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1. 发明授权

US07212702B1 Optoelectric converting substrate 失效
标题翻译：光电转换基板
公开(公告)号：US07212702B1
公开(公告)日：2007-05-01
申请号：US11488113
申请日：2006-07-18
申请人： Yen Chu , Ying-Chih Chen , Shun-Tien Lee
发明人： Yen Chu , Ying-Chih Chen , Shun-Tien Lee
IPC分类号： G02B6/02 , G02B6/12 , G02B6/32 , G02B6/36
CPC分类号： G02B6/02314 , G02B6/12002 , G02B6/12004 , G02B6/43
摘要： An optoelectric converting substrate includes a substrate, at least one honeycomb-shaped micro-structured optical waveguide embedded in the substrate and having two ends exposed through the substrate, a plurality of optoelectronic elements disposed on the substrate and coupled with the two ends of the honeycomb-shaped micro-structured optical waveguide, and a plurality of IC driving elements disposed on the substrate and electrically connected with the optoelectronic elements by conductive wires to drive the optoelectronic elements such that optical signals are transmitted through the honeycomb-shaped micro-structured optical waveguide. The optoelectric converting substrate can be easily fabricated at a low cost and effectively increases the displacement tolerance of the optoelectronic elements in substrate packaging.
摘要翻译：光电转换基板包括基板，至少一个蜂窝状微结构光波导，其嵌入在该基板内并且具有通过该基板露出的两端;多个光电元件，设置在该基板上并与该蜂窝体的两端连接形状的微结构光波导，以及多个IC驱动元件，其设置在基板上并通过导线与光电元件电连接，以驱动光电元件，使得光信号通过蜂窝状微结构光波导。可以以低成本容易地制造光电转换基板，并有效地增加基板封装中的光电元件的位移公差。

2. 发明授权

US07249896B2 Array optical sub-assembly 失效
标题翻译：阵列光学子组件
公开(公告)号：US07249896B2
公开(公告)日：2007-07-31
申请号：US11074733
申请日：2005-03-09
申请人： Yi-Ming Chen , Ying-Chih Chen , Yao-Ling Cheng , Shun-Tien Lee
发明人： Yi-Ming Chen , Ying-Chih Chen , Yao-Ling Cheng , Shun-Tien Lee
IPC分类号： G02B6/36 , G02B6/42 , G02B6/00
CPC分类号： H01L27/14618 , G02B6/4206 , G02B6/425 , H01L25/167 , H01L27/14625 , H01L27/14627 , H01L27/14634 , H01L27/14685 , H01L33/58 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H05K1/141 , H05K1/183 , H01L2224/0401
摘要： An array optical sub-assembly includes a base seat, an integrated circuit, a transparent substrate and a photoelectric element. The integrated circuit and the photoelectric element are bonded respectively to the base seat and the transparent substrate. The base seat and the transparent substrate form a sealed space to protect the elements. The photoelectric element and the integrated circuit are separated to avoid thermal interference between the photoelectric element and the integrated circuit. Therefore total performance is increased and fabrication difficulty is reduced.
摘要翻译：阵列光学子组件包括基座，集成电路，透明基板和光电元件。集成电路和光电元件分别结合到基座和透明基板。基座和透明基板形成密封空间以保护元件。分离光电元件和集成电路，以避免光电元件与集成电路之间的热干扰。因此，总体性能提高，制造难度降低。

3. 发明授权

US07577321B2 Hybrid electro-optical circuit board and method for fabricating the same 有权
标题翻译：混合电光电路板及其制造方法
公开(公告)号：US07577321B2
公开(公告)日：2009-08-18
申请号：US11790547
申请日：2007-04-26
申请人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
发明人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/12004 , H05K1/0274 , H05K2201/0959 , H05K2201/2054
摘要： A hybrid electro-optical circuit board including a plate, a light guiding hole and a light-guide device. The light guiding hole is formed in the plate to be connected to an upper surface and a lower surface of the plate. The light-guide device is formed on the lower surface and covers and contacts the light guiding hole. An optical signal is transmitted between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is further formed on an inner wall of the light guiding hole, to reduce the roughness of the inner wall and reflects the optical signal by the reflection characteristics of metal. Further, the light guiding hole is filled with a transparent substance to transmit the optical signal and to stop foreign material from entering the light guiding hole.
摘要翻译：一种混合电光电路板，包括板，导光孔和导光装置。导光孔形成在板中以连接到板的上表面和下表面。导光装置形成在下表面上并覆盖并接触导光孔。光信号经由导光孔在导光装置与板的上表面之间传递。金属层进一步形成在导光孔的内壁上，以减小内壁的粗糙度，并通过金属的反射特性反射光信号。此外，导光孔填充有透明物质以透射光信号并阻止异物进入导光孔。

