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    • 1. 发明申请
    • Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment
    • 添加D2至H2以检测和校准通过分离电子附着形成的原子氢
    • US20090008426A1
    • 2009-01-08
    • US12233678
    • 2008-09-19
    • Chun Christine DongEugene Joseph Karwacki, JR.Richard E. Patrick
    • Chun Christine DongEugene Joseph Karwacki, JR.Richard E. Patrick
    • B23K37/00
    • B23K1/206H01L2924/0002H05K3/3489H01L2924/00
    • A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
    • 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法,包括以下步骤:a)提供一种或多种待焊接的组分, 连接到作为目标组件的第一电极; b)提供邻近目标组件的第二电极; c)在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d)向所述第一和第二电极提供直流(DC)电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e)使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。
    • 2. 发明授权
    • Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
    • 添加D2至H2以检测和校准由离子电子附着形成的原子氢
    • US07434719B2
    • 2008-10-14
    • US11298262
    • 2005-12-09
    • Chun Christine DongEugene Joseph Karwacki, Jr.Richard E. Patrick
    • Chun Christine DongEugene Joseph Karwacki, Jr.Richard E. Patrick
    • B23K35/38B23H3/00
    • B23K1/206H01L2924/0002H05K3/3489H01L2924/00
    • A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
    • 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法,包括以下步骤:a)提供一种或多种待焊接的组分, 连接到作为目标组件的第一电极; b)提供邻近目标组件的第二电极; c)在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d)向所述第一和第二电极提供直流(DC)电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e)使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。