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    • 8. 发明授权
    • VLSI hot-spot minimization using nanotubes
    • 使用纳米管的VLSI热点最小化
    • US07842554B2
    • 2010-11-30
    • US12169458
    • 2008-07-08
    • Christos Dimitrios DimitrakopoulosChristos John Georgiou
    • Christos Dimitrios DimitrakopoulosChristos John Georgiou
    • H01L21/00
    • F28F21/02F28D2015/0225F28D2021/0029F28F2255/00F28F2260/02H01L23/373H01L2924/0002H01L2924/00
    • The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area. The heat conductivity of the nanotubes is greater than the heat conductivity of the matrix material, with the distal ends of the nanotubes exposed to present a distal surface comprising the first heat conducting means for direct contact with a medium comprising a cooling fluid. The inventors also disclose processes for manufacturing and using the device and products produced by the processes.
    • 本发明涉及一种半导体器件,其包括具有位于管芯上的平面中的至少一个限定热点区域的管芯和包括在不同于热点区域的平面的平面内延伸的碳纳米管的纳米管的冷却结构 并从热点区域的平面向外。 纳米管与热点区域可操作地相关联,以降低由热点区域和模具上的至少一个其它区域之间的温度梯度,该温度梯度由低于热点区域的温度限定。 包括第二导热材料的基质材料基本上围绕纳米管,并且与由热点区域的温度限定的模具上的另一个区域可操作地相关联并与其导热。 纳米管的导热性大于基体材料的导热性,其中纳米管的远端暴露于远侧表面,该远端表面包括用于与包含冷却流体的介质直接接触的第一导热装置。 本发明人还公开了用于制造和使用由该方法生产的装置和产品的方法。
    • 9. 发明授权
    • Active devices using threads
    • 主动设备使用线程
    • US06437422B1
    • 2002-08-20
    • US09852078
    • 2001-05-09
    • Paul M. SolomonJane Margaret ShawCherie R. KaganChristos Dimitrios DimitrakopoulosTak Hung Ning
    • Paul M. SolomonJane Margaret ShawCherie R. KaganChristos Dimitrios DimitrakopoulosTak Hung Ning
    • H01L2906
    • D02G3/441H01L29/0657H01L51/0036H01L51/0512H02N2/18
    • Active devices that have either a thread or a ribbon geometry. The thread geometry includes single thread active devices and multiple thread devices. Single thread devices have a central core that may contain different materials depending upon whether the active device is responsive to electrical, light, mechanical, heat, or chemical energy. Single thread active devices include FETs, electro-optical devices, stress transducers, and the like. The active devices include a semiconductor body that for the single thread devices is a layer about the core of the thread. For the multiple thread devices, the semiconductor body is either a layer on one or more of the threads or an elongated body disposed between two of the threads. For example, a FET is formed of three threads, one of which carries a gate insulator layer and a semiconductor layer and the other two of which are electrically conductive and serve as the source and drain. The substrates or threads are preferably flexible and can be formed in a fabric.
    • 具有螺纹或带状几何形状的活动设备。 螺纹几何包括单线程有源器件和多线程器件。 单线设备具有中心芯,其可以包含不同的材料,这取决于有源器件是否响应于电,光,机械,热或化学能量。 单线有源器件包括FET,电光器件,应力传感器等。 有源器件包括用于单线器件是围绕线芯的层的半导体本体。 对于多线器件,半导体本体是一个或多个螺纹上的层或设置在两个螺纹之间的细长体。 例如,FET由三条线构成,其中一条带有栅极绝缘体层和半导体层,另外两条导电并用作源极和漏极。 基材或丝线优选是柔性的并且可以在织物中形成。