4. 发明申请

US20060140550A1 Array optical sub-assembly 失效
标题翻译：阵列光学子组件
公开(公告)号：US20060140550A1
公开(公告)日：2006-06-29
申请号：US11074733
申请日：2005-03-09
申请人： Yi-Ming Chen , Ying-Chih Chen , Yao-Ling Cheng , Shun-Tien Lee
发明人： Yi-Ming Chen , Ying-Chih Chen , Yao-Ling Cheng , Shun-Tien Lee
IPC分类号： G02B6/42
CPC分类号： H01L27/14618 , G02B6/4206 , G02B6/425 , H01L25/167 , H01L27/14625 , H01L27/14627 , H01L27/14634 , H01L27/14685 , H01L33/58 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H05K1/141 , H05K1/183 , H01L2224/0401
摘要： An array optical sub-assembly includes a base seat, an integrated circuit, a transparent substrate and a photoelectric element. The integrated circuit and the photoelectric element are bonded respectively to the base seat and the transparent substrate. The base seat and the transparent substrate form a sealed space to protect the elements. The photoelectric element and the integrated circuit are separated to avoid thermal interference between the photoelectric element and the integrated circuit. Therefore total performance is increased and fabrication difficulty is reduced.
摘要翻译：阵列光学子组件包括基座，集成电路，透明基板和光电元件。集成电路和光电元件分别结合到基座和透明基板。基座和透明基板形成密封空间以保护元件。分离光电元件和集成电路，以避免光电元件与集成电路之间的热干扰。因此，总体性能提高，制造难度降低。

5. 发明申请

US20080138006A1 Hybrid electro-optical circuit board and method for fabricating the same 有权
标题翻译：混合电光电路板及其制造方法
公开(公告)号：US20080138006A1
公开(公告)日：2008-06-12
申请号：US11790547
申请日：2007-04-26
申请人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
发明人： Chien-Chun Lu , Shin-Ge Lee , Chun-Hsing Lee , Shun-Tien Lee , Ying-Chih Chen
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/12004 , H05K1/0274 , H05K2201/0959 , H05K2201/2054
摘要： A hybrid electro-optical circuit board and a method for fabricating the same are provided. The hybrid electro-optical circuit board includes a plate, and a light guiding hole is formed in the plate for connecting an upper surface and a lower surface of the plate. A light-guide device is formed on the lower surface and covers the light guiding hole for transmitting an optical signal between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is formed on an inner wall of the light guiding hole to reduce the roughness of the inner wall and reflects optical signal by the reflection characteristics of metal. Thus, the decay of the intensity of optical signal is reduced. A transparent substance is filled into the light guiding hole for transmitting the optical signal and stopping invaders from entering the light guiding hole.
摘要翻译：提供了一种混合电光电路板及其制造方法。混合电光电路板包括板，并且在板中形成用于连接板的上表面和下表面的导光孔。导光装置形成在下表面上并且覆盖导光孔，用于经由导光孔在光导装置和板的上表面之间传输光信号。金属层形成在导光孔的内壁上，以减小内壁的粗糙度，并通过金属的反射特性反射光信号。因此，光信号强度的衰减降低。透明物质被填充到导光孔中，用于传输光信号并阻止入侵者进入导光孔。

