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1. 发明申请

US20050230407A1 Toxic waste receptacle 审中-公开
标题翻译：有毒废物容器
公开(公告)号：US20050230407A1
公开(公告)日：2005-10-20
申请号：US10810382
申请日：2004-03-26
申请人： Chun-Li Fang , Ruei-Hung Jang , Wen-Hung Tseng , Tsung-Chi Hsieh , Sheng-Liang Pan
发明人： Chun-Li Fang , Ruei-Hung Jang , Wen-Hung Tseng , Tsung-Chi Hsieh , Sheng-Liang Pan
IPC分类号： B65D25/14 , B65F1/06 , B65F1/16
CPC分类号： B65F1/06 , B65F1/163 , B65F2001/1676 , B65F2210/1675 , B65F2210/1795
摘要： A toxic waste receptacle with a cover includes an exhaust hood that exhausts toxic gases from the waste receptacle and an interior bag closure mechanism that is operable externally and closes the bag disposed within an interior receptacle of the toxic waste receptacle. The exhaust system exhausts toxic gases from the interior of the waste receptacle and the internal bag closure mechanism confines harmful toxic gases within the bag prior to opening the cover of the waste receptacle to prevent toxic gases from escaping into the work environment.
摘要翻译：具有盖的有毒废物容器包括从废物容器排出有毒气体的排气罩和可在外部操作并封闭设置在有毒废物容器的内部容器内的袋的内部袋封闭机构。排气系统从废物容器的内部排出有毒气体，并且在打开废物容器的盖子之前，内部袋封闭机构将有害的有毒气体限制在袋内，以防止有毒气体逸出到工作环境中。

2. 发明授权

US06971270B2 Method and apparatus for measuring gripping strength of a vacuum wand 失效
标题翻译：用于测量真空棒的夹紧强度的方法和装置
公开(公告)号：US06971270B2
公开(公告)日：2005-12-06
申请号：US10782036
申请日：2004-02-19
申请人： Ruei-Hung Jang , Chih-Lin Ying , Tsung-Chi Hsieh , Sheng-Liang Pan , Ching-Hui Tai
发明人： Ruei-Hung Jang , Chih-Lin Ying , Tsung-Chi Hsieh , Sheng-Liang Pan , Ching-Hui Tai
IPC分类号： G01L1/00 , G01L5/00 , G01L5/22 , G01L7/00
CPC分类号： G01L5/0033 , G01L5/226
摘要： A method and apparatus for measuring the vacuum gripping strength of a vacuum wand or robotic arm provides a pressure gauge and a conduit extending from the pressure gauge and terminating at an opening formed in a receiving surface. A vacuum wand head is positioned on the receiving surface such that the gripping surface of the vacuum wand forms a conterminous boundary with the receiving surface and the vacuum port of the vacuum wand is aligned over the opening formed in the receiving surface. The receiving surface replicates a wafer surface so that the same vacuum gripping strength as would be delivered to a wafer being gripped by the vacuum wand, is thereby sensed by the pressure gauge. Spring loaded positioning members act in conjunction with a clamp member and a mechanical stop position the vacuum wand head in the receiving area and over the opening and also to assure that the gripping surface of the vacuum wand head is flush against the surface of the receiving area. Diminution of vacuum gripping strength caused by scratches or other defects of the gripping surface that cause vacuum leaks between gripping surface and the wafer surface, are similarly reproduced and sensed by the pressure gauge.
摘要翻译：用于测量真空棒或机器人手臂的真空夹紧强度的方法和装置提供压力计和从压力计延伸并终止于形成在接收表面中的开口的导管。真空棒头定位在接收表面上，使得真空棒的抓握表面与接收表面形成一个连续的边界，并且真空棒的真空端口在形成在接收表面中的开口上对准。接收表面复制晶片表面，从而通过压力计感测到与由真空棒夹持的晶片相同的真空夹紧强度。弹簧加载的定位构件与夹紧构件一起作用并且机械地将真空棒头位于接收区域中并在开口上并且还确保真空棒头的夹持表面与接收区域的表面齐平。通过压力计类似地再现和感测由夹紧表面上的擦伤或其他缺陷导致抓握表面和晶片表面之间的真空泄漏的真空夹紧强度的减小。

