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    • 10. 发明申请
    • Integral molded heat sinks on DC-DC converters and power supplies
    • DC-DC转换器和电源的集成模制散热器
    • US20060164811A1
    • 2006-07-27
    • US11044870
    • 2005-01-26
    • John MaxwellWilliam Yeates
    • John MaxwellWilliam Yeates
    • H05K7/20
    • H05K1/0203H05K1/0204H05K3/284H05K3/285H05K7/209H05K2201/0141H05K2201/066H05K2203/1316
    • A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.
    • 电源模块具有包含用于将输入电压转换为输出电压的多个电气部件的印刷电路板(PCB)。 在PCB的基本上整个表面区域上形成散热器以提供散热。 散热器由注塑在PCB表面上的导热和电绝缘的聚合物化合物(例如液晶聚合物或聚苯硫醚)制成。 散热器可以形成在PCB的前侧和后侧,并且可以具有用于增加散热片的散热表面积的多个支柱。 通过将散热器布置在PCB的整个表面上,散热器能够消除更多的热量,并允许电源模块在给定相同的物理尺寸和环境条件下提供更多的输出负载电流。