6. 发明申请

US20070104414A1 OPTOELECTRIC CONVERTING SUBSTRATE 失效
标题翻译：光电转换基板
公开(公告)号：US20070104414A1
公开(公告)日：2007-05-10
申请号：US11488113
申请日：2006-07-18
申请人： Daniel Chu , Ying-Chih Chen , Shun-Tien Lee
发明人： Daniel Chu , Ying-Chih Chen , Shun-Tien Lee
IPC分类号： G02B6/12
CPC分类号： G02B6/02314 , G02B6/12002 , G02B6/12004 , G02B6/43
摘要： An optoelectric converting substrate includes a substrate, at least one honeycomb-shaped micro-structured optical waveguide embedded in the substrate and having two ends exposed through the substrate, a plurality of optoelectronic elements disposed on the substrate and coupled with the two ends of the honeycomb-shaped micro-structured optical waveguide, and a plurality of IC driving elements disposed on the substrate and electrically connected with the optoelectronic elements by conductive wires to drive the optoelectronic elements such that optical signals are transmitted through the honeycomb-shaped micro-structured optical waveguide. The optoelectric converting substrate can be easily fabricated at a low cost and effectively increases the displacement tolerance of the optoelectronic elements in substrate packaging.
摘要翻译：光电转换基板包括基板，至少一个蜂窝状微结构光波导，其嵌入在该基板内并且具有通过该基板露出的两端;多个光电元件，设置在该基板上并与该蜂窝体的两端连接形状的微结构光波导，以及多个IC驱动元件，其设置在基板上并通过导线与光电元件电连接，以驱动光电元件，使得光信号通过蜂窝状微结构光波导。可以以低成本容易地制造光电转换基板，并有效地增加基板封装中的光电元件的位移公差。

7. 发明申请

US20050090146A1 Optical transmission module 失效
标题翻译：光传输模块
公开(公告)号：US20050090146A1
公开(公告)日：2005-04-28
申请号：US10816327
申请日：2004-04-01
申请人： Min Kao , Cheng Tsai , Chia-Hung Chiu , Shun-Tien Lee
发明人： Min Kao , Cheng Tsai , Chia-Hung Chiu , Shun-Tien Lee
IPC分类号： G02B6/42 , H01R12/00 , H05K1/14 , H05K1/18
CPC分类号： H05K1/147 , H05K1/145 , H05K1/189 , H05K2201/10121
摘要： An optical transmission module comprising at least a photoelectric element, a printed circuit board and a flexible printed circuit board is provided. The flexible printed circuit board electrically connects the photoelectrical elements and the printed circuit board. At least a ground plane is formed on the flexible printed circuit board to reduce crosstalk and electromagnetic interference. Transmission lines and impedance formed on the flexible printed circuit board solve the problems of signal distortion and impedance mismatch. The flexible printed circuit board also serves as a flexible interface to solve prior problems of connection stress between the photoelectric element and the printed circuit board.
摘要翻译：提供至少包括光电元件，印刷电路板和柔性印刷电路板的光传输模块。柔性印刷电路板电连接光电元件和印刷电路板。至少在柔性印刷电路板上形成接地平面以减少串扰和电磁干扰。在柔性印刷电路板上形成的传输线和阻抗解决了信号失真和阻抗失配的问题。柔性印刷电路板还用作柔性接口，以解决光电元件和印刷电路板之间的连接应力的先前问题。

8. 发明授权

US07680389B2 Light transceiver module 失效
标题翻译：光收发模块
公开(公告)号：US07680389B2
公开(公告)日：2010-03-16
申请号：US11643893
申请日：2006-12-22
申请人： Cheng-Da Shaw , Shun-Tien Lee , Chiung-Hung Wang , Min Sheng Kao , Cheng Hung Tsai , Kun-Yi Shen , Chia Hung Chiu
发明人： Cheng-Da Shaw , Shun-Tien Lee , Chiung-Hung Wang , Min Sheng Kao , Cheng Hung Tsai , Kun-Yi Shen , Chia Hung Chiu
IPC分类号： G02B6/42 , H04B10/02
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4245 , G02B6/4256 , G02B6/4281 , G02B6/4283 , G02B6/4284
摘要： A light transceiver module is designed for electronic devices. It forms an electric connection with the electric connector of the electronic device. The light transceiver module contains a base, a light-emitting device for providing optical signals, a light-receiving device for receiving optical signals, and a main circuit board. The base supports the light-emitting device, the light-receiving device, and the main circuit board. The main circuit board has a pluggable electric connector for connections with the electric connector of the electronic device. The light transceiver module can be used to simplify and optimize the devices using it.
摘要翻译：光收发模块设计用于电子设备。它与电子设备的电连接器形成电连接。光收发模块包括基座，用于提供光信号的发光装置，用于接收光信号的光接收装置和主电路板。基座支撑发光装置，光接收装置和主电路板。主电路板具有用于与电子设备的电连接器连接的可插拔电连接器。光收发模块可用于简化和优化使用它的设备。

