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1. 发明授权

US07630594B2 Optical interconnection module 有权
标题翻译：光互连模块
公开(公告)号：US07630594B2
公开(公告)日：2009-12-08
申请号：US11878114
申请日：2007-07-20
申请人： Chun-Hsing Lee , Shin-Ge Lee , Ying-Chih Chen , Cherng-Shiun Wu
发明人： Chun-Hsing Lee , Shin-Ge Lee , Ying-Chih Chen , Cherng-Shiun Wu
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/4214 , G02B6/4204 , G02B6/4231
摘要： An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.
摘要翻译：光学互连模块包括至少一个光电元件，至少一个基板和至少一个光耦合元件。多个匹配元件形成在与光电子元件和衬底相对的光耦合元件的一侧上。在对应于匹配元件的位置处，在光电子元件和衬底中形成多个对准元件。匹配元件和对准元件彼此接合以进行对准，使得光电元件，基板和光耦合元件在组装期间直接对准。此外，光耦合元件用于增加光电子元件和形成在衬底上的光波导的光耦合效率。

2. 发明申请

US20080085076A1 Optical interconnection module 有权
标题翻译：光互连模块
公开(公告)号：US20080085076A1
公开(公告)日：2008-04-10
申请号：US11878114
申请日：2007-07-20
申请人： Chun-Hsing Lee , Shin-Ge Lee , Ying-Chih Chen , Cherng-shiun Wu
发明人： Chun-Hsing Lee , Shin-Ge Lee , Ying-Chih Chen , Cherng-shiun Wu
IPC分类号： G02B6/12
CPC分类号： G02B6/4214 , G02B6/4204 , G02B6/4231
摘要： An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.
摘要翻译：光学互连模块包括至少一个光电元件，至少一个基板和至少一个光耦合元件。多个匹配元件形成在与光电子元件和衬底相对的光耦合元件的一侧上。在对应于匹配元件的位置处，在光电子元件和衬底中形成多个对准元件。匹配元件和对准元件彼此接合以进行对准，使得光电元件，基板和光耦合元件在组装期间直接对准。此外，光耦合元件用于增加光电子元件和形成在衬底上的光波导的光耦合效率。

3. 发明授权

US07295725B1 Electro-optical circuit board 有权
标题翻译：电光电路板
公开(公告)号：US07295725B1
公开(公告)日：2007-11-13
申请号：US11706879
申请日：2007-02-13
申请人： Cherng-Shiun Wu , Hsien-Huan Chiu , Shin-Ge Lee , Ying-Chih Chen
发明人： Cherng-Shiun Wu , Hsien-Huan Chiu , Shin-Ge Lee , Ying-Chih Chen
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42 , G02B6/10 , G02F1/035 , G02F1/295
CPC分类号： G02B6/4214 , G02B6/12 , G02B6/13 , H05K1/0274 , H05K3/4641 , H05K2203/061
摘要： An electro-optical circuit board is provided, which includes an electrical wiring board and an optical wiring board. The optical wiring board includes a first metal substrate, an optical guiding layer formed on the first metal substrate, and a metal supporting structure formed around the optical guiding layer, wherein the optical guiding layer includes an optical waveguide and a clad wrapping the optical waveguide. When the electrical wiring board is joined with the optical wiring board through a laminating process, the metal supporting structure absorbs the pressure applied to the electro-optical circuit board.
摘要翻译：提供一种电光电路板，其包括电布线板和光布线板。光配线板包括第一金属基板，形成在第一金属基板上的光引导层和形成在光导层周围的金属支撑结构，其中，光导层包括光波导和包围光波导的包层。当电接线板通过层压工艺与光布线板接合时，金属支撑结构吸收施加到电光电路板的压力。

4. 发明申请

US20080138006A1 Hybrid electro-optical circuit board and method for fabricating the same 有权
标题翻译：混合电光电路板及其制造方法
公开(公告)号：US20080138006A1
公开(公告)日：2008-06-12
申请号：US11790547
申请日：2007-04-26
申请人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
发明人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/12004 , H05K1/0274 , H05K2201/0959 , H05K2201/2054
摘要： A hybrid electro-optical circuit board and a method for fabricating the same are provided. The hybrid electro-optical circuit board includes a plate, and a light guiding hole is formed in the plate for connecting an upper surface and a lower surface of the plate. A light-guide device is formed on the lower surface and covers the light guiding hole for transmitting an optical signal between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is formed on an inner wall of the light guiding hole to reduce the roughness of the inner wall and reflects optical signal by the reflection characteristics of metal. Thus, the decay of the intensity of optical signal is reduced. A transparent substance is filled into the light guiding hole for transmitting the optical signal and stopping invaders from entering the light guiding hole.
摘要翻译：提供了一种混合电光电路板及其制造方法。混合电光电路板包括板，并且在板中形成用于连接板的上表面和下表面的导光孔。导光装置形成在下表面上并且覆盖导光孔，用于经由导光孔在光导装置和板的上表面之间传输光信号。金属层形成在导光孔的内壁上，以减小内壁的粗糙度，并通过金属的反射特性反射光信号。因此，光信号强度的衰减降低。透明物质被填充到导光孔中，用于传输光信号并阻止入侵者进入导光孔。

