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1. 发明授权

US07509053B2 Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules 失效
标题翻译：阻抗匹配电路，同时屏蔽收发模块的寄生效应
公开(公告)号：US07509053B2
公开(公告)日：2009-03-24
申请号：US11875332
申请日：2007-10-19
申请人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
发明人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
IPC分类号： H04B10/02
CPC分类号： H04B10/43 , H01L2224/48091 , H01L2924/19104 , H01P5/02 , H01L2924/00014
摘要： A method for fabricating a transceiver, which simultaneously provides impedance matched transmission for radio frequency (RF) and shields against transmission losses due to parasitic effects includes identifying parasitic electromagnetic elements associated with an RF choke for a given placement on a substrate. RF lines are placed and dimensioned on the bench to form impedance matched RF lines wherein a portion of the RF lines shield the RF choke for a given bandwidth such that impedance matching and control of parasitic effects of the RF choke are simultaneously provided wherein an intermediate capacitance formed between the RF choke and the shield is sized to balance against the parasitic effects to provide a desired transmission response over a selected frequency range.
摘要翻译：一种用于制造收发器的方法，其同时为射频（RF）提供阻抗匹配传输，并且防止由于寄生效应引起的传输损耗，包括识别与用于衬底上的给定放置的RF扼流圈相关联的寄生电磁元件。 RF线被放置并在尺寸上放置在台架上以形成阻抗匹配RF线，其中RF线的一部分屏蔽RF扼流圈以达到给定带宽，使得同时提供RF扼流圈的寄生效应的阻抗匹配和控制，其中中间电容形成在RF扼流器和屏蔽之间的尺寸被设计成与寄生效应平衡以在选定的频率范围内提供期望的传输响应。

2. 发明授权

US07720386B2 Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules 失效
标题翻译：阻抗匹配电路，同时屏蔽收发模块的寄生效应
公开(公告)号：US07720386B2
公开(公告)日：2010-05-18
申请号：US12144044
申请日：2008-06-23
申请人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
发明人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
IPC分类号： H04B10/02
CPC分类号： H04B10/43 , H01L2224/48091 , H01L2924/19104 , H01P5/02 , H01L2924/00014
摘要： An RF device includes a signal layer disposed over a ground plane having radio frequency (RF) transmission lines configured and dimensioned to provide impedance matching along the RF lines. A shield is formed as a part of the RF lines and disposed below the RF choke of a DC current supply to form an intermediate capacitance between the choke and the shield to control parasitic effects.
摘要翻译： RF设备包括设置在具有射频（RF）传输线的接地平面上的信号层，射频（RF）传输线被配置和设计尺寸以提供沿着RF线的阻抗匹配。屏蔽形成为RF线的一部分并且设置在DC电流源的RF扼流圈下方，以在扼流圈和屏蔽之间形成中间电容，以控制寄生效应。

3. 发明申请

US20090034980A1 IMPEDANCE MATCHING CIRCUIT WITH SIMULTANEOUS SHIELDING OF PARASITIC EFFECTS FOR TRANSCEIVER MODULES 失效
标题翻译：阻抗匹配电路同时屏蔽接收模块的PARASITIC效应
公开(公告)号：US20090034980A1
公开(公告)日：2009-02-05
申请号：US12144044
申请日：2008-06-23
申请人： DANIEL M. KUCHTA , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
发明人： DANIEL M. KUCHTA , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
IPC分类号： H04B10/02
CPC分类号： H04B10/43 , H01L2224/48091 , H01L2924/19104 , H01P5/02 , H01L2924/00014
摘要： An RF device includes a signal layer disposed over a ground plane having radio frequency (RF) transmission lines configured and dimensioned to provide impedance matching along the RF lines. A shield is formed as a part of the RF lines and disposed below the RF choke of a DC current supply to form an intermediate capacitance between the choke and the shield to control parasitic effects.
摘要翻译： RF设备包括设置在具有射频（RF）传输线的接地平面上的信号层，射频（RF）传输线被配置和设计尺寸以提供沿着RF线的阻抗匹配。屏蔽形成为RF线的一部分并且设置在DC电流源的RF扼流圈下方，以在扼流圈和屏蔽之间形成中间电容，以控制寄生效应。