9. 发明申请

US20060067698A1 Optical fiber system and method for carrying both CATV and Ethernet signals 有权
公开(公告)号：US20060067698A1
公开(公告)日：2006-03-30
申请号：US10948330
申请日：2004-09-24
申请人： Yi-Jen Chan , Fan-Hsiu Huang , Hsin-Pin Wang , Dong-Min Lin , Mu-Tao Chu , Shin-Ge Lee , Shun-Tien Lee
发明人： Yi-Jen Chan , Fan-Hsiu Huang , Hsin-Pin Wang , Dong-Min Lin , Mu-Tao Chu , Shin-Ge Lee , Shun-Tien Lee
IPC分类号： H04B10/12
CPC分类号： H04B10/25751
摘要： The present invention is an optical fiber system and method for carrying both CATV and Ethernet signals. The digital signals are translated into higher band by a direct up/down conversion so that analog signals and digital signals are treated as different frequency bands of electrical signals. Then, all the signals are mixed/divided by a power combiner/divider. And then, by using optoelectronic devices, the signals are processed with optoelectronic conversion. The converted optical signals are transmitted in a fiber or a related optical channel having low channel loss yet high capacity. To sum up, the present invention can transmit digital signals together with analog signals in a single wavelength to save the cost of an optical signal system and to provide a convenience on rearranging the system.

10. 发明申请

US20050135726A1 Array optical subassembly for array optical active component 失效
标题翻译：用于阵列光学有源元件的阵列光学子组件
公开(公告)号：US20050135726A1
公开(公告)日：2005-06-23
申请号：US10826176
申请日：2004-04-15
申请人： Yi-Ming Chen , Chiung-Hung Wang , Shun-Tien Lee , Yao-Ling Cheng , Cherng-Shiun Wu
发明人： Yi-Ming Chen , Chiung-Hung Wang , Shun-Tien Lee , Yao-Ling Cheng , Cherng-Shiun Wu
IPC分类号： G02B6/42 , G02B6/12
CPC分类号： G02B6/4292 , G02B6/423 , G02B6/4244 , G02B6/4249 , G02B6/4257 , G02B6/4269
摘要： An array optical subassembly has a substrate, at least one optical active component, a driver IC, a circuit board and a cover covering the foregoing elements. The substrate has two opposite surfaces, wherein one surface is formed by a lens array and the other surface is formed by metal pads, lines and alignment keys. The optical active component has a source array aligned to the lens array when the optical active component is connected to the metal pads on the substrate. The driver IC and the circuit board are also connected to the metal pads on the substrate to drive the optical active component. The lens array is directly formed on the substrate so the source array is aligned to the lens array very well by the alignment keys when the optical active component connected to the substrate.
摘要翻译：阵列光学子组件具有衬底，至少一个光学有源元件，驱动器IC，电路板和覆盖上述元件的盖。衬底具有两个相对的表面，其中一个表面由透镜阵列形成，另一个表面由金属焊盘，线和对准键形成。当光学有源部件连接到基板上的金属焊盘时，光学有源部件具有与透镜阵列对准的源阵列。驱动器IC和电路板也连接到衬底上的金属焊盘以驱动光学有源部件。透镜阵列直接形成在衬底上，因此当连接到衬底的光学有源元件时，源极阵列通过对准键非常好地对准透镜阵列。

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