号：US13213939
申请日：2011-08-19
申请人： Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
发明人： Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
IPC分类号： G03F7/20 , H05K3/30 , H01L21/48 , H01L23/498 , H01L21/56 , H05K3/28 , H05K3/34 , H01L23/00
CPC分类号： H05K3/305 , H01L21/4853 , H01L21/563 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H05K3/28 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49124 , H01L2924/00 , H01L2924/014
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.
摘要翻译：这里公开了一种印刷电路板及其制造方法，包括：在基底基板上形成覆盖膜层叠的保护层; 使覆盖膜层叠的保护层曝光，对保护层进行光敏化，使遮盖膜光降解; 以及显影光降解的覆盖膜和光敏保护层，以形成在保护层上露出作为基底基板的最外层的电路层的焊盘单元的开口，由此可以提高印刷电路板的生产率，而不执行分离覆盖膜的过程。

9. 发明申请

US20130175238A1 ETCHING SOLUTION AND METHOD OF MANUFACTURING PRINTED WIRING SUBSTRATE USING THE SAME 审中-公开
标题翻译：蚀刻方法和使用其制造印刷的布线基板的方法
公开(公告)号：US20130175238A1
公开(公告)日：2013-07-11
申请号：US13474335
申请日：2012-05-17
申请人： Dae Jo HONG , Chang Bo LEE , Cheol Ho CHOI , Chang Sup RYU , Sung Pyo HONG , Jong Hoon JEON , Akira HOSOMI , Hiroshi TAKAMIYA
发明人： Dae Jo HONG , Chang Bo LEE , Cheol Ho CHOI , Chang Sup RYU , Sung Pyo HONG , Jong Hoon JEON , Akira HOSOMI , Hiroshi TAKAMIYA
IPC分类号： C09K13/06 , H05K3/00
CPC分类号： C09K13/06 , H05K3/067 , H05K3/383
摘要： This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.
摘要翻译：本发明涉及包括过氧化氢，硫酸，氯离子，苯并三唑和吡唑的蚀刻溶液，以及印刷线路基板的金属布线的表面用碱溶液处理的印刷布线基板的制造方法，使用蚀刻溶液进行粗糙化，然后进行防锈处理，从而即使用小的蚀刻量的金属（Cu）也形成多孔表面凹凸和微锚，从而获得金属和绝缘材料之间的高粘合力。

10. 发明申请

US20130026626A1 METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS 审中-公开
标题翻译：用于形成包括炸药的炸药和底物的方法
公开(公告)号：US20130026626A1
公开(公告)日：2013-01-31
申请号：US13487926
申请日：2012-06-04
申请人： Cheol Ho CHOI , Chang Bo LEE , Chang Sup RYU
发明人： Cheol Ho CHOI , Chang Bo LEE , Chang Sup RYU
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/568 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/11474 , H01L2224/1148 , H01L2224/11849 , H01L2224/13017 , H01L2224/13022 , H01L2224/131 , H01L2924/01322 , H01L2924/12042 , H01L2924/381 , H05K2203/041 , H05K2203/043 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： Disclosed herein are a method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process.The present invention can decrease the number of processes and realize a fine bump pitch of 90 μm or less at the time of forming bumps. Further, the present invention can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.
摘要翻译：本文公开了一种用于形成凸块的方法和包括该凸块的基板。该方法包括：在基板上形成阻焊剂和在基板上形成的电极：对阻焊剂进行激光蚀刻处理，形成用于形成凸块的开口; 在用于形成凸块的开口中印刷用于形成凸块的组合物; 并进行回流处理。本发明可以减少处理次数，并且在形成凸块时实现90μm以下的微小凸点间距。此外，由于处理次数的减少，本发明还可以减少对准的次数。

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