4. 发明授权

US07412172B2 Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules 失效
标题翻译：阻抗匹配电路，同时屏蔽收发模块的寄生效应
公开(公告)号：US07412172B2
公开(公告)日：2008-08-12
申请号：US10727817
申请日：2003-12-04
申请人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
发明人： Daniel M. Kuchta , Mark B. Ritter , Albert E. Ruehli , Christian Schuster
IPC分类号： H04B10/02
CPC分类号： H04B10/43 , H01L2224/48091 , H01L2924/19104 , H01P5/02 , H01L2924/00014
摘要： An RF device includes a signal layer disposed over a ground plane having radio frequency (RF) transmission lines configured and dimensioned to provide impedance matching along the RF lines. A shield is formed as a part of the RF lines and disposed below the RF choke of a DC current supply to form an intermediate capacitance between the choke and the shield to control parasitic effects.
摘要翻译： RF设备包括设置在具有射频（RF）传输线的接地平面上的信号层，射频（RF）传输线被配置和设计尺寸以提供沿着RF线的阻抗匹配。屏蔽形成为RF线的一部分并且设置在DC电流源的RF扼流圈下方，以在扼流圈和屏蔽之间形成中间电容，以控制寄生效应。

5. 发明授权

US08832011B2 Electronic synapses from stochastic binary memory devices 有权
公开(公告)号：US08832011B2
公开(公告)日：2014-09-09
申请号：US13611722
申请日：2012-09-12
申请人： Bipin Rajendran , Mark B. Ritter
发明人： Bipin Rajendran , Mark B. Ritter
IPC分类号： G06N3/04 , G06N3/00 , G06N3/063
CPC分类号： G06N3/0635 , G06N3/04 , G06N3/049
摘要： According to a technique, an electronic device is configured to correspond to characteristic features of a biological synapse. The electronic device includes multiple bipolar resistors arranged in parallel to form an electronic synapse, an axonal connection connected to one end of the electronic synapse and to a first electronic neuron, and a dendritic connection connected to another end of the electronic synapse and to a second electronic neuron. An increase and decrease of synaptic conduction in the electronic synapse is based on a probability of switching the plurality of bipolar resistors between a low resistance state and a high resistance state.

6. 发明授权

US08429107B2 System for address-event-representation network simulation 有权
标题翻译：地址事件表示网络仿真系统
公开(公告)号：US08429107B2
公开(公告)日：2013-04-23
申请号：US12611968
申请日：2009-11-04
申请人： Monty M. Denneau , Daniel J. Friedman , Ralph Linsker , Mark B. Ritter
发明人： Monty M. Denneau , Daniel J. Friedman , Ralph Linsker , Mark B. Ritter
IPC分类号： G06F15/18 , G06N3/08
CPC分类号： H04L47/521
摘要： A system, method, and design structure for address-event-representation network simulation are provided. The system includes a hardware structure with a plurality of interconnected processing modules configured to simulate a plurality of interconnected nodes. To simulate each node, the hardware structure includes a source table configured to receive an input message and identify a weight associated with a source of the input message. The hardware structure also includes state management logic configured to update a node state as a function of the identified weight, and generate an output signal responsive to the updated node state. The hardware structure further includes a target table configured to generate an output message in response to the output signal, identify a target to receive the output message, and transmit the output message. The hardware structure may further include learning logic configured to combine information about input messages and generated output signals, and to update weights.
摘要翻译：提供了一种用于地址事件表示网络仿真的系统，方法和设计结构。该系统包括硬件结构，其具有被配置为模拟多个互连节点的多个互连的处理模块。为了模拟每个节点，硬件结构包括被配置为接收输入消息并且识别与输入消息的源相关联的权重的源表。硬件结构还包括状态管理逻辑，其被配置为根据所识别的权重更新节点状态，并响应于更新的节点状态生成输出信号。硬件结构进一步包括目标表，其被配置为响应于输出信号产生输出消息，识别目标以接收输出消息，并发送输出消息。硬件结构还可以包括被配置为组合关于输入消息和生成的输出信号的信息并且更新权重的学习逻辑。

