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    • 2. 发明授权
    • Resistless methods of fabricating FETs
    • 无阻抗制造FET的方法
    • US5759880A
    • 1998-06-02
    • US775908
    • 1997-01-02
    • Kumar ShiralagiRaymond K. Tsui
    • Kumar ShiralagiRaymond K. Tsui
    • H01L21/033H01L21/335H01L21/338
    • H01L29/66462H01L21/0335
    • A method of fabricating semiconductor devices including forming a plurality of layers of semiconductor material on the surface of a substrate, forming a mask without using a resist on the layers which can be disassociated in-situ, removing an unmasked portion of the layers to form a semiconductor device with a gate region and opposed exposed source and drain surfaces, selectively growing source and drain contact regions on the exposed source and drain surfaces respectively, the contact regions defining opposed sidewalls adjacent the gate region, disassociating the mask, forming sidewall spacers on the sidewalls, forming a metal contact on the source, drain and gate regions with the spacers preventing intercontact therebetween, and depositing a passivating layer over the semiconductor device, with all of the previous steps being performed in-situ in a modular equipment cluster.
    • 一种制造半导体器件的方法,包括在衬底的表面上形成多个半导体材料层,形成掩模,而不在可以原位解离的层上使用抗蚀剂,除去层的未掩模部分以形成 具有栅极区域和相对的暴露的源极和漏极表面的半导体器件,分别在暴露的源极和漏极表面上选择性地增长源极和漏极接触区域,接触区域限定与栅极区域相邻的相对侧壁,使掩模分离,在其上形成侧壁间隔物 侧壁,在源极,漏极和栅极区域上形成金属接触,其中间隔物防止它们之间的相互接触,并且在半导体器件上沉积钝化层,其中所有先前的步骤在模块化设备集群中原位执行。