3. 发明申请

US20050183510A1 Method and apparatus for measuring gripping strength of a vacuum wand 失效
公开(公告)号：US20050183510A1
公开(公告)日：2005-08-25
申请号：US10782036
申请日：2004-02-19
申请人： Ruei-Hung Jang , Chih-Lin Ying , Tsung-Chi Hsieh , Sheng-Liang Pan , Ching-Hui Tai
发明人： Ruei-Hung Jang , Chih-Lin Ying , Tsung-Chi Hsieh , Sheng-Liang Pan , Ching-Hui Tai
IPC分类号： G01L1/00 , G01L5/00 , G01L5/22 , G01L7/00
CPC分类号： G01L5/0033 , G01L5/226
摘要： A method and apparatus for measuring the vacuum gripping strength of a vacuum wand or robotic arm provides a pressure gauge and a conduit extending from the pressure gauge and terminating at an opening formed in a receiving surface. A vacuum wand head is positioned on the receiving surface such that the gripping surface of the vacuum wand forms a conterminous boundary with the receiving surface and the vacuum port of the vacuum wand is aligned over the opening formed in the receiving surface. The receiving surface replicates a wafer surface so that the same vacuum gripping strength as would be delivered to a wafer being gripped by the vacuum wand, is thereby sensed by the pressure gauge. Spring loaded positioning members act in conjunction with a clamp member and a mechanical stop position the vacuum wand head in the receiving area and over the opening and also to assure that the gripping surface of the vacuum wand head is flush against the surface of the receiving area. Diminution of vacuum gripping strength caused by scratches or other defects of the gripping surface that cause vacuum leaks between gripping surface and the wafer surface, are similarly reproduced and sensed by the pressure gauge.

4. 发明申请

US20070177244A1 Method and system for patterning alignment marks on a transparent substrate 有权
标题翻译：在透明基板上图案化对准标记的方法和系统
公开(公告)号：US20070177244A1
公开(公告)日：2007-08-02
申请号：US11400974
申请日：2006-04-10
申请人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
发明人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
IPC分类号： G02B26/00
CPC分类号： G02B26/0841
摘要： Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
摘要翻译：公开了一种在透明基板上形成对准标记的方法和系统。光反射层沉积在晶片的光学透明衬底上。围绕光学透明基板上的对准标记限定区域。除了该区域之外，从透明基板的大部分除去光反射层。另外，公开了一种微电子机械系统装置。该器件包括光学透明衬底，在光学透明衬底上的至少一个光学部分透明的对准标记，以及附接到光学透明衬底的多个反射元件或成像像素。

5. 发明授权

US07838386B2 Method and system for patterning alignment marks on a transparent substrate 有权
标题翻译：在透明基板上图案化对准标记的方法和系统
公开(公告)号：US07838386B2
公开(公告)日：2010-11-23
申请号：US12235960
申请日：2008-09-23
申请人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
发明人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
IPC分类号： H01L21/76 , H01L21/00 , H01L23/544
CPC分类号： G02B26/0841
摘要： Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
摘要翻译：公开了一种在透明基板上形成对准标记的方法和系统。光反射层沉积在晶片的光学透明衬底上。围绕光学透明基板上的对准标记限定区域。除了该区域之外，从透明基板的大部分除去光反射层。另外，公开了一种微电子机械系统装置。该器件包括光学透明衬底，在光学透明衬底上的至少一个光学部分透明的对准标记，以及附接到光学透明衬底的多个反射元件或成像像素。

6. 发明申请

US20090098283A1 METHOD AND SYSTEM FOR PATTERNING ALIGNMENT MARKS ON A TRANSPARENT SUBSTRATE 有权
标题翻译：用于在透明基板上绘制对准标记的方法和系统
公开(公告)号：US20090098283A1
公开(公告)日：2009-04-16
申请号：US12235960
申请日：2008-09-23
申请人： Ruei-Hung JANG , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
发明人： Ruei-Hung JANG , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
IPC分类号： B29D11/00
CPC分类号： G02B26/0841
摘要： Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
摘要翻译：公开了一种在透明基板上形成对准标记的方法和系统。光反射层沉积在晶片的光学透明衬底上。围绕光学透明基板上的对准标记限定区域。除了该区域之外，从透明基板的大部分除去光反射层。另外，公开了一种微电子机械系统装置。该器件包括光学透明衬底，在光学透明衬底上的至少一个光学部分透明的对准标记，以及附接到光学透明衬底的多个反射元件或成像像素。