7. 发明授权

US08053819B2 Three-dimensional cascaded power distribution in a semiconductor device 有权
标题翻译：半导体器件中的三维级联功率分布
公开(公告)号：US08053819B2
公开(公告)日：2011-11-08
申请号：US12120899
申请日：2008-05-15
申请人： Kerry Bernstein , Paul W. Coteus , Philip George Emma , Allan Mark Hartstein , Stephen V. Kosonocky , Ruchir Puri , Mark B. Ritter
发明人： Kerry Bernstein , Paul W. Coteus , Philip George Emma , Allan Mark Hartstein , Stephen V. Kosonocky , Ruchir Puri , Mark B. Ritter
IPC分类号： H01L29/80
CPC分类号： G11C5/063 , G11C5/14 , H01L21/8221 , H01L27/0688 , H03H1/0007
摘要： An IC structure having reduced power loss and/or noise includes two or more active semiconductor regions stacked in a substantially vertical dimension, each active semiconductor region including an active layer. The IC structure further includes two or more voltage supply planes, each of the voltage supply planes corresponding to a respective one of the active layers.
摘要翻译：具有降低的功率损耗和/或噪声的IC结构包括以基本上垂直的尺寸堆叠的两个或更多个有源半导体区域，每个有源半导体区域包括有源层。 IC结构还包括两个或更多个电压供应平面，每个电压供应平面对应于相应的一个有源层。

8. 发明授权

US5495545A Method for extending bandwidth of large core fiber optic transmission links 失效
标题翻译：扩展大型核心光纤传输链路带宽的方法
公开(公告)号：US5495545A
公开(公告)日：1996-02-27
申请号：US328177
申请日：1994-10-24
申请人： Michael F. Cina , Dennis L. Karst , Modest M. Oprysko , Mark B. Ritter , Stephen L. Spanoudis , Jeannine M. Trewhella
发明人： Michael F. Cina , Dennis L. Karst , Modest M. Oprysko , Mark B. Ritter , Stephen L. Spanoudis , Jeannine M. Trewhella
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4206
摘要： A method for making an optical fiber transmission apparatus for limiting the optical modes which were emitted from a source in such a way to impinge on an optical fiber to extract a high bandwidth from the fiber. The apparatus includes a lens or aperture to control the angle and distribution of light launched into the fiber. The apparatus achieves reproducibly high bandwidths in large core step-index optical fibers of short transmission length distances. The lens or aperture introduces light from the source into the fiber at an angle at which substantially no intermode delay occurs as the light propagates down the fiber. An integral fiber optic coupling assembly that includes an optical electronic component receptacle, the lens and/or aperture, and an optical fiber connector interface which provides low cost easy to manufacture assembly is also disclosed. A unitary plastic housing provides the function of a lens and mechanical reference or locating features for the light source and optical fiber.
摘要翻译：一种制造光纤传输装置的方法，用于限制从源发射的光模，以照射到光纤上以从光纤提取高带宽。该装置包括用于控制发射到光纤中的光的角度和分布的透镜或孔。该装置在具有短传输长度距离的大型核心阶跃折射率光纤中实现可重复的高带宽。透镜或光圈将光从光源引入光纤，其角度基本上不发生模式间延迟，因为光沿着光纤传播。还公开了一种包括光学电子部件插座，透镜和/或孔径以及提供低成本易于制造组装的光纤连接器接口的整体光纤耦合组件。单一的塑料外壳提供了一个透镜的功能，并为光源和光纤提供机械参考或定位功能。

9. 发明授权

US5263620A Wirebond removal apparatus using alternating fluid stream 失效
标题翻译：使用交替流体流的导线粘合去除装置
公开(公告)号：US5263620A
公开(公告)日：1993-11-23
申请号：US843693
申请日：1992-02-28
申请人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
发明人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01L21/60 , B08B3/02 , B23K1/018 , B26F3/00 , H05K13/04
CPC分类号： H05K13/0486 , B23K1/018 , H01L24/98 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , Y10T225/10 , Y10T225/30 , Y10T225/329 , Y10T29/49821 , Y10T29/53274
摘要： A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

10. 发明授权

US5186632A Electronic device elastomeric mounting and interconnection technology 失效
标题翻译：电子器件弹性体安装和互连技术
公开(公告)号：US5186632A
公开(公告)日：1993-02-16
申请号：US762977
申请日：1991-09-20
申请人： Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
发明人： Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01R24/00 , H01R12/62 , H01R12/72 , H05K3/36 , H05K7/02
CPC分类号： H01R12/62 , H01R12/721 , H05K3/365 , H05K7/023
摘要： An interconnecting and mounting technology involving the use of elastomeric properties. A mounting member grips, in a notch, the edge of a device supporting planar member with the device conductors brought to that edge. Conductors are provided at the surface of the mounting member, contacting the device conductors in the notch, and connecting with external wiring conductors on an external wiring planar member. The external wiring to device conductor interconnecting conductors can be on flex tape including elastomeric contact adaptation. Retention force for mounting member compression and mounting member to external wiring planar member retention is provided.

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