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1. 发明专利

JP2002271028A COIL-INCORPORATED MULTI-LAYER SUBSTRATE AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR LAMINATED COIL 失效
公开(公告)号：JP2002271028A
公开(公告)日：2002-09-20
申请号：JP2001069607
申请日：2001-03-13
申请人： DENSO CORP , MITSUBISHI PLASTICS IND
发明人： NOMOTO KAORU , NAKAZAWA SHUSAKU , KONDO KOJI , NIDAN AKIRA , YAMADA SHINGETSU , TANIGUCHI KOICHIRO
IPC分类号： H05K1/16 , H01F41/04 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To efficiently manufacture a coil-incorporated multi-layered resin board which has a relatively large-sized coil. SOLUTION: A coil-incorporated multi-layered resin 29 is formed by laminating insulating resin layers 36 alternately with coil patterns 37 and uniting them together by heating and pressing them, and the coil patterns 37 of respective layers are electrically connected by a via hole conductor 38 formed penetrating the respective insulating resin layers 36. Each insulating resin layer 36 is formed of mixed resin of 65 to 35 wt.% polyaryl ketone resin of >=260 deg.C in crystal fusion peak temperature and 35 to 65 wt.% polyether imide as a crystallized delay polymer. The coil patterns 37 are formed by a subtractive method. The via hole conductor 38 is formed by charging conductor paste in the via hole 39 formed in the insulating resin layers 36 by screen printing.

2. 发明专利

DE10131697A1 Pressure sensor has conductive elevations that are arranged in between opposing surfaces of shaft and sensor chip, thereby connecting sensor chip to guides 未知
公开(公告)号：DE10131697A1
公开(公告)日：2002-01-10
申请号：DE10131697
申请日：2001-06-29
申请人： DENSO CORP
发明人： NIDAN AKIRA , TAKI TAKAFUMI , HARA HIDEAKI , MASUDA MICHIHIRO , BAN KANAME , TANAKA KAZUO , MURAKAMI YOSHIFUMI
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
摘要： Guides (2) extend away from the surface (1a) of a shaft (1). Conductive elevations (8) are formed on the surface (4a) of a sensor chip (4) having a diaphragm (5) that generates an electrical signal corresponding to a physical value. The surfaces (1a,4a) are opposite each other, with the elevations arranged in between such that the sensor chip is connected to the guides through the elevations.

3. 发明专利

JPH10142087A METHOD FOR ADJUSTING OUTPUT CHARACTERISTIC OF SEMICONDUCFOR PRESSURE SENSOR 失效
公开(公告)号：JPH10142087A
公开(公告)日：1998-05-29
申请号：JP30064396
申请日：1996-11-12
申请人： DENSO CORP
发明人： KAMIYA TETSUAKI , NIDAN AKIRA
IPC分类号： G01L9/04 , G01L9/00 , G01L27/00
摘要： PROBLEM TO BE SOLVED: To obtain an output characteristic adjustment method that is capable of effecting laser trimming easily. SOLUTION: A sensor chip 6 has a diaphragm 9 and a resistor 11 for adjusting output characteristics and is joined onto a glass pedestal 7, and an external application pressure for a reference pressure room 13 that is formed between the sensor chip 6 and the glass pedestal 7 is detected by a piezo resistance layer 10 that is provided at the diaphragm 9. In a chamber where an internal pressure can be adjusted, a characteristic value is measured under two types of pressures that differ from atmospheric pressure and a resistor for adjusting output characteristics is trimmed while a characteristic value is measured based on the characteristic value under atmospheric pressure.

4. 发明专利

JP2002082009A PRESSURE SENSOR 失效
公开(公告)号：JP2002082009A
公开(公告)日：2002-03-22
申请号：JP2001010682
申请日：2001-01-18
申请人： DENSO CORP
发明人： TAKI TAKAFUMI , NIDAN AKIRA , HARA HIDEAKI , MASUDA MICHIHIRO , BAN KANAME , TANAKA KAZUO , MURAKAMI YOSHIFUMI
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide an adequately miniaturizable structure in a pressure sensor in which a stem having a lead for taking a signal on one surface side and a sensor chip having a diaphragm for detecting pressure on one surface side are provided, and the sensor chip is mounted on one side of the stem with the sensor chip electrically connected to the lead. SOLUTION: A conductive bump 8 is formed on one surface 4a of the sensor chip 4, and the bump 8 is electrically connected to the lead 2 by thermo compression bonding or the like while the surface 4a of the sensor chip 4 is faced to one surface 1a of the stem 1.

5. 发明专利

JP2008021902A Semiconductor device, and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008021902A
公开(公告)日：2008-01-31
申请号：JP2006193866
申请日：2006-07-14
申请人： Denso Corp , 株式会社デンソー
发明人： NINOMIYA YASUTOKU , TOTOKAWA SHINJI , NIDAN AKIRA , SAKAI MINEICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/0401 , H01L2224/06102 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To electrically bond a semiconductor chip over regions where heights in whole surfaces are different even if there are any height variations in the whole surfaces of a package, in a semiconductor device constituted by electrically bonding both electrodes of the semiconductor chip and a ceramic package in the state where sides having each electrode of the semiconductor chip and the ceramic package are made to be faced.
SOLUTION: Between a chip electrode 12 and a package electrode 22, there intervenes conductive adhesive 30 as a conductive bonding member which can be deformed at the time of loading a semiconductor chip 10 on a package 20. While the both electrodes 12, 22 are electrically connected by this conductive adhesive 30, heights variations T existing in whole surfaces 21 of the package 20 are absorbed by deforming the conductive adhesive 30.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在包装的整个表面上存在任何高度变化的情况下，在半导体芯片的整个表面的高度不同的区域上电连接半导体芯片，在通过电连接两个电极半导体芯片和具有半导体芯片和陶瓷封装的每个电极的侧面的状态的陶瓷封装。解决方案：在芯片电极12和封装电极22之间，插入作为导电接合部件的导电粘合剂30，在将半导体芯片10装载在封装20上时可以变形。尽管两个电极12， 22通过该导电粘合剂30电连接，存在于包装20的整个表面21中的高度变化T被导电粘合剂30变形所吸收。（C）2008，JPO＆INPIT

6. 发明专利

JP2008201085A Manufacturing method of product 有权
标题翻译：产品制造方法
公开(公告)号：JP2008201085A
公开(公告)日：2008-09-04
申请号：JP2007042199
申请日：2007-02-22
申请人： Denso Corp , 株式会社デンソー
发明人： ONO TOSHIHIDE , NIDAN AKIRA , NOMURA EIJI , HIRASE KIYOSHI
IPC分类号： B29C45/17 , B29C45/38
摘要： PROBLEM TO BE SOLVED: To realize a palletless transportation in a manufacturing process of a rotary detecting sensor.
SOLUTION: In an injection molding process (S100), a support having plate parts 70, 71 and extension sections 74a, 74b is provided to a work 200, and the work 200 itself is transferred to a position of each processing process (S130-S160) by a carrier device 300 in a self-independent state. Accordingly, when the work 200 is transferred to the position of each processing process by the carrier device 300, it is not necessary to use any pallet.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在旋转检测传感器的制造过程中实现无托盘运输。解决方案：在注射成型工艺（S100）中，将具有板部件70,71和延伸部分74a，74b的支撑件提供到工件200，并且工件200本身被转移到每个加工过程的位置 S130-S160）由自身独立状态的载体装置300。因此，当通过承载装置300将工件200转移到每个处理过程的位置时，不需要使用任何托盘。版权所有（C）2008，JPO＆INPIT

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