5. 发明授权

US07577321B2 Hybrid electro-optical circuit board and method for fabricating the same 有权
标题翻译：混合电光电路板及其制造方法
公开(公告)号：US07577321B2
公开(公告)日：2009-08-18
申请号：US11790547
申请日：2007-04-26
申请人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
发明人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/12004 , H05K1/0274 , H05K2201/0959 , H05K2201/2054
摘要： A hybrid electro-optical circuit board including a plate, a light guiding hole and a light-guide device. The light guiding hole is formed in the plate to be connected to an upper surface and a lower surface of the plate. The light-guide device is formed on the lower surface and covers and contacts the light guiding hole. An optical signal is transmitted between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is further formed on an inner wall of the light guiding hole, to reduce the roughness of the inner wall and reflects the optical signal by the reflection characteristics of metal. Further, the light guiding hole is filled with a transparent substance to transmit the optical signal and to stop foreign material from entering the light guiding hole.
摘要翻译：一种混合电光电路板，包括板，导光孔和导光装置。导光孔形成在板中以连接到板的上表面和下表面。导光装置形成在下表面上并覆盖并接触导光孔。光信号经由导光孔在导光装置与板的上表面之间传递。金属层进一步形成在导光孔的内壁上，以减小内壁的粗糙度，并通过金属的反射特性反射光信号。此外，导光孔填充有透明物质以透射光信号并阻止异物进入导光孔。

6. 发明授权

US07508059B2 Stacked chip package with redistribution lines 有权
标题翻译：具有再分配线的堆叠芯片封装
公开(公告)号：US07508059B2
公开(公告)日：2009-03-24
申请号：US11416134
申请日：2006-05-03
申请人： Mou-Shiung Lin , Shih-Hsiung Lin , Hsin-Jung Lo , Ying-Chih Chen , Chiu-Ming Chou
发明人： Mou-Shiung Lin , Shih-Hsiung Lin , Hsin-Jung Lo , Ying-Chih Chen , Chiu-Ming Chou
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/525 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/06135 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2224/73265 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06558 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate.
摘要翻译：芯片封装包括具有第一侧和第二侧的第一芯片，其中所述第一芯片包括第一焊盘，第一焊盘，第二焊盘和在其第一侧的第一钝化层，所述第一钝化层中的开口暴露所述第一焊盘，所述第一迹线在所述第一钝化层之上，所述第一迹线将所述第一焊盘连接到所述第二焊盘; 具有第一侧和第二侧的第二芯片，其中所述第二芯片包括在其第一侧的第一焊盘，其中所述第二芯片的所述第二侧与所述第二芯片的所述第二侧接合; 与所述第一芯片的所述第一侧或所述第二芯片的所述第一侧连接的衬底; 连接所述第一芯片的所述第二焊盘和所述衬底的第一引线接合线; 以及连接所述第二芯片的所述第一焊盘和所述衬底的第二引线键合线。

7. 发明申请

US20070104414A1 OPTOELECTRIC CONVERTING SUBSTRATE 失效
标题翻译：光电转换基板
公开(公告)号：US20070104414A1
公开(公告)日：2007-05-10
申请号：US11488113
申请日：2006-07-18
申请人： Daniel Chu , Ying-Chih Chen , Shun-Tien Lee
发明人： Daniel Chu , Ying-Chih Chen , Shun-Tien Lee
IPC分类号： G02B6/12
CPC分类号： G02B6/02314 , G02B6/12002 , G02B6/12004 , G02B6/43
摘要： An optoelectric converting substrate includes a substrate, at least one honeycomb-shaped micro-structured optical waveguide embedded in the substrate and having two ends exposed through the substrate, a plurality of optoelectronic elements disposed on the substrate and coupled with the two ends of the honeycomb-shaped micro-structured optical waveguide, and a plurality of IC driving elements disposed on the substrate and electrically connected with the optoelectronic elements by conductive wires to drive the optoelectronic elements such that optical signals are transmitted through the honeycomb-shaped micro-structured optical waveguide. The optoelectric converting substrate can be easily fabricated at a low cost and effectively increases the displacement tolerance of the optoelectronic elements in substrate packaging.
摘要翻译：光电转换基板包括基板，至少一个蜂窝状微结构光波导，其嵌入在该基板内并且具有通过该基板露出的两端;多个光电元件，设置在该基板上并与该蜂窝体的两端连接形状的微结构光波导，以及多个IC驱动元件，其设置在基板上并通过导线与光电元件电连接，以驱动光电元件，使得光信号通过蜂窝状微结构光波导。可以以低成本容易地制造光电转换基板，并有效地增加基板封装中的光电元件的位移公差。

