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    • 3. 发明授权
    • Method of encapsulating an organic light-emitting device
    • 封装有机发光装置的方法
    • US07621794B2
    • 2009-11-24
    • US11271410
    • 2005-11-09
    • Chung J. LeeAtul KumarChieh Chen
    • Chung J. LeeAtul KumarChieh Chen
    • H05B33/10H01L51/56G02F1/335C03B27/00
    • H01L51/5256Y10T428/1082Y10T428/2852
    • A method of encapsulating an organic light-emitting device is disclosed, wherein the device includes a light-emitting portion and an electrical contact portion, the method including forming a polymer layer over the light-emitting portion and the electrical contact portion of the device; forming a separation in the polymer layer between a portion of the polymer layer disposed over the light-emitting portion of the device and a portion of the polymer layer disposed over the electrical contact portion of the device; adhering a film removal structure to the portion of the polymer layer disposed over the electrical contact portion of the device; and removing the film removal structure, thereby causing the removal of the portion of the polymer layer disposed over the electrical contact portion of the device.
    • 公开了一种封装有机发光器件的方法,其中该器件包括发光部分和电接触部分,该方法包括在器件的发光部分和电接触部分上形成聚合物层; 在所述聚合物层的设置在所述器件的发光部分之上的部分和设置在所述器件的电接触部分之上的聚合物层的一部分之间的聚合物层中形成分离; 将膜去除结构粘附到设置在所述器件的电接触部分上方的聚合物层的部分; 并去除膜去除结构,从而导致去除设置在器件的电接触部分上的聚合物层的部分。