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    • 6. 发明申请
    • Monolithic duplexer and fabrication method thereof
    • 单片双工器及其制造方法
    • US20070024391A1
    • 2007-02-01
    • US11392624
    • 2006-03-30
    • Sang-chul SulDuck-hwan KimChul-soo KimIn-sang SongMoon-chul LeeKyu-dong JungJea-shik Shin
    • Sang-chul SulDuck-hwan KimChul-soo KimIn-sang SongMoon-chul LeeKyu-dong JungJea-shik Shin
    • H03H7/46
    • H03H3/02H03H9/0571H03H9/706
    • A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a plurality of first ground planes formed between the plurality of elements. A cap wafer is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts, and cavities. Second sealing parts are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes cover the plurality of ground posts. Via holes vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.
    • 一种单片双工器及其制造方法。 单片双工器包括器件晶片,在器件晶片的顶部彼此远离的多个元件,形成在器件晶片的顶部上的第一密封部分和形成在器件晶片的顶部之间的多个第一接地平面 元素。 还提供了盖晶片,其具有用于封装器件晶片,多个突出部分,多个接地柱和空腔的蚀刻区域。 第二密封部分形成在突出部分的底部上,并且多个第二接地平面覆盖多个接地柱。 通孔垂直穿过盖晶片以连接到多个第二接地平面,并且接地端子形成在通孔的顶部上。 第一密封部分和第一接地平面分别附接到第二密封部分和第二接地平面。