8. 发明授权

US07212702B1 Optoelectric converting substrate 失效
标题翻译：光电转换基板
公开(公告)号：US07212702B1
公开(公告)日：2007-05-01
申请号：US11488113
申请日：2006-07-18
申请人： Yen Chu , Ying-Chih Chen , Shun-Tien Lee
发明人： Yen Chu , Ying-Chih Chen , Shun-Tien Lee
IPC分类号： G02B6/02 , G02B6/12 , G02B6/32 , G02B6/36
CPC分类号： G02B6/02314 , G02B6/12002 , G02B6/12004 , G02B6/43
摘要： An optoelectric converting substrate includes a substrate, at least one honeycomb-shaped micro-structured optical waveguide embedded in the substrate and having two ends exposed through the substrate, a plurality of optoelectronic elements disposed on the substrate and coupled with the two ends of the honeycomb-shaped micro-structured optical waveguide, and a plurality of IC driving elements disposed on the substrate and electrically connected with the optoelectronic elements by conductive wires to drive the optoelectronic elements such that optical signals are transmitted through the honeycomb-shaped micro-structured optical waveguide. The optoelectric converting substrate can be easily fabricated at a low cost and effectively increases the displacement tolerance of the optoelectronic elements in substrate packaging.
摘要翻译：光电转换基板包括基板，至少一个蜂窝状微结构光波导，其嵌入在该基板内并且具有通过该基板露出的两端;多个光电元件，设置在该基板上并与该蜂窝体的两端连接形状的微结构光波导，以及多个IC驱动元件，其设置在基板上并通过导线与光电元件电连接，以驱动光电元件，使得光信号通过蜂窝状微结构光波导。可以以低成本容易地制造光电转换基板，并有效地增加基板封装中的光电元件的位移公差。

9. 发明申请

US20050066481A1 Pet collar buckle structure 失效
标题翻译：宠物领扣扣结构
公开(公告)号：US20050066481A1
公开(公告)日：2005-03-31
申请号：US10670736
申请日：2003-09-26
申请人： Ying-Chih Chen
发明人： Ying-Chih Chen
IPC分类号： A01K27/00 , A44B11/25
CPC分类号： A01K27/005 , A44B11/2592 , Y10T24/3982 , Y10T24/45461 , Y10T24/45775
摘要： A pet collar buckle structure comprised of a plastic male member and female member. The male member consists of a stepped round face at its front end, an outer circular surface protruding from the round surface and, furthermore, a lateral notch formed in the two sides of the round face. The female member has an interior space between a surface section and two elastic clips, each elastic clip having a narrow slot formed along the outer side as well as a convex section and a concave section contiguously articulated along the inner side. As such, the male member becomes tightly ensconced following insertion into the female member, but when the male member and the female member are subjected to a certain pulling force, the male member is safely released without dead angle occurrence from the trailing end and bottom surface of the female member.
摘要翻译：一种由塑料阳构件和阴构件组成的宠物衣领扣结构。阳构件由其前端的阶梯状圆形面，从圆形表面突出的外圆形表面以及另外形成在圆形表面两侧的横向凹口组成。阴构件具有在表面部分和两个弹性夹子之间的内部空间，每个弹性夹具具有沿着外侧形成的狭缝，以及沿着内侧连续铰接的凸部和凹部。因此，在插入阴构件之后，阳构件变得紧紧地固定，但是当阳构件和阴构件受到一定的拉力时，阳构件从后端和底面发生而没有死角而被安全地释放的女性成员。

10. 发明授权

US09142527B2 Method of wire bonding over active area of a semiconductor circuit 有权
公开(公告)号：US09142527B2
公开(公告)日：2015-09-22
申请号：US11926156
申请日：2007-10-29
申请人： Jin-Yuan Lee , Ying-Chih Chen , Mou-Shiung Lin
发明人： Jin-Yuan Lee , Ying-Chih Chen , Mou-Shiung Lin
IPC分类号： H01L21/4763 , H01L23/00
CPC分类号： H01L24/48 , H01L24/03 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05171 , H01L2224/05187 , H01L2224/05548 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/854 , H01L2224/85424 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/04953 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metallization formed over the active and/or passive devices. A passivation layer formed over the interconnect metallization is provided, wherein openings are formed in the passivation layer to an upper metal layer of the interconnect metallization. Compliant metal bond pads are formed over the passivation layer, wherein the compliant metal bond pads are connected through the openings to the upper metal layer, and wherein the compliant metal bond pads are formed substantially over the active and/or passive devices. The compliant metal bond pads may be formed of a composite metal structure.

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