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    • 7. 发明授权
    • Super high frequency oscillator/resonator
    • 超高频振荡器/谐振器
    • US5023503A
    • 1991-06-11
    • US460454
    • 1990-01-03
    • Ronald LeggeCurtis D. Moyer
    • Ronald LeggeCurtis D. Moyer
    • H03B5/30H03H3/007H03H9/05H03H9/17H03H9/24H03H9/25H04R17/10
    • H03H9/17
    • A method of filtering an AC signal using a piezoelectric beam is provided. A piezoelectric film is formed on a mechanical support and a portion of the piezoelectric film forms a beam which extends beyond the mechanical support so that a cavity is formed underneath the beam, and the beam is free to vibrate in the cavity at a resonant frequency when an acoustic wave is propagated in the piezoelectric layer.A depletion region is formed under a Schottky contact which serves as a drive electrode. An unfiltered AC signal is coupled to the drive electrode thereby establishing an acoustic wave when the unfiltered AC signal comprises a component at the resonant frequency. Surface charge on the piezoelectric film resulting from vibration of the beam allows the resonant frequency component of the unfiltered AC signal to pass through the depletion region. Alternatively, the resonant frequency component can be passed by a tunnel current through the cavity.
    • 提供了使用压电束对AC信号进行滤波的方法。 在机械支架上形成压电薄膜,并且压电薄膜的一部分形成一个延伸超过机械支架的光束,从而在光束的下方形成空腔,并且光束以谐振频率自由地在空腔中振动, 声波在压电层中传播。 在用作驱动电极的肖特基接触下形成耗尽区。 未过滤的AC信号耦合到驱动电极,从而当未滤波的AC信号包括谐振频率处的分量时建立声波。 由光束的振动导致的压电膜上的表面电荷允许未滤波的AC信号的谐振频率分量通过耗尽区。 或者,谐振频率分量可以通过隧道电流通过空腔。
    • 8. 发明授权
    • Si-GaP-Si heterojunction bipolar transistor (HBT) on Si substrate
    • Si-GaP-Si异质结双极晶体管(HBT)
    • US4959702A
    • 1990-09-25
    • US417417
    • 1989-10-05
    • Curtis D. MoyerRaymond K. Tsui
    • Curtis D. MoyerRaymond K. Tsui
    • H01L29/737
    • H01L29/7378
    • A heterojunction bipolar transistor (HBT) is provided having a silicon substrate in which a conventional junction base is formed. A coherently strained layer of semiconductor material having a wider band gap than silicon, such as gallium phosphide, is formed over the base to form a first portion of an emitter multilayer. A second portion of the emitter multilayer comprises silicon which can be epitaxially grown on the coherently strained layer. A thin heteropotential barrier is thus formed at the base-emitter junction which preferentially allows electrons to move from emitter to base while significantly reducing hole current from base to emitter, thereby improving emitter injection efficiency and current gain.
    • 提供了具有其中形成常规接合基底的硅衬底的异质结双极晶体管(HBT)。 在基底上形成具有比硅更宽带隙的诸如磷化镓的相干应变层的半导体材料以形成发射极多层的第一部分。 发射极多层的第二部分包括可在相干应变层上外延生长的硅。 因此,在基极 - 发射极结处形成薄的势能势垒,其优先地允许电子从发射极移动到基极,同时显着减少从基极到发射极的空穴电流,从而提高发射极注入效率和电流增益。
    • 10. 发明授权
    • Field emission device having stamped substrate and method
    • 具有冲压基板和方法的场致发射器件
    • US6114802A
    • 2000-09-05
    • US808382
    • 1997-02-28
    • Craig AmrineKenneth DeanCurtis D. Moyer
    • Craig AmrineKenneth DeanCurtis D. Moyer
    • H01J3/02H01J29/02H01J19/24H01J29/04
    • H01J3/022H01J29/028H01J2201/30423H01J2329/8615
    • A field emission device (400) includes a plastically-deformable, ceramic, stamped substrate (200) made from a plastically deformable ceramic, which in the preferred embodiment includes a calendered tape. The plastically-deformable, ceramic, stamped substrate (200) includes first and second opposed surfaces (202, 204) and defines apertures (206) in which are formed extraction electrodes (410). The field emission device (400) further includes an electron-emissive layer (418) being formed on the first opposed surface (202). Cathodes (420) are disposed on the electron-emissive layer (418) and cross the extraction electrodes (410) at an angle of 90.degree.. A method for fabricating said field emission device (400) includes stamping a layer (100) of the softened calendered tape with a die (300) to define the apertures (206) and grooves (208, 212, 214).
    • 场致发射器件(400)包括由可塑性变形的陶瓷制成的可塑性变形的陶瓷冲压衬底(200),在优选实施例中,其包括压延带。 塑性可变形的陶瓷冲压衬底(200)包括第一和第二相对表面(202,204)并且限定孔(206),其中形成有引出电极(410)。 场发射器件(400)还包括形成在第一相对表面(202)上的电子发射层(418)。 阴极(420)设置在电子发射层(418)上,并以90°的角度与提取电极(410)交叉。 制造所述场发射装置(400)的方法包括用模具(300)冲压软化的压延带的层(100)以限定孔(206)和凹槽(208,212,214)。