7. 发明授权

US07450296B2 Method and system for patterning alignment marks on a transparent substrate 有权
标题翻译：在透明基板上图案化对准标记的方法和系统
公开(公告)号：US07450296B2
公开(公告)日：2008-11-11
申请号：US11400974
申请日：2006-04-10
申请人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
发明人： Ruei-Hung Jang , Ya-Wen Lee , Tzu-Yang Wu , Sheng-Liang Pan , Chin-Hsiang Lin , Tsai-Sheng Gau
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0841
摘要： Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
摘要翻译：公开了一种在透明基板上形成对准标记的方法和系统。光反射层沉积在晶片的光学透明衬底上。围绕光学透明基板上的对准标记限定区域。除了该区域之外，从透明基板的大部分除去光反射层。另外，公开了一种微电子机械系统装置。该器件包括光学透明衬底，在光学透明衬底上的至少一个光学部分透明的对准标记，以及附接到光学透明衬底的多个反射元件或成像像素。

8. 发明申请

US20070249137A1 Method and system for wafer backside alignment 失效
标题翻译：晶圆背面对准的方法和系统
公开(公告)号：US20070249137A1
公开(公告)日：2007-10-25
申请号：US11409582
申请日：2006-04-24
申请人： Sheng-Chieh Liu , Chia-Hung Kao , Tzu-Yang Wu , Sheng-Liang Pan , Yuan-Bang Lee
发明人： Sheng-Chieh Liu , Chia-Hung Kao , Tzu-Yang Wu , Sheng-Liang Pan , Yuan-Bang Lee
IPC分类号： H01L21/306 , H01L21/76 , H01L21/302
CPC分类号： B81C1/00603
摘要： Disclosed is a method and a system for wafer backside alignment. A zero mark patterning on front side of a substrate. A plurality of layers are deposited on the front side of the substrate. The wafer is flipped over with backside of the substrate facing up, and a through wafer etching is performed from the backside to an etch stop layer deposited over the front side of the substrate.
摘要翻译：公开了一种用于晶片背面对准的方法和系统。在基板的正面上形成零标记。多个层沉积在基板的正面上。将晶片的背面朝上翻转，从背面到沉积在基板前侧的蚀刻停止层进行贯通晶片蚀刻。

9. 发明申请

US20060001945A1 Spacer fabrication process for manufacturing reflective stealth mirrors and other MEMS devices 有权
标题翻译：用于制造反射隐形镜和其他MEMS器件的间隔件制造工艺
公开(公告)号：US20060001945A1
公开(公告)日：2006-01-05
申请号：US11002766
申请日：2004-12-02
申请人： Shan-Hua Wu , Fei-Yun Chen , Wei-Ya Wang , Hung-Hsin Liu , Sheng-Liang Pan
发明人： Shan-Hua Wu , Fei-Yun Chen , Wei-Ya Wang , Hung-Hsin Liu , Sheng-Liang Pan
IPC分类号： G02B26/00
CPC分类号： G02B26/0833
摘要： A method for use in manufacturing a microelectromechanical system, such as a reflective stealth mirror includes the steps of: forming an I-shape mirror structure; forming a spacer layer over the I-shape mirror structure; and patterning the spacer layer to form at least one spacer along a side of the I-shape mirror structure.
摘要翻译：一种用于制造诸如反射式隐形镜的微机电系统的方法包括以下步骤：形成I形镜结构; 在所述I形镜结构上形成间隔层; 以及图案化间隔层以沿着I形镜结构的一侧形成至少一个间隔物。

10. 发明授权

US06495813B1 Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process 有权
标题翻译：用于半导体成像装置的多微透镜设计，以提高滤色镜过程中的光采集效率
公开(公告)号：US06495813B1
公开(公告)日：2002-12-17
申请号：US09414926
申请日：1999-10-12
申请人： Yang-Tung Fan , Bii-Cheng Chang , Sheng-Liang Pan , Kuo-Liang Lu
发明人： Yang-Tung Fan , Bii-Cheng Chang , Sheng-Liang Pan , Kuo-Liang Lu
IPC分类号： H01L2700
CPC分类号： H01L27/14603 , H01L27/14627
摘要： Multi-microlens arrays for optimizing light collection efficiency in CCD/CMOS solid-state color image cameras with L-shaped or non-regular photodetector areas are disclosed. Microelectronic fabrication methods for forming planar array multi-microlenses comprised of elements consisting of lens-pairs, integrated with color-filters, and compatible with CMOS high-volume manufacturing are taught. Experimental results demonstrating the processes for fabrication of multi-microlenses for L-shaped and for non-regular sensing areas are given.
摘要翻译：公开了用于优化具有L形或非常规光电探测器区域的CCD / CMOS固态彩色摄像机中的光收集效率的多微透镜阵列。教导了用于形成平面阵列多微透镜的微电子制造方法，所述平面阵列多微透镜由与彩色滤光片集成并与CMOS大批量制造兼容的透镜对构成的元件组成。给出了证明L型和非常规感测区域的多微透镜制造工艺的实验结果。

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