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1. 发明授权

US08937326B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08937326B2
公开(公告)日：2015-01-20
申请号：US13033702
申请日：2011-02-24
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62 , H01L27/15 , F21K99/00 , H01L33/48 , H01L33/64
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

2. 发明授权

US08445933B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08445933B2
公开(公告)日：2013-05-21
申请号：US12782287
申请日：2010-05-18
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

3. 发明授权

US08076680B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08076680B2
公开(公告)日：2011-12-13
申请号：US11908112
申请日：2005-10-26
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

4. 发明申请

US20100224904A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20100224904A1
公开(公告)日：2010-09-09
申请号：US12782287
申请日：2010-05-18
申请人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62 , H01L33/64 , H01L33/52
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

5. 发明申请

US20090267085A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20090267085A1
公开(公告)日：2009-10-29
申请号：US11908112
申请日：2005-10-26
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

6. 发明授权

US08368190B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08368190B2
公开(公告)日：2013-02-05
申请号：US13074740
申请日：2011-03-29
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L23/495
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

7. 发明授权

US08159000B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08159000B2
公开(公告)日：2012-04-17
申请号：US13159846
申请日：2011-06-14
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

8. 发明授权

US09447957B2 LED lamp 有权
标题翻译：点灯
公开(公告)号：US09447957B2
公开(公告)日：2016-09-20
申请号：US14129795
申请日：2012-06-20
申请人： Hyuck Jung Choi , Kyung Hee Ye
发明人： Hyuck Jung Choi , Kyung Hee Ye
IPC分类号： F21V1/00 , F21V29/00 , F21K99/00 , F21V29/74 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/232 , F21V29/004 , F21V29/74 , F21Y2101/00 , F21Y2115/10 , Y02B20/30
摘要： The present invention relates to an LED lamp. In the LED lamp, light may be emitted in lateral and rear directions as well as in a front direction to obtain light distribution characteristics similar to those of an incandescent lamp, and heat generated when the LED emits light may be effectively dissipated.
摘要翻译：本发明涉及一种LED灯。在LED灯中，可以在横向和后方以及正面方向上发射光，以获得与白炽灯类似的分布特性，并且可以有效地消散LED发光时产生的热量。

9. 发明申请

US20150036329A1 LIGHT EMITTING MODULE HAVING WAFER WITH INTEGRATED POWER SUPPLY DEVICE 审中-公开
标题翻译：具有集成电源设备的散热器发光模块
公开(公告)号：US20150036329A1
公开(公告)日：2015-02-05
申请号：US13976653
申请日：2011-08-22
申请人： Hyuck Jung Choi , Young Eun Yang
发明人： Hyuck Jung Choi , Young Eun Yang
IPC分类号： F21V23/00 , F21L4/08 , H01L25/16 , H01L33/52 , H01L33/62 , H01L31/02 , H01L31/052 , H01L33/50 , F21S9/03 , H01L25/075
CPC分类号： F21V23/005 , F21L4/08 , F21S9/037 , F21Y2101/00 , H01L25/0753 , H01L25/167 , H01L31/02021 , H01L31/02327 , H01L31/0543 , H01L31/153 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/62 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： A light emitting module is disclosed. The light emitting module comprises a wafer having first and second surfaces; a light emitting diode chip disposed on the first surface of the wafer; a power supply device for supplying power to the light emitting diode chip; and a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, wherein the power supply device is disposed on the second surface of the wafer.
摘要翻译：公开了一种发光模块。发光模块包括具有第一和第二表面的晶片; 设置在晶片的第一表面上的发光二极管芯片; 用于向发光二极管芯片供电的电源装置; 以及用于将太阳光转换成电并将其提供给电源装置的光电转换装置，其中电源装置设置在晶片的第二表面上。

10. 发明授权

US08188492B2 Light emitting device having plural light emitting diodes and at least one phosphor for emitting different wavelengths of light 有权
标题翻译：具有多个发光二极管和至少一个用于发射不同波长的光的荧光体的发光器件
公开(公告)号：US08188492B2
公开(公告)日：2012-05-29
申请号：US12439052
申请日：2007-08-24
申请人： Sang Min Lee , Hyuck Jung Choi , Mi Hae Kim
发明人： Sang Min Lee , Hyuck Jung Choi , Mi Hae Kim
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , C09K11/7734 , C09K11/7792 , H01L33/50 , H01L2224/48 , Y02B20/181
摘要： The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor. According to the present invention, there is provided a white light emitting device, wherein using a light emitting diode for emitting light different in wavelength from light that is ex-cititively emitted from the phosphor, an excitation light source, i.e., light in the ultraviolet region for exciting the phosphor is effectively used, thereby improving energy conversion efficiency and improving reliability.
摘要翻译：本发明提供了一种发光器件，包括用于发射紫外线波长区域的光的第一发光二极管; 至少一个磷光体布置在第一发光二极管周围并被从第一发光二极管发射的光激发，以发射具有比从第一发光二极管发射的光的波长更长的峰值波长的光; 以及至少一个第二发光二极管，用于发射波长不同于从荧光体发出的光的峰值波长的波长的光。根据本发明，提供了一种白光发光装置，其中使用发光二极管发射波长不同于从荧光体中突出出射的光的光，激发光源，即紫外线中的光有效地利用激发荧光体的区域，从而提高能量转换效率并提高